公开(公告)号：US07692433B2

公开(公告)日：2010-04-06

申请号：US11455110

申请日：2006-06-16

Applicant: Benjamin N. Eldridge ,  Roy J. Henson ,  Eric D. Hobbs ,  Peter B. Mathews ,  Makarand S. Shinde

Inventor： Benjamin N. Eldridge ,  Roy J. Henson ,  Eric D. Hobbs ,  Peter B. Mathews ,  Makarand S. Shinde

IPC: G01R31/26

CPC classification number: G01R1/07342

Abstract: A composite substrate for testing semiconductor devices is formed by selecting a plurality of substantially identical individual substrates, cutting a corner from at least some of the individual substrates in accordance with their position in a final array configuration, and then assembling the individual substrates into the final array configuration. The final array configuration of substrates with corners cut or sawed away conforms more closely to the surface area of a wafer being tested, and can easily fit within space limits of a test environment.

Abstract translation: 用于测试半导体器件的复合衬底通过选择多个基本上相同的单独衬底形成，根据它们在最终阵列构型中的位置从至少一些单个衬底切割拐角，然后将各个衬底组装成最终 阵列配置。 具有切割或锯切的角落的基底的最终阵列配置更接近于正被测试的晶片的表面积，并且可以容易地适应在测试环境的空间极限内。

公开(公告)号：US20090260960A1

公开(公告)日：2009-10-22

申请号：US12106364

申请日：2008-04-21

Applicant: John K. Gritters ,  Eric D. Hobbs ,  Sangtae Park ,  Jun Jason Yao

Inventor： John K. Gritters ,  Eric D. Hobbs ,  Sangtae Park ,  Jun Jason Yao

IPC: H01H59/00 ,  H02N1/00

CPC classification number: H01H1/60 ,  H01H1/0036 ,  H01H59/0009 ,  H01H2001/0047 ,  H01H2001/0052 ,  H01H2001/0078

Abstract: Embodiments of the present invention provide microelectromechanical systems (MEMS) switching methods and apparatus having improved performance and lifetime as compared to conventional MEMS switches. In some embodiments, a MEMS switch may include a resilient contact element comprising a beam and a tip configured to wipe a contact surface; and a MEMS actuator having an open position that maintains the tip and the contact surface in a spaced apart relation and a closed position that brings the tip into contact with the contact surface, wherein the resilient contact element and the MEMS actuator are disposed on a substrate and are movable in a plane substantially parallel to the substrate. In some embodiments, various contact elements are provided for the MEMS switch. In some embodiments, various actuators are provided for control of the operation of the MEMS switch.

Abstract translation: 与常规MEMS开关相比，本发明的实施例提供了具有改进的性能和寿命的微机电系统（MEMS）开关方法和装置。 在一些实施例中，MEMS开关可以包括弹性接触元件，其包括梁和构造成擦拭接触表面的尖端; 以及MEMS致动器，其具有将尖端和接触表面保持间隔的关系和使尖端与接触表面接触的闭合位置的打开位置，其中弹性接触元件和MEMS致动器设置在基板上 并且可以在基本上平行于基板的平面中移动。 在一些实施例中，为MEMS开关提供各种接触元件。 在一些实施例中，提供各种致动器用于控制MEMS开关的操作。

公开(公告)号：US20090206860A1

公开(公告)日：2009-08-20

申请号：US12165325

申请日：2008-06-30

Applicant: Andrew W. McFarland ,  Kevin Youl Yasumura ,  Eric D. Hobbs ,  Keith J. Breinlinger

Inventor： Andrew W. McFarland ,  Kevin Youl Yasumura ,  Eric D. Hobbs ,  Keith J. Breinlinger

IPC: G01R1/04

CPC classification number: G01R1/44 ,  G01R1/07307 ,  G01R31/2891

Abstract: A thermal adjustment apparatus for adjusting one or more thermally induced movements of an electro-mechanical assembly includes: a compensating element expanding at a first rate different from a second rate at which the electro-mechanical assembly expands for generating a counteracting force in response to changes in temperature; and a coupling mechanism coupling the compensating element to the electro-mechanical assembly, and being adjustable to control an amount of the counteracting force applied to the electro-mechanical assembly as temperature changes.

Abstract translation: 一种用于调节机电组件的一个或多个热诱导运动的热调节装置包括：补偿元件以不同于机电组件膨胀的第二速率的第一速率膨胀以产生响应于变化的反作用力 温度; 以及将补偿元件耦合到机电组件的耦合机构，并且可调节以在温度变化时控制施加到机电组件的抵抗力的量。

公开(公告)号：US20080157789A1

公开(公告)日：2008-07-03

申请号：US11617394

申请日：2006-12-28

Applicant: Eric D. Hobbs

Inventor： Eric D. Hobbs

IPC: G01R31/02 ,  H01L23/58 ,  H05K3/20

CPC classification number: G01R1/06716 ,  G01R1/06733 ,  Y10T29/49128

Abstract: Rotating contact elements and methods of fabrication are provided herein. In one embodiment, a rotating contact element includes a tip having a first side configured to contact a device to be tested and an opposing second side; and a plurality of deformed members extending from the second side of the tip and arranged about a central axis thereof, wherein the tip rotates substantially about the central axis upon compression of the plurality of deformed members.

Abstract translation: 本文提供旋转接触元件和制造方法。 在一个实施例中，旋转接触元件包括尖端，其具有被配置为接触待测试装置和相对的第二侧的第一侧; 以及多个变形构件，其从所述尖端的第二侧延伸并围绕其中心轴线布置，其中当所述多个变形构件压缩时，所述尖端基本上围绕所述中心轴线旋转。

公开(公告)号：US07368930B2

公开(公告)日：2008-05-06

申请号：US11464593

申请日：2006-08-15

Applicant: Eric D. Hobbs ,  Christopher D. McCoy ,  James M. Porter, Jr. ,  Alexander H. Slocum

Inventor： Eric D. Hobbs ,  Christopher D. McCoy ,  James M. Porter, Jr. ,  Alexander H. Slocum

IPC: G01R31/02

CPC classification number: G01R31/2891 ,  G01R31/31905

Abstract: A probe card assembly can comprise a support structure to which a plurality of probes can be directly or indirectly attached. The probes can be disposed to contact an electronic device to be tested. The probe card assembly can further comprise actuators, which can be configured to change selectively an attitude of the support structure with respect to a reference structure. The probe card assembly can also comprise a plurality of lockable compliant structures. While unlocked, the lockable compliant structures can allow the support structure to move with respect to the reference structure. While locked, however, the compliant structures can provide mechanical resistance to movement of the support structure with respect to the reference structure.

Abstract translation: 探针卡组件可以包括支撑结构，多个探针可以直接或间接附接到支撑结构。 可以将探针设置成接触要测试的电子设备。 探针卡组件还可以包括致动器，其可以被配置为相对于参考结构选择性地改变支撑结构的姿态。 探针卡组件还可以包括多个可锁定的柔顺结构。 当解锁时，可锁定的柔性结构可以允许支撑结构相对于参考结构移动。 然而，当锁定时，柔性结构可以提供对支撑结构相对于参考结构的移动的机械阻力。

公开(公告)号：US20080079449A1

公开(公告)日：2008-04-03

申请号：US11537164

申请日：2006-09-29

Applicant: Eric D. Hobbs

Inventor： Eric D. Hobbs

IPC: G01R31/02

CPC classification number: G01R1/07364

Abstract: Methods and apparatus for indirect planarization of a substrate are provided herein. In one embodiment, an apparatus for indirectly planarizing a probe card assembly includes an adjustment portion for controlling a force applied to a probe substrate of the probe card assembly; a force application portion configured to apply the force to the probe substrate at a location that is laterally offset from the adjustment portion; and a mechanism coupling the adjustment portion to the force application portion.

Abstract translation: 本文提供了用于衬底的间接平面化的方法和装置。 在一个实施例中，用于间接平面化探针卡组件的装置包括用于控制施加到探针卡组件的探针基板的力的调节部分; 力施加部，其构造成在从所述调节部侧向偏移的位置处向所述探针基板施加力; 以及将调节部联接到力施加部的机构。

公开(公告)号：US20180071730A1

公开(公告)日：2018-03-15

申请号：US15634097

申请日：2017-06-27

Applicant: Keith Joseph Breinlinger ,  Eric D. Hobbs ,  Dorian Liepmann ,  Joshua Tanner Nevill ,  Mark P. White ,  Maria Jimena Loureiro

Inventor： Keith Joseph Breinlinger ,  Eric D. Hobbs ,  Dorian Liepmann ,  Joshua Tanner Nevill ,  Mark P. White ,  Maria Jimena Loureiro

IPC: B01L3/00 ,  C12M3/06

CPC classification number: B01L3/5027 ,  B01L2200/0647 ,  B01L2200/0684 ,  B01L2300/0864 ,  B01L2300/0883 ,  B01L2400/086 ,  C12M23/16 ,  Y10T436/2575

Abstract: Some configurations of a microfluidic apparatus can comprise a fluidic circuit of interconnected fluidic structures into which a plurality of different media can be introduced or extracted. A variety of operations can be performed with the different media including isolating with a second medium one or more of the fluidic structures that is filled partially or fully with a first medium. Discrete volumes of a medium can be moved through the isolating second medium to deliver materials or micro-objects to or remove micro-objects or materials from a fluidic structure that is otherwise isolated by the second medium. Some configurations of a microfluidic apparatuses can isolate microfluidic structures in a microfluidic apparatus using flow rates or blocking structures, and some configurations can manage bubbles in fluidic structures.

公开(公告)号：US08120373B2

公开(公告)日：2012-02-21

申请号：US13022443

申请日：2011-02-07

Applicant: Eric D. Hobbs ,  Andrew W. McFarland

Inventor： Eric D. Hobbs ,  Andrew W. McFarland

IPC: G01R31/20 ,  G01R31/00

CPC classification number: G01R1/07378

Abstract: A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener assembly for use with testing devices can be part of a probe card assembly that can include a stiffener assembly comprising an upper stiffener coupled to a plurality of lower stiffeners; and a substrate constrained between the upper stiffener and the plurality of lower stiffeners, the stiffener assembly restricting non-planar flex of the substrate while facilitating radial movement of the substrate with respect to the stiffener assembly.

Abstract translation: 本文提供了一种与测试装置一起使用的加强装置。 在一些实施例中，用于与测试装置一起使用的加强件组件可以是探针卡组件的一部分，其可以包括加强件组件，该加强件组件包括联接到多个下加强件的上加强件; 以及限制在所述上加强件和所述多个下加强件之间的衬底，所述加强件组件限制所述衬底的非平面弯曲，同时促进所述衬底相对于所述加强件组件的径向移动。

公开(公告)号：US07999375B2

公开(公告)日：2011-08-16

申请号：US11548668

申请日：2006-10-11

Applicant: Eric D. Hobbs ,  Gaetan L. Mathieu

Inventor： Eric D. Hobbs ,  Gaetan L. Mathieu

IPC: H01L23/34

CPC classification number: H01L23/34 ,  B81B7/0006 ,  B81B7/0093 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/00

Abstract: An electronic device can comprise a semiconductor die on which can be formed a micromechanical system. The micromechanical system can comprise a plurality of electrically conductive elongate, contact structures, which can be disposed on input and/or output terminals of the semiconductor die. The micromechanical system can also comprise a cooling structure disposed on the semiconductor die.

Abstract translation: 电子设备可以包括其上可以形成微机械系统的半导体管芯。 微机械系统可以包括多个导电细长的接触结构，其可以设置在半导体管芯的输入和/或输出端子上。 微机械系统还可以包括设置在半导体管芯上的冷却结构。

公开(公告)号：US20100327891A1

公开(公告)日：2010-12-30

申请号：US12492177

申请日：2009-06-26

Applicant: Eric D. Hobbs

Inventor： Eric D. Hobbs

IPC: G01R31/02

CPC classification number: G01R31/2874

Abstract: Embodiments of probe cards and methods for fabricating and using same are provided herein. In some embodiments, an apparatus for testing a device (DUT) may include a probe card configured for testing a DUT; a thermal management apparatus disposed on the probe card to heat and/or cool the probe card; a sensor disposed on the probe card and coupled to the thermal management apparatus to provide data to the thermal management apparatus corresponding to a temperature of a location of the probe card; a first connector disposed on the probe card and coupled to the thermal management apparatus for connecting to a first power source internal to a tester; and a second connector, different than the first connector, disposed on the probe card and coupled to the thermal management apparatus for connecting to a second power source external to the tester.

Abstract translation: 本文提供了探针卡及其制造和使用方法的实施例。 在一些实施例中，用于测试设备（DUT）的设备可以包括配置用于测试DUT的探针卡; 设置在探针卡上以加热和/或冷却探针卡的热管理装置; 传感器，设置在所述探针卡上并耦合到所述热管理装置，以向与所述探针卡的位置的温度相对应的所述热管理装置提供数据; 第一连接器，其设置在所述探针卡上并且耦合到所述热管理装置，用于连接到测试仪内部的第一电源; 以及与第一连接器不同的第二连接器，其设置在探针卡上并且耦合到热管理装置，用于连接到测试仪外部的第二电源。