利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

29 条记录 (耗时 0.018 秒)

    Method and apparatus for using a pressure control system to monitor a plasma processing system
    21.
    发明申请
    Method and apparatus for using a pressure control system to monitor a plasma processing system 有权
    用于使用压力控制系统监测等离子体处理系统的方法和装置

    公开(公告)号：US20050283321A1

    公开(公告)日：2005-12-22

    申请号：US10868346

    申请日：2004-06-16

    申请人： Hongyu Yue ,  Hieu Lam

    发明人： Hongyu Yue ,  Hieu Lam

    IPC分类号： H01J37/32 ,  G01N31/00 ,  G06F19/00

    CPC分类号： H01J37/32623 ,  H01J37/32935

    摘要： A method and apparatus is presented for using a pressure control system to monitor a plasma processing system. By monitoring variations in the state of the pressure control system, a fault condition, an erroneous fault condition, or a service condition can be detected. For example, the service condition can include monitoring the accumulation of residue between successive preventative maintenance events.

    摘要翻译： 提出了一种使用压力控制系统监测等离子体处理系统的方法和装置。 通过监视压力控制系统的状态的变化，可以检测故障状况，错误故障状况或服务条件。 例如，服务条件可以包括在连续的预防性维护事件之间监视残留物的累积。

    Method of manufacturing a perpendicular magnetic write head with stepped trailing magnetic shield with electrical lapping guide control
    22.
    发明授权
    Method of manufacturing a perpendicular magnetic write head with stepped trailing magnetic shield with electrical lapping guide control 有权
    使用带电研磨导向器控制的具有阶梯式后跟磁屏蔽的垂直磁性写头的制造方法

    公开(公告)号：US07990651B2

    公开(公告)日：2011-08-02

    申请号：US11956292

    申请日：2007-12-13

    申请人： Wen-Chien David Hsiao ,  Hieu Lam ,  Vladimir Nikitin ,  Sue Siyang Zhang ,  Yi Zheng

    发明人： Wen-Chien David Hsiao ,  Hieu Lam ,  Vladimir Nikitin ,  Sue Siyang Zhang ,  Yi Zheng

    IPC分类号： G11B5/187

    CPC分类号： G11B5/1278 ,  G11B5/3116 ,  G11B5/3146 ,  G11B5/315 ,  G11B5/3166 ,  G11B5/3169

    摘要： A method for manufacturing a magnetic write head having a stepped trailing shield. The stepped trailing shield is formed by forming a non-magnetic bump over a write pole prior to electroplating a wrap-around magnetic shield. The method allows the location of the front edge of the bump relative to the back edge of the wrap-around shield to be monitored by measuring the electrical resistance of an electrical lapping guide formed concurrently with these features. This concurrent formation of a lapping guide can be used to define the relative location of other features as well, such as the location of a back edge of a wrap-around shield relative to a flare point of a write pole.

    摘要翻译： 一种用于制造具有阶梯式后挡板的磁写头的方法。 在电镀环绕磁屏蔽之前，通过在写入极上形成非磁性凸块来形成阶梯式后屏蔽。 该方法允许通过测量与这些特征同时形成的电研磨引导件的电阻来监测凸块的前边缘相对于环绕护罩的后边缘的位置。 研磨引导件的这种同时形成也可以用于限定其它特征的相对位置，例如环绕屏蔽件的后边缘相对于写入极点的扩张点的位置。

    Layered return poles for magnetic write heads
    23.
    发明授权
    Layered return poles for magnetic write heads 有权
    用于磁性写入头的分层返回极

    公开(公告)号：US07933096B2

    公开(公告)日：2011-04-26

    申请号：US12005558

    申请日：2007-12-26

    申请人： Donald G. Allen ,  Hieu Lam ,  Terence Tin-Lok Lam ,  Steve C. Puga

    发明人： Donald G. Allen ,  Hieu Lam ,  Terence Tin-Lok Lam ,  Steve C. Puga

    IPC分类号： G11B5/33

    CPC分类号： G11B5/3153 ,  G11B5/1278

    摘要： Methods and structures for the fabrication of both thin film longitudinal and perpendicular write heads are disclosed. A unique feature of these write heads is the inclusion of layered return poles, which comprise alternating layers of 22/78 and 80/20 NiFe alloys. The alternating layers also vary in thickness, the 22/78 NiFe layers having a nominal thickness of 1500 angstroms and the 80/20 NiFe layers having a nominal thickness of about 75 angstroms. Head efficiency and signal to noise ratios are significantly improved in heads having layered return pole construction.

    摘要翻译： 公开了用于制造薄膜纵向和垂直写入头的方法和结构。 这些写头的一个独特之处在于包含层叠的返回极，其包括22/78和80/20 NiFe合金的交替层。 交替层的厚度也变化，22/78 NiFe层的标称厚度为1500埃，而80/20 NiFe层的标称厚度为约75埃。 在具有分层回极结构的头部中，头部效率和信噪比显着提高。

    Methods of making magnetic write heads with use of a resist channel shrinking solution having corrosion inhibitors
    27.
    发明申请
    Methods of making magnetic write heads with use of a resist channel shrinking solution having corrosion inhibitors 审中-公开
    使用具有腐蚀抑制剂的抗蚀剂通道收缩溶液制造磁性写入头的方法

    公开(公告)号：US20060096081A1

    公开(公告)日：2006-05-11

    申请号：US11312064

    申请日：2005-12-19

    申请人： Christian Bonhote ,  Jila Tabib ,  Dennis McKean ,  Daniel Bedell ,  Jyh-Shuey Lo ,  Hieu Lam ,  Kim Lee

    发明人： Christian Bonhote ,  Jila Tabib ,  Dennis McKean ,  Daniel Bedell ,  Jyh-Shuey Lo ,  Hieu Lam ,  Kim Lee

    IPC分类号： G11B5/127 ,  H04R31/00

    CPC分类号： G11B5/3116 ,  G11B5/3163 ,  Y10T29/49032 ,  Y10T29/49039 ,  Y10T29/49043 ,  Y10T29/49044 ,  Y10T29/49048 ,  Y10T29/49052

    摘要： One preferred method for use in making a magnetic write head with use of the resist channel shrinking solution includes the steps of forming a first pole piece layer of a first pole piece; forming a gap layer over the first pole piece layer; forming a patterned resist over the first pole piece layer and the gap layer; electroplating a first pedestal portion of a second pole piece over the gap layer within a channel of the patterned resist; forming an oxide layer over the first pedestal portion; applying the resist channel shrinking solution comprising the resist channel shrinking film and the corrosion inhibitors over the patterned resist; baking the resist channel shrinking solution over the patterned resist to thereby reduce a width of the channel; removing the resist channel shrinking solution; electroplating a second pedestal portion of the second pole piece within the reduced-width channel of the patterned resist; removing the patterned resist; and milling the structure. Advantageously, the oxide layer and the corrosion inhibitors of the resist channel shrinking solution reduce corrosion in the pole piece during the act of baking the resist channel shrinking solution.

    摘要翻译： 使用抗蚀剂通道收缩溶液制造磁性写入头的一种优选方法包括以下步骤：形成第一极片的第一极片层; 在所述第一极片层上形成间隙层; 在所述第一极片层和所述间隙层上形成图案化的抗蚀剂; 在图案化的抗蚀剂的通道内的间隙层上电镀第二极片的第一基座部分; 在所述第一基座部分上形成氧化物层; 在图案化的抗蚀剂上施加包含抗蚀剂通道收缩膜和腐蚀抑制剂的抗蚀剂通道收缩溶液; 在图案化的抗蚀剂上烘烤抗蚀剂通道收缩溶液，从而减小通道的宽度; 去除抗蚀剂通道收缩溶液; 在所述图案化抗蚀剂的所述减小宽度的通道内电镀所述第二极靴的第二基座部分; 去除图案化的抗蚀剂; 并研磨结构。 有利地，抗蚀剂通道收缩溶液的氧化物层和腐蚀抑制剂在烘烤抗蚀剂通道收缩溶液的作用期间减少极片中的腐蚀。

    Methods for improving positioning performance of electron beam lithography on magnetic wafers
    28.
    发明申请
    Methods for improving positioning performance of electron beam lithography on magnetic wafers 失效
    改善电子束光刻在磁晶片上的定位性能的方法

    公开(公告)号：US20050252780A1

    公开(公告)日：2005-11-17

    申请号：US10845956

    申请日：2004-05-14

    申请人： Alexander Driskill-Smith ,  Hieu Lam ,  Kim Lee

    发明人： Alexander Driskill-Smith ,  Hieu Lam ,  Kim Lee

    IPC分类号： B05D5/12 ,  C25D3/56 ,  C25D5/02 ,  G11B5/855 ,  G11B5/858

    CPC分类号： G11B5/855 ,  C25D3/562 ,  C25D5/022 ,  G11B5/858

    摘要： The present invention discloses a method for the production of sub-micron structures on magnetic materials using electron beam lithography. A subtractive process is disclosed wherein a portion of a magnetic material layer is removed from the substrate using conventional lithography, and the remaining portion of the magnetic material layer is patterned by e-beam lithography. A additive process is also disclosed wherein a thin magnetic seed layer is deposited on the substrate, a portion of which is removed by conventional lithography and replaced with a non-magnetic conducting layer. The remaining portion of magnetic seed layer is patterned by e-beam lithography and the final magnetic structure produced by electroplating.

    摘要翻译： 本发明公开了一种使用电子束光刻在磁性材料上生产亚微米结构的方法。 公开了一种消减方法，其中使用常规光刻将磁性材料层的一部分从衬底上除去，并且通过电子束光刻将磁性材料层的剩余部分图案化。 还公开了一种添加方法，其中将薄的磁性种子​​层沉积在基底上，其一部分通过常规的光刻法被去除并被非磁性导电层代替。 通过电子束光刻和通过电镀产生的最终磁性结构对磁性种子层的剩余部分进行构图。

    Controlling a material processing tool and performance data
    29.
    发明申请
    Controlling a material processing tool and performance data 有权
    控制材料加工工具和性能数据

    公开(公告)号：US20050234574A1

    公开(公告)日：2005-10-20

    申请号：US10512863

    申请日：2003-06-27

    申请人： Hieu Lam ,  Hongyu Yue

    发明人： Hieu Lam ,  Hongyu Yue

    IPC分类号： H01L21/3065 ,  G05B19/418 ,  G06F19/00 ,  H01L21/205

    CPC分类号： G05B19/41865 ,  G05B2219/31443 ,  G05B2219/32366 ,  G05B2219/45031 ,  Y02P90/20 ,  Y02P90/26

    摘要： According to an embodiment of the present invention, a material processing systeme (1) including a process tool (10) and a process performance control system (100). The process performance control system (100) includes a process performance controller (55) coupled to the process tool (10), where the process performance controller (55) includes a process performance prediction model (110), a process recipe correction filter (120), a process controller (130), and process performance model correction algorithm (150). The process performance prediction model (110) is configured to receive tool data from a plurality of sensors coupled to process tool (10) and to predict process performance data. The process recipe correction filter (120) is coupled to the process performance prediction model (110) and configured to receive predicted process performance data and generate a process recipe correction for run-to-run process control. The process controller (130) is coupled to the process recipe correction filter (120) and is configured to update a process recipe according to the process recipe correction.

    摘要翻译： 根据本发明的实施例，一种包括处理工具（10）和过程执行控制系统（100）的材料处理系统（1）。 过程性能控制系统（100）包括耦合到处理工具（10）的过程性能控制器（55），其中过程性能控制器（55）包括过程性能预测模型（110），过程配方校正过滤器（120） ），过程控制器（130）和过程执行模型校正算法（150）。 过程性能预测模型（110）被配置为从耦合到过程工具（10）的多个传感器接收工具数据并预测过程性能数据。 过程配方校正滤波器（120）耦合到过程性能预测模型（110）并且被配置为接收预测的过程性能数据并且生成用于运行过程控制的过程配方校正。 过程控制器（130）耦合到过程配方校正过滤器（120），并被配置为根据处理配方校正更新过程配方。