公开(公告)号：US20120056330A1

公开(公告)日：2012-03-08

申请号：US13186049

申请日：2011-07-19

Applicant: Ho-Jin Lee ,  Sung-Dong Cho ,  Se-Young Jeong ,  Yeong-Lyeol Park ,  Sin-Woo Kang

Inventor： Ho-Jin Lee ,  Sung-Dong Cho ,  Se-Young Jeong ,  Yeong-Lyeol Park ,  Sin-Woo Kang

IPC: H01L23/48

CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2924/15311

Abstract: A semiconductor device may include a substrate and a through electrode. The substrate may have a first surface and a second surface opposite to the first surface, the substrate including circuit patterns formed on the first surface. The through electrode penetrates the substrate and may be electrically connected to the circuit pattern, the through electrode including a first plug that extends from the first surface in a thickness direction of the substrate and a second plug that extends from the second surface in the thickness direction of the substrate so as to be connected to the first plug.

Abstract translation: 半导体器件可以包括衬底和通孔。 衬底可以具有与第一表面相对的第一表面和第二表面，所述衬底包括形成在第一表面上的电路图案。 贯通电极穿透基板并且可以电连接到电路图案，所述通孔包括在基板的厚度方向上从第一表面延伸的第一插塞和在厚度方向上从第二表面延伸的第二插塞 以便连接到第一插头。

公开(公告)号：US08119448B2

公开(公告)日：2012-02-21

申请号：US12817304

申请日：2010-06-17

Applicant: Son-Kwan Hwang ,  In-Young Lee ,  Ho-Jin Lee ,  Dong-Hyeon Jang

Inventor： Son-Kwan Hwang ,  In-Young Lee ,  Ho-Jin Lee ,  Dong-Hyeon Jang

IPC: H01L21/00

CPC classification number: H01L24/11 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/11902 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/9201 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/10329 ,  H01L2224/05552

Abstract: A semiconductor chip comprises a substrate including a front surface and a rear surface, the substrate having a first via hole formed in the front surface and a second via hole formed in the rear surface, a first conductive plug formed on the substrate, the first conductive plug including a first portion formed in the first via hole and a second portion protruding from the front surface of the substrate, and a second conductive plug formed on the first conductive plug, the second conductive plug having a smaller cross-sectional area than the first conductive plug.

Abstract translation: 一种半导体芯片，包括：具有前表面和后表面的基板，所述基板具有形成在所述前表面上的第一通孔和形成在所述后表面中的第二通孔，形成在所述基板上的第一导电塞，所述第一导电 所述插头包括形成在所述第一通孔中的第一部分和从所述基板的前表面突出的第二部分，以及形成在所述第一导电插塞上的第二导电插塞，所述第二导电插塞具有比所述第一通孔更小的横截面积 导电插头

公开(公告)号：US20110154168A1

公开(公告)日：2011-06-23

申请号：US12971180

申请日：2010-12-17

Applicant: Yong Ho LEE ,  Dae lg CHANG ,  Ho Jin LEE

Inventor： Yong Ho LEE ,  Dae lg CHANG ,  Ho Jin LEE

IPC: G06F11/10

CPC classification number: H04L1/0057 ,  H03M13/116 ,  H03M13/1185 ,  H03M13/6527 ,  H03M13/6544 ,  H04L1/0041

Abstract: Disclosed is an effective high-speed encoding method using a parity-check matrix proposed in an IEEE 802.1x standard for high-speed low-density parity-check encoding. In the prior art, encoding was performed by blocking and dividing the parity-check matrix of the LDPC code and through relevant matrix equations, or encoding was performed by an encoding apparatus that divides a matrix multiplication operation of a generated matrix acquired by using an arbitrary parity-check matrix of a quasi-cyclic (QC) LDPC code and information vectors into two sequential steps and implements each step as a cyclic shift-register. Unlike the prior art, the present invention provides an effective high-speed encoding method having low additional complexity by using a quasi-cyclic characteristic of a parity-check matrix as well as an encoding method through generation of a temporary parity bit, generation of a correction bit, and correction of a parity bit by using the parity-check matrix having a dual-diagonal parity structure proposed in the standard.

Abstract translation: 公开了一种使用IEEE 802.1x标准中提出的用于高速低密度奇偶校验编码的奇偶校验矩阵的有效的高速编码方法。 在现有技术中，通过阻塞和划分LDPC码的奇偶校验矩阵并通过相关的矩阵方程来执行编码，或者由编码装置执行编码，该编码装置将通过使用任意的所获得的生成矩阵的矩阵乘法运算 准循环（QC）LDPC码的奇偶校验矩阵和信息向量分成两个连续步骤，并且实现每个步骤作为循环移位寄存器。 与现有技术不同，本发明通过使用奇偶校验矩阵的准循环特性以及通过生成临时奇偶校验位的编码方法来提供具有低附加复杂度的有效高速编码方法， 校正位，以及通过使用在标准中提出的具有双对角奇偶校验结构的奇偶校验矩阵来校正奇偶校验位。

公开(公告)号：US20110115340A1

公开(公告)日：2011-05-19

申请号：US12948211

申请日：2010-11-17

Applicant: Ho-Jin LEE

Inventor： Ho-Jin LEE

IPC: H01L41/053

CPC classification number: G06F3/041 ,  G06F3/016

Abstract: A touch panel device in which a support portion is provided to include an actuator for generating vibration giving an excellent sense of touch without the need for a separate mounting space. To this end, the touch panel device having a front cover portion, a touch sensor unit divided into an upper transparent electrode layer and a lower transparent electrode layer, and a substrate provided under the touch sensor portion includes an actuator for delivering vibration to the front cover portion, a reinforcing portion having the actuator attached thereto to attach the actuator to the touch sensor unit, and a support portion formed on the substrate to provide an opening in a first side thereof and a closed second side, such that the actuator is inserted into and coupled to the opening and the support portion supports the actuator to deliver the vibration of the actuator to the front cover portion.

Abstract translation: 一种触摸面板装置，其中提供支撑部分以包括用于产生振动的致动器，从而具有优异的触摸感，而不需要单独的安装空间。 为此，具有前盖部分，分为上透明电极层和下透明电极层的触摸传感器单元和设置在触摸传感器部分下方的基板的触摸面板装置包括用于将振动传递到前面的致动器 覆盖部分，具有附接到其上的致动器以将致动器附接到触摸传感器单元的加强部分，以及形成在基板上的支撑部分，以在其第一侧和闭合的第二侧提供开口，使得致动器被插入 并且支撑部分支撑致动器以将致动器的振动传递到前盖部分。

公开(公告)号：US20110050948A1

公开(公告)日：2011-03-03

申请号：US12858176

申请日：2010-08-17

Applicant: Young Sun JEON ,  Ho Jin Lee ,  Young Su Moon ,  Shi Hwa Lee

Inventor： Young Sun JEON ,  Ho Jin Lee ,  Young Su Moon ,  Shi Hwa Lee

IPC: H04N9/73 ,  G06T7/00

CPC classification number: H04N9/735 ,  G06T5/007 ,  G06T7/11 ,  G06T2207/10024

Abstract: An automatic white balance adjusting apparatus and method based on detection of an effective area. The automatic white balance adjusting apparatus may detect the effective area by using a color temperature, a luminance, and a correlation, and may adjust a white balance with respect to the detected effective area.

Abstract translation: 一种基于检测有效面积的自动白平衡调节装置和方法。 自动白平衡调节装置可以通过使用色温，亮度和相关性来检测有效面积，并且可以相对于检测到的有效面积调整白平衡。

公开(公告)号：US07830017B2

公开(公告)日：2010-11-09

申请号：US11950251

申请日：2007-12-04

Applicant: In-Young Lee ,  Dong-Ho Lee ,  Nam-Seog Kim ,  Hyun-Soo Chung ,  Ho-Jin Lee ,  Myeong-Soo Park

Inventor： In-Young Lee ,  Dong-Ho Lee ,  Nam-Seog Kim ,  Hyun-Soo Chung ,  Ho-Jin Lee ,  Myeong-Soo Park

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L23/525 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

Abstract: Provided are a wafer level chip scale package in which a redistribution process is applied at a wafer level, a manufacturing method thereof, and a semiconductor chip module including the wafer level chip scale package. The wafer level chip scale package includes a semiconductor chip having a bonding pad, a first insulating layer disposed on the semiconductor chip so as to expose the bonding pad, a redistribution line disposed on the exposed bonding pad and the first insulating layer, a sacrificial layer disposed below a redistribution pad of the redistribution line, a second insulating layer disposed on the redistribution line so as to expose the redistribution pad and including a crack inducement hole disposed beside the sacrificial layer, and an external connection terminal attached to the redistribution pad.

Abstract translation: 提供了其中在晶片级应用再分配处理的晶片级芯片级封装，其制造方法以及包括晶片级芯片级封装的半导体芯片模块。 晶片级芯片级封装包括具有接合焊盘的半导体芯片，设置在半导体芯片上以暴露焊盘的第一绝缘层，设置在暴露的焊盘和第一绝缘层上的再分配线，牺牲层 设置在所述再分配线的再分配衬垫的下方，设置在所述再分配线上的第二绝缘层，以暴露所述再分配衬垫并且包括设置在所述牺牲层旁边的裂纹诱导孔，以及附接到所述再分布衬垫的外部连接端子。

公开(公告)号：US20100271285A1

公开(公告)日：2010-10-28

申请号：US12747134

申请日：2008-07-18

Applicant: So-Hyeun Yun ,  In-Bok Yom ,  Ho-jin Lee ,  Ji-Whan Ko

Inventor： So-Hyeun Yun ,  In-Bok Yom ,  Ho-jin Lee ,  Ji-Whan Ko

IPC: H01Q15/14

CPC classification number: H01Q15/0013

Abstract: There is provided a frequency Selective Surface (FSS) structure for multi frequency bands configured with unit cells, each including a loop unit, arranged at regular intervals, wherein each unit cell includes: a dielectric layer; and the loop unit having a fixed width and formed on the dielectric layer, wherein the loop unit includes a first loop and a second loop formed inside the first loop with a predetermined space away from the first loop, each of the first loop and the second loop being formed sinuously in at least one portion.

Abstract translation: 提供了配置有单位单元的多频段的频率选择表面（FSS）结构，每个单元包括以规则间隔排列的循环单元，其中每个单位单元包括：介电层; 并且所述环形单元具有固定的宽度并且形成在所述介电层上，其中所述环形单元包括第一环和第二环，所述第一环和第二环形成在所述第一环内，具有远离所述第一环的预定空间，所述第一环和所述第二环中的每一个 在至少一个部分中正弦地形成环。

公开(公告)号：US07801101B2

公开(公告)日：2010-09-21

申请号：US10892679

申请日：2004-07-15

Applicant: Minsu Shin ,  Joon-Gyu Ryu ,  Hoon Jeong ,  Ho-Jin Lee

Inventor： Minsu Shin ,  Joon-Gyu Ryu ,  Hoon Jeong ,  Ho-Jin Lee

IPC: H04B7/216

CPC classification number: H04B7/18513 ,  H04L1/0003 ,  H04L1/0009 ,  H04W4/18 ,  H04W84/06

Abstract: Provided are a forward link rain attenuation compensating apparatus using an adaptive transmission scheme in an interactive satellite communication system and a method thereof. The apparatus separates the mobile stations into clear-sky mobile stations and mobile stations in the state of rain attenuation and makes the clear-sky mobile stations receive data having a high data transmission efficiency at a high-speed while making the rain attenuation mobile stations receive the data continuously although the data transmit rate is low by making each of the two kinds of mobile stations receive data frames of a different transmission method, and provides a method therefor. The apparatus includes: a resource manager, a transmitting data format converter, a forward modulator, a backward demodulator, a receiving data format converter.

Abstract translation: 提供一种在交互式卫星通信系统中使用自适应传输方案的前向链路雨衰补偿装置及其方法。 该装置将移动台分为处于雨衰状态的空中移动台和移动台，使得天空清空的移动台高速接收高数据传输效率的数据，同时使雨衰移移动站接收 通过使两种移动站中的每一个接收到不同的传输方式的数据帧，数据传输速率是低的，并且提供了一种方法。 该装置包括：资源管理器，发送数据格式转换器，前向调制器，反向解调器，接收数据格式转换器。

公开(公告)号：US07777345B2

公开(公告)日：2010-08-17

申请号：US12132925

申请日：2008-06-04

Applicant: Ho-Jin Lee ,  Nam-Seog Kim ,  Yong-Chai Kwon ,  Hyun-Soo Chung ,  In-Young Lee ,  Son-Kwan Hwang

Inventor： Ho-Jin Lee ,  Nam-Seog Kim ,  Yong-Chai Kwon ,  Hyun-Soo Chung ,  In-Young Lee ,  Son-Kwan Hwang

IPC: H01L23/48

CPC classification number: H01L24/05 ,  H01L23/481 ,  H01L24/03 ,  H01L24/06 ,  H01L24/13 ,  H01L24/32 ,  H01L25/0657 ,  H01L2224/02372 ,  H01L2224/034 ,  H01L2224/036 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05011 ,  H01L2224/05552 ,  H01L2224/05559 ,  H01L2224/05561 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06136 ,  H01L2224/06181 ,  H01L2224/08146 ,  H01L2224/32145 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/00014

Abstract: A semiconductor device having a through electrode and a method of fabricating the same are disclosed. In one embodiment, a semiconductor device includes a first insulating layer formed on a semiconductor substrate. A wiring layer having a first aperture to expose a portion of the first insulating layer is formed on the first insulating layer. A second insulating layer is formed on an upper portion of the wiring layer and in the first aperture. A conductive pad having a second aperture to expose a portion of the second insulating layer is formed on the second insulating layer. A through hole with a width narrower than widths of the first and second apertures is formed through the first and second insulating layers and an upper portion of the semiconductor substrate. A through electrode is formed in the through hole.

Abstract translation: 公开了一种具有通孔的半导体器件及其制造方法。 在一个实施例中，半导体器件包括形成在半导体衬底上的第一绝缘层。 具有用于露出第一绝缘层的一部分的第一孔的布线层形成在第一绝缘层上。 第二绝缘层形成在布线层的上部和第一孔中。 具有第二孔径以暴露第二绝缘层的一部分的导电焊盘形成在第二绝缘层上。 通过第一和第二绝缘层和半导体衬底的上部形成宽度比第一和第二孔的宽度窄的通孔。 在通孔中形成贯通电极。

公开(公告)号：US20100149373A1

公开(公告)日：2010-06-17

申请号：US12458603

申请日：2009-07-16

Applicant: Ho Jin Lee ,  Young Su Moon ,  Sang Jo Lee

Inventor： Ho Jin Lee ,  Young Su Moon ,  Sang Jo Lee

IPC: H04N9/73

CPC classification number: H04N9/73

Abstract: A color reproduction apparatus may include a white balance performing unit to perform white balance with respect to an image obtained from a sensor using a white balance gain, an image restoring unit to restore an RGB image from the white-balanced image by interpolating a color filter array image, a first color corrector to correct a color distortion caused by a light source by applying first correction data, and a second color corrector to correct a color distortion caused by a characteristic of a sensor by applying second correction data.

Abstract translation: 彩色再现装置可以包括白平衡执行单元，以相对于使用白平衡增益的传感器获得的图像执行白平衡，图像恢复单元通过内插滤色器来恢复来自白平衡图像的RGB图像 阵列图像，通过施加第一校正数据来校正由光源引起的颜色失真的第一颜色校正器，以及通过应用第二校正数据来校正由传感器的特性引起的颜色失真的第二颜色校正器。