公开(公告)号：US20100051703A1

公开(公告)日：2010-03-04

申请号：US12503112

申请日：2009-07-15

申请人： Kenji KOBAE

发明人： Kenji KOBAE

IPC分类号： G06K19/06 ,  H01Q17/00

CPC分类号： H01Q1/2225 ,  G06K19/07749 ,  G06K19/0775

摘要： A radio frequency identification tag includes a substrate, and an antenna pattern disposed on an outer peripheral side surface of the substrate. An electronic device is electrically connected to the antenna pattern, and is mounted on the outer peripheral side surface of the substrate.

摘要翻译： 射频识别标签包括衬底和布置在衬底的外周侧表面上的天线图案。 电子设备电连接到天线图案，并且安装在基板的外周侧表面上。

公开(公告)号：US20100001388A1

公开(公告)日：2010-01-07

申请号：US12559234

申请日：2009-09-14

申请人： Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

发明人： Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

IPC分类号： H01L23/02 ,  H01L21/50

CPC分类号： H01L23/24 ,  G06K19/07728 ,  H01L23/16 ,  H01L23/3135 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： An electronic device includes: a base; a conductor pattern formed on the base; a circuit chip electrically connected to the conductor pattern; and a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which includes concentric rings as an internal structure. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base.

摘要翻译： 电子设备包括：基座; 形成在基座上的导体图案; 电连接到所述导体图形的电路芯片; 以及加强构件，其设置在所述基座上以围绕所述电路芯片的外形为环状，并且包括作为内部结构的同心环。 电子装置还包括密封构件，其在覆盖电路芯片的顶部的同时填充加强构件的内部，从而将电路芯片密封在基座上。

公开(公告)号：US20100001081A1

公开(公告)日：2010-01-07

申请号：US12559202

申请日：2009-09-14

申请人： Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

发明人： Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

IPC分类号： G06K19/07 ,  H05K3/30

CPC分类号： G06K19/07749 ,  G06K19/027 ,  G06K19/07728 ,  H01L23/16 ,  H01L23/3121 ,  H01L23/3135 ,  H01L2224/16 ,  Y10T29/49146

摘要： An electronic device includes: a base; a conductor pattern formed on the base; a circuit chip electrically connected to the conductor pattern; and a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which has such an internal structure that a plurality of columns extending in the thickness direction of the base are dispersed in a predetermined substrate. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base.

摘要翻译： 电子设备包括：基座; 形成在基座上的导体图案; 电连接到所述导体图形的电路芯片; 以及加强构件，其设置在所述基座上以围绕所述电路芯片的外形为环状，并且具有这样的内部结构，使得沿所述基座的厚度方向延伸的多个列分散在预定基板中 。 电子装置还包括密封构件，其在覆盖电路芯片的顶部的同时填充加强构件的内部，从而将电路芯片密封在基座上。

公开(公告)号：US20090243006A1

公开(公告)日：2009-10-01

申请号：US12402881

申请日：2009-03-12

申请人： Tetsuya TAKAHASHI ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

发明人： Tetsuya TAKAHASHI ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

IPC分类号： H01L29/84 ,  H01L23/12 ,  H01L21/50

CPC分类号： B81B3/0078 ,  B81B2201/042 ,  B81B2203/0109 ,  B81B2203/0307 ,  B81C1/00126 ,  H01L24/14 ,  H01L2224/1134 ,  H01L2224/1403 ,  H01L2224/73204 ,  H01L2924/07811 ,  H01L2924/1461 ,  H01L2924/00

摘要： According to an aspect of the invention, an electronic part includes a substrate having a first planar surface, a first bump affixed to the first planar surface of the substrate, a second bump affixed to the first planar surface of the substrate a predetermined distance from the first bump, a MEMS chip including a element, the MEMS chip coupled to the first bump and the second bump, the MEMS chip distanced from the first planar surface, an adhesive region bonding with the first bump, the substrate and the MEMS chip.

摘要翻译： 根据本发明的一个方面，电子部件包括具有第一平坦表面的基板，固定到基板的第一平面表面的第一凸起，固定到基板的第一平面表面的第二凸起，距离基板的预定距离 第一凸块，包括元件的MEMS芯片，耦合到第一凸块和第二凸块的MEMS芯片，与第一平坦表面分开的MEMS芯片，与第一凸块，基板和MEMS芯片结合的粘合区域。

公开(公告)号：US20090130393A1

公开(公告)日：2009-05-21

申请号：US12191539

申请日：2008-08-14

申请人： Hiroshi KOBAYASHI ,  Kenji KOBAE ,  Takashi KUBOTA

发明人： Hiroshi KOBAYASHI ,  Kenji KOBAE ,  Takashi KUBOTA

IPC分类号： B32B3/30

CPC分类号： G06K19/07749 ,  G06K19/02 ,  G06K19/027 ,  G06K19/07728 ,  G06K19/07758 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1815 ,  Y10T428/2462 ,  H01L2924/00

摘要： The electronic apparatus includes a base sheet; a conductive pattern formed on the base sheet; a circuit chip mounted on the base sheet and connected to the conductive pattern; and plural protrusions arranged on at least one of a frontside and a backside of the base sheet to overlap at least a portion of the conductive pattern. The plural protrusions protrude in a direction away from the base sheet.

摘要翻译： 电子设备包括基片; 形成在基片上的导电图案; 电路芯片，安装在基片上并连接到导电图案; 以及布置在所述基片的前侧和后侧中的至少一个上的多个突起，以与所述导电图案的至少一部分重叠。 多个突起在远离基片的方向上突出。

公开(公告)号：US20090115611A1

公开(公告)日：2009-05-07

申请号：US12265209

申请日：2008-11-05

申请人： Hiroshi KOBAYASHI ,  Kenji KOBAE

发明人： Hiroshi KOBAYASHI ,  Kenji KOBAE

IPC分类号： G08B13/14

CPC分类号： G06K19/07749 ,  G06K19/07728 ,  G06K19/0775 ,  H01L21/56 ,  H01L21/568 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27013 ,  H01L2224/29012 ,  H01L2224/29034 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  Y10T29/49149 ,  H01L2924/00012 ,  H01L2924/00

摘要： An RFID tag manufacturing method is including application process in which a heat-curable adhesive is applied to an area where a circuit chip is placed on a base to which antennae are wired so as to be connected with the circuit chip, placement process in which the circuit chip is placed where the adhesive is applied, and thereby the circuit chip is connected with the antennae, covering process in which the circuit chip placed on the base is covered with a sheet member having an adhesive layer on its surface, such that the adhesive layer faces the base, and heat and pressure applying process in which pressure is applied to the sheet member toward the base, and heat and pressure are applied to the circuit chip from above the sheet member, thereby curing the adhesive and fixing the circuit chip and the sheet member on the base.

摘要翻译： RFID标签制造方法包括以下步骤：将可热固化粘合剂施加到电路芯片放置在与天线连接的基底上的区域以便与电路芯片连接的应用过程，其中， 将电路芯片放置在施加粘合剂的位置，由此电路芯片与天线连接，其中放置在基座上的电路芯片被其表面上具有粘合剂层的片状部件覆盖的覆盖过程，使得粘合剂 层向基部施加压力施加过程，其中压力施加到片状部件朝向基部，并且热和压力从片状部件的上方施加到电路芯片，从而固化粘合剂并固定电路芯片，并且 基座上的片材。

公开(公告)号：US20090115577A1

公开(公告)日：2009-05-07

申请号：US12193364

申请日：2008-08-18

申请人： Hiroshi Kobayashi ,  Kenji Kobae ,  Takashi Kubota ,  Hidehiko Kira

发明人： Hiroshi Kobayashi ,  Kenji Kobae ,  Takashi Kubota ,  Hidehiko Kira

IPC分类号： H04Q5/22

CPC分类号： G06K19/07749 ,  G06K19/07728 ,  G06K19/0775 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191

摘要： An RFID tag includes: a sheet-like base; an antenna provided on the base and extending along the base; a circuit chip mounted on the base and connected to the antenna for performing radio communication through the antenna; a protection body wider than the circuit chip and narrower than the antenna, which is located at least either above the circuit chip or on a backside of the circuit chip with the base interposed therebetween for protecting the circuit chip; and a connection section provided as a portion of the antenna at a location where an edge of the protection body and the antenna intersect with each other as viewed from a direction intersecting with a surface of the base, which includes one or more conductor patterns narrower than other portion of the antenna, and which connects inner and outer antenna portions of the edge with each other.

摘要翻译： RFID标签包括：片状基底; 设置在基座上并沿基座延伸的天线; 安装在基座上并连接到天线的电路芯片，用于通过天线进行无线电通信; 比电路芯片更宽的保护体，并且比天线窄，其位于电路芯片的上方或电路芯片的背面，其中插入基板，用于保护电路芯片; 以及连接部，其在从与所述基部的表面相交的方向观察时，在所述保护体和所述天线的边缘彼此相交的位置处设置为所述天线的一部分，所述方向包括一个或多个导体图案，所述导体图案比 天线的其他部分，并且将边缘的内天线部分和外天线部分彼此连接。

公开(公告)号：US07514788B2

公开(公告)日：2009-04-07

申请号：US11979165

申请日：2007-10-31

申请人： Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Takayoshi Matsumura

发明人： Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Takayoshi Matsumura

IPC分类号： H01L21/302

CPC分类号： H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L24/75 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/759 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00015 ,  H01L2224/13099 ,  H01L2924/00

摘要： The structure of mounting an electronic component on a circuit board is capable of securely flip-chip-bonding the electronic component having bumps, whose separations are very short, to the circuit board without displacement. The structure of mounting an electronic component on a circuit board is characterized in that bumps of the electronic component are respectively flip-chip-bonded to electrodes of the circuit board by applying ultrasonic vibrations to the electronic component, and that a center of each of the bumps is previously relatively displaced, with respect to a center of each of the electrodes in a width direction, in a direction parallel to a direction of the ultrasonic vibrations.

摘要翻译： 将电子部件安装在电路板上的结构能够将具有非常短的分离的凸块的电子部件可靠地倒置接合到电路板而没有位移。 将电子部件安装在电路板上的结构的特征在于，通过对电子部件施加超声波振动，电子部件的凸起分别与电路基板的电极倒装接合， 先前相对于每个电极的宽度方向上的中心在与超声波振动的方向平行的方向上相对移位。

公开(公告)号：US07471081B2

公开(公告)日：2008-12-30

申请号：US11326598

申请日：2006-01-06

申请人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

发明人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

IPC分类号： G01R33/12

CPC分类号： G11B5/455 ,  G11B5/4555 ,  G11B5/6005 ,  H01R13/2421 ,  H01R2201/20

摘要： A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.

摘要翻译： 滑块测试器包括使测试介质旋转的驱动单元，可拆卸地支撑滑块作为单个主体的固定板，以及与由固定板支撑的滑块电连接的调查装置，并且调查滑块的特性。 在该固定板上设置有可滑动地支承滑块的可动支承部30。 还提供了一种按压机构，其通过可移动支撑部件朝向介质的表面弹性地按压滑块以将滑块设置在介质表面上。 按压机构包括弹性体56，其由与所述可动支撑部接触并弹性地按压所述可动支撑部的板簧构成。

公开(公告)号：US20070184582A1

公开(公告)日：2007-08-09

申请号：US11435851

申请日：2006-05-18

申请人： Kimio Nakamura ,  Kenji Kobae ,  Takashi Kubota

发明人： Kimio Nakamura ,  Kenji Kobae ,  Takashi Kubota

IPC分类号： H01L21/00

CPC分类号： H01L24/75 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75304 ,  H01L2224/75744 ,  H01L2224/83139 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/3511 ,  H01L2924/00

摘要： A method of flip-chip mounting can reliably and stably mount a semiconductor chip to a mounting substrate while avoiding problems such as damage to the semiconductor chip due to a difference in thermal expansion coefficients between the semiconductor chip and the mounting substrate. The method of flip-chip mounting a semiconductor chip supports a mounting substrate on a stage in a state where a resin material has been supplied onto a chip mounting surface of the mounting substrate and presses the semiconductor chip toward the mounting substrate using a pressure/heat applying head to bond the semiconductor chip to the mounting substrate and thermally harden the resin material. A concave part is provided in a support surface of the stage that supports the semiconductor chip, and the semiconductor chip is bonded to the mounting substrate by pressing the semiconductor chip toward the mounting substrate using the pressure/heat applying head in a state where the mounting substrate is bent toward the concave part.

摘要翻译： 一种倒装芯片安装方法可以可靠且稳定地将半导体芯片安装到安装基板，同时避免由于半导体芯片和安装基板之间的热膨胀系数的差异而导致对半导体芯片的损坏等问题。 半导体芯片的倒装芯片的安装方法在将树脂材料供给到安装基板的芯片安装面上的状态下，将载置基板支撑在载台上，并使用压力/热量将半导体芯片朝向安装基板 施加头部以将半导体芯片粘合到安装基板上并使树脂材料热硬化。 在支撑半导体芯片的载物台的支撑面上设置有凹部，半导体芯片通过使用压力/加热头将半导体芯片压向安装基板而与安装基板接合， 基板向凹部弯曲。