公开(公告)号：US09064693B2

公开(公告)日：2015-06-23

申请号：US13581281

申请日：2010-03-01

Applicant: Jean-Paul Noel ,  Ming Li

Inventor： Jean-Paul Noel ,  Ming Li

IPC: H01L21/311 ,  H01L21/31 ,  H01L21/02 ,  C23C16/02 ,  C23C16/34 ,  C23C16/40 ,  C23C16/56 ,  H05B33/10

CPC classification number: H01L21/02164 ,  C23C16/0218 ,  C23C16/345 ,  C23C16/401 ,  C23C16/56 ,  H01L21/0217 ,  H01L21/022 ,  H01L21/02312 ,  H01L21/02337 ,  H05B33/10

Abstract: Deposition of thin film dielectrics, and in particular for chemical vapor deposition of nano-layer structures comprising multiple layers of dielectrics, such as, silicon dioxide, silicon nitride, silicon oxynitride, and/or other silicon compatible dielectrics includes post-deposition surface treatment of deposited layers with a metal or semiconductor source gas, e.g., a silicon source gas. Deposition of silicon containing dielectrics comprises silane-based chemistry for deposition of doped or undoped dielectric layers, and surface treatment of deposited dielectric layers with silane. Surface treatment provides dielectric layers with improved layer-to-layer uniformity and lateral continuity, and substantially atomically flat dielectric layers suitable for multilayer structures for electroluminescent light emitting structures, e.g., active layers containing rare earth containing luminescent centers. Doped or undoped dielectric thin films or nano-layer dielectric structures may also be provided for other semiconductor devices.

Abstract translation: 薄膜电介质的沉积，特别是用于化学气相沉积的包括多层电介质的纳米层结构，例如二氧化硅，氮化硅，氮氧化硅和/或其它与硅相容的电介质包括后沉积表面处理 具有金属或半导体源气体的沉积层，例如硅源气体。 含硅电介质的沉积包括用于沉积掺杂或未掺杂电介质层的硅烷基化学，以及用硅烷表面处理沉积的介电层。 表面处理提供具有改进的层间均匀性和横向连续性的电介质层，以及适用于电致发光发光结构的多层结构的基本上原子平坦的介电层，例如含有含稀土含有发光中心的活性层。 也可以为其它半导体器件提供掺杂或未掺杂的电介质薄膜或纳米层介电结构。

公开(公告)号：US09060927B2

公开(公告)日：2015-06-23

申请号：US12397219

申请日：2009-03-03

Applicant: Solomon S. Steiner ,  Roderike Pohl ,  Ming Li ,  Robert Hauser

Inventor： Solomon S. Steiner ,  Roderike Pohl ,  Ming Li ,  Robert Hauser

IPC: A61K38/28 ,  C07K14/62 ,  A61K9/00 ,  A61K38/00

CPC classification number: A61K9/0019 ,  A61K38/00 ,  A61K38/28 ,  A61K47/12 ,  A61K47/183 ,  C07K14/62

Abstract: Injectable insulin formulations with improved stability and rapid onset of action are described herein. The formulations may be for subcutaneous, intradermal or intramuscular administration. In the preferred embodiment, the formulations are administered via subcutaneous injection. The formulations contain insulin in combination with a chelator and dissolution agent, and optionally additional excipients. In the preferred embodiment, the formulation contains human insulin, a zinc chelator such as EDTA and a dissolution agent such as citric acid or sodium citrate. These formulations are rapidly absorbed into the blood stream when administered by subcutaneous injection. In the preferred embodiment, the insulin is provided as a clear liquid, neutral pH, in a multi-use sterile vial. In an alternative embodiment, the insulin is provided as a powder in a sterile vial. This is mixed with a diluent containing a pharmaceutically acceptable carrier, such as water, a zinc chelator such as EDTA and a dissolution agent such as citric acid shortly before or at the time of administration. In another embodiment, the insulin is stored as a frozen mixture, ready for use upon thawing.

Abstract translation: 本文描述了具有改善的稳定性和快速起效的可注射的胰岛素制剂。 制剂可用于皮下，皮内或肌内给药。 在优选的实施方案中，通过皮下注射施用制剂。 制剂含有与螯合剂和溶解剂以及任选的其它赋形剂组合的胰岛素。 在优选的实施方案中，制剂含有人胰岛素，锌螯合剂如EDTA和溶解剂如柠檬酸或柠檬酸钠。 当通过皮下注射给药时，这些制剂被快速地吸收到血流中。 在优选的实施方案中，胰岛素以多用途无菌小瓶中的透明液体中性pH提供。 在替代实施方案中，胰岛素以无菌小瓶中的粉末形式提供。 将其与包含药学上可接受的载体如水，锌螯合剂如EDTA的稀释剂和不久之前或给药时的溶解剂如柠檬酸混合。 在另一个实施方案中，将胰岛素作为冷冻混合物储存，准备在解冻时使用。

公开(公告)号：US09034142B2

公开(公告)日：2015-05-19

申请号：US12642497

申请日：2009-12-18

Applicant: Christopher M. Bartlett ,  Ming Li ,  Jon Henri ,  Marshall R. Stowell ,  Mohammed Sabri

Inventor： Christopher M. Bartlett ,  Ming Li ,  Jon Henri ,  Marshall R. Stowell ,  Mohammed Sabri

IPC: C23C16/52 ,  H01L21/306 ,  C23C16/455 ,  C23C16/44

CPC classification number: C23C16/52 ,  C23C16/4401 ,  C23C16/45565 ,  C23C16/4557 ,  C23C16/45572 ,  C23C16/458 ,  C23C16/46

Abstract: A temperature controlled showerhead assembly for chemical vapor deposition (CVD) chambers enhances heat dissipation to provide accurate temperature control of the showerhead face plate and maintain temperatures substantially lower than surrounding components. Heat dissipates by conduction through a showerhead stem and removed by the heat exchanger mounted outside of the vacuum environment. Heat is supplied by a heating element inserted into the steam of the showerhead. Temperature is controlled using feedback supplied by a temperature sensor installed in the stem and in thermal contact with the face plate.

Abstract translation: 用于化学气相沉积（CVD）室的温度控制喷淋头组件增强散热以提供喷头面板的精确的温度控制并保持温度显着低于周围部件。 热量通过喷淋头传导并通过安装在真空环境外的热交换器除去。 热量由插入淋浴头蒸汽的加热元件提供。 使用由安装在杆上的温度传感器提供的反馈并与面板进行热接触来控制温度。

公开(公告)号：US08989116B2

公开(公告)日：2015-03-24

申请号：US13558691

申请日：2012-07-26

Applicant: Jinyi Zhou ,  Lan Liu ,  Xiaolong Guo ,  Ming Li ,  Zhe Chen ,  Qi Yu

Inventor： Jinyi Zhou ,  Lan Liu ,  Xiaolong Guo ,  Ming Li ,  Zhe Chen ,  Qi Yu

IPC: H04W4/00 ,  H04W76/02 ,  H04L12/66

CPC classification number: H04L12/66 ,  H04W28/0268 ,  H04W72/087 ,  H04W76/10 ,  H04W76/11 ,  H04W76/12

Abstract: Method and system for setting up a bearer are disclosed. The bearer setup method includes these steps: a packet data network gateway (PGW) obtains first quality of service (QoS) information and a first bearer identifier (ID), and sets up a bearer between the PGW and a radio access network (RAN) according to the first QoS information, where the bearer is associated with the first bearer ID; the RAN sets up a radio bearer (RB) with a user equipment (UE) according to second QoS information associated with the first QoS information, where the RB is associated with a second bearer ID associated with the first bearer ID.

Abstract translation: 公开了建立承载的方法和系统。 承载建立方法包括以下步骤：分组数据网络网关（PGW）获得第一服务质量（QoS）信息和第一承载标识符（ID），并且在PGW和无线接入网络（RAN）之间建立承载， 根据第一QoS信息，其中承载与第一承载ID相关联; RAN根据与第一QoS信息相关联的第二QoS信息与用户设备（UE）建立无线承载（RB），其中RB与与第一承载ID相关联的第二承载ID相关联。

公开(公告)号：US08969513B2

公开(公告)日：2015-03-03

申请号：US13884750

申请日：2011-11-10

Applicant: Bingming He ,  Ming Li ,  Zhijun Tang ,  Xiaoming Ji

Inventor： Bingming He ,  Ming Li ,  Zhijun Tang ,  Xiaoming Ji

IPC: C07K7/56 ,  A61K38/12 ,  A61K38/00

CPC classification number: C07K7/56 ,  A61K38/00 ,  A61K38/12

Abstract: Disclosed are a caspofungin analog and applications thereof. The caspofungin analog is a compound having a structure as indicated in Formula (4), or pharmaceutically acceptable salts thereof. R1 can be chosen from hydroxyl, benzyloxy, phenoxy, substituted phenoxy, or substituted benzyloxy. R2, R3, R4, R5 can be chosen from hydrogen, C1-C6 alkyl, C1-C6 alkoxy, hydroxyl, benzyloxyphenyl, substituted benzyloxyphenyl, nitro, fluorine, chlorine, bromine, or iodine. Also disclosed are a preparation method for and applications of the compound.

Abstract translation: 公开了卡泊芬净类似物及其应用。 卡泊芬净类似物是具有式（4）所示结构的化合物或其药学上可接受的盐。 R 1可以选自羟基，苄氧基，苯氧基，取代的苯氧基或取代的苄氧基。 R2，R3，R4，R5可以选自氢，C1-C6烷基，C1-C6烷氧基，羟基，苄氧基苯基，取代的苄氧基苯基，硝基，氟，氯，溴或碘。 还公开了该化合物的制备方法和应用。

公开(公告)号：US08967452B2

公开(公告)日：2015-03-03

申请号：US13448866

申请日：2012-04-17

Applicant: Yiu Ming Cheung ,  Tsan Yin Peter Lo ,  Ming Li ,  Yick Hong Mak ,  Ka San Lam

Inventor： Yiu Ming Cheung ,  Tsan Yin Peter Lo ,  Ming Li ,  Yick Hong Mak ,  Ka San Lam

IPC: B23K31/02 ,  B23K26/20

CPC classification number: H01L24/81 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16238 ,  H01L2224/75251 ,  H01L2224/75263 ,  H01L2224/75744 ,  H01L2224/75753 ,  H01L2224/78252 ,  H01L2224/78253 ,  H01L2224/81048 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81224 ,  H01L2224/81907 ,  H01L2224/81986 ,  H01L2224/9205 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00

Abstract: A die is prepared for thermal compression bonding by first aligning electrical contacts on the die to bond pads on a substrate onto which the die is to be mounted. Those electrical contacts are held against the bond pads on the substrate with a bonding tool. Partially bonding the die onto the substrate by providing heat to a portion of the die to elevate a temperature there to above a melting point of solder in the electrical contacts so as to melt at least some of the solder. Then thermally compress the whole die and heat it to above the melting point of the solder of the electrical contacts so that the solder of the electrical contacts outside the portion of the die are also melted to bond the die to the substrate.

Abstract translation: 通过首先将芯片上的电触点对准到将要安装裸片的基板上的接合焊盘，准备用于热压接的裸片。 这些电触头用接合工具保持在基板上的接合焊盘上。 通过向模具的一部分提供热量将模具部分地粘合到基板上，以将其温度升高到电触点中焊料的熔点以使熔化至少一些焊料。 然后热压整个模头并将其加热到电触头的焊料的熔点以上，使得电接触部分外部的电触点的焊料也被熔化，以将模具结合到衬底。

公开(公告)号：US20150058874A1

公开(公告)日：2015-02-26

申请号：US14389472

申请日：2012-05-31

Applicant: Renfeng Sun ,  Ming Li ,  Lin Xu ,  Dechun Kong ,  Qi Wu

Inventor： Renfeng Sun ,  Ming Li ,  Lin Xu ,  Dechun Kong ,  Qi Wu

IPC: G06Q30/06 ,  H04N21/478 ,  H04N21/442 ,  H04N21/643

CPC classification number: G06Q30/0643 ,  G06Q30/0625 ,  H04N21/254 ,  H04N21/25891 ,  H04N21/2668 ,  H04N21/4316 ,  H04N21/44222 ,  H04N21/47815 ,  H04N21/64322 ,  H04N21/812 ,  H04N21/8405

Abstract: The disclosure provides a method and a device for setting properties. The method comprises: analyzing and counting one or more program sources selected by a user through an Internet Protocol Television (IPTV) program system; determining program IDs corresponding to the program sources selected by the user according to a analysis and statistics result to acquire the merchandise corresponding to the program IDs in the IPTV merchandise system; and setting the properties of the merchandise, wherein the merchandise properties set are used for indicating how to display the merchandise in the IPTV merchandise system. The problem caused by the identical merchandise recommended to all the users in the IPTV online shopping system in the related art is solved, consequently, personalized services are implemented for different users and the user experience is improved.

Abstract translation: 本公开提供了一种用于设置属性的方法和装置。 该方法包括：通过互联网协议电视（IPTV）程序系统分析和计数由用户选择的一个或多个节目源; 根据分析统计结果确定与用户选择的节目源相对应的节目ID，以获取与IPTV商品系统中的节目ID相对应的商品; 以及设置商品的属性，其中所述商品属性集用于指示如何在IPTV商品系统中显示商品。 解决了相关技术中IPTV网络购物系统中推荐给所有用户的相同商品造成的问题，为不同用户实现个性化服务，提高用户体验。

公开(公告)号：US08956892B2

公开(公告)日：2015-02-17

申请号：US13347388

申请日：2012-01-10

Applicant: Kui Kam Lam ,  Ka Yee Mak ,  Yiu Yan Wong ,  Ming Li

Inventor： Kui Kam Lam ,  Ka Yee Mak ,  Yiu Yan Wong ,  Ming Li

IPC: H01L33/50

CPC classification number: H01L33/50 ,  H01L2224/48091 ,  H01L2924/15311 ,  H01L2933/0041 ,  H01L2924/00014

Abstract: Disclosed is a method of fabricating a light-emitting diode package, which comprises a light-emitting chip operative to emit light of a first wavelength range. The method comprises the steps of: dispensing a photoluminescent mixture on the light-emitting chip, the photoluminescent mixture being capable of absorbing a portion of light of the first wavelength range emitted from the light-emitting chip to re-emit light of a second wavelength range; partially curing the photoluminescent mixture by heating the photoluminescent mixture to a pre-curing temperature and then cooling the photoluminescent mixture to below the pre-curing temperature; and fully curing the photoluminescent mixture to harden the photoluminescent mixture. An apparatus for fabricating a light-emitting diode package is also disclosed.

Abstract translation: 公开了一种制造发光二极管封装的方法，其包括可发射第一波长范围的光的发光芯片。 该方法包括以下步骤：在发光芯片上分配光致发光混合物，所述光致发光混合物能够吸收从发光芯片发射的第一波长范围的一部分光，以重新发射第二波长的光 范围; 通过将光致发光混合物加热至预固化温度，然后将光致发光混合物冷却至预固化温度以下来部分固化光致发光混合物; 并充分固化光致发光混合物以硬化光致发光混合物。 还公开了一种用于制造发光二极管封装的装置。

公开(公告)号：US20150024561A1

公开(公告)日：2015-01-22

申请号：US13877763

申请日：2012-05-02

Applicant: Ming Li ,  Ru Huang

Inventor： Ming Li ,  Ru Huang

IPC: H01L21/8234 ,  H01L29/66

CPC classification number: H01L21/823456 ,  H01L21/26506 ,  H01L21/2652 ,  H01L21/26586 ,  H01L21/28123 ,  H01L21/823431 ,  H01L21/823481 ,  H01L29/165 ,  H01L29/41783 ,  H01L29/66545 ,  H01L29/66628 ,  H01L29/66795 ,  H01L29/6681 ,  H01L29/66818 ,  H01L29/785

Abstract: Systems and methods of fabricating a FinFET in large scale integrated circuit are disclosed. One illustrative method relates to a dummy gate process, wherein the fin structure is only formed in the gate electrode region by performing a photolithography process and an etching of a first dummy gate on a flat STI surface using chemical mechanical polishing, forming drain and source regions, depositing a medium dielectric layer, polishing the medium dielectric layer till the top of the first dummy gate is exposed through the chemical mechanical polishing process again, removing the dummy gate material via a dry etching and a wet etching, and continuously etching the STI dielectric layer with the hard mask formed by the medium dielectric layer, thereafter performing the deposition of real gate dielectric and gate electrode material to complete the device structure.

Abstract translation: 公开了在大规模集成电路中制造FinFET的系统和方法。 一种说明性的方法涉及虚拟栅极工艺，其中仅通过使用化学机械抛光在平坦STI表面上执行光刻工艺和蚀刻第一伪栅极而在栅电极区域中形成鳍结构，形成漏极和源极区 ，沉积介质介质层，再次通过化学机械抛光工艺对介质介质层进行抛光，直到第一虚拟栅极的顶部暴露出来，通过干蚀刻和湿蚀刻去除虚拟栅极材料，并连续蚀刻STI电介质 层，其中由介质介质层形成的硬掩模，然后执行真栅极电介质和栅电极材料的沉积以完成器件结构。

公开(公告)号：US20150021155A1

公开(公告)日：2015-01-22

申请号：US14361652

申请日：2011-11-29

Applicant: Ming Li ,  Kok Kiong Low

Inventor： Ming Li ,  Kok Kiong Low

IPC: H01H13/10 ,  H01H5/02 ,  H01H13/04 ,  H01H13/14 ,  H01H3/12

CPC classification number: H01H13/10 ,  H01H3/122 ,  H01H5/02 ,  H01H13/023 ,  H01H13/04 ,  H01H13/14 ,  H01H13/70 ,  H01H13/83 ,  H01H2215/042 ,  H01H2219/044 ,  H01H2219/05 ,  H01H2219/054 ,  H01H2221/026 ,  H01H2221/04 ,  H01H2221/058 ,  H01H2223/038

Abstract: Key switch mechanisms are typically used for mediating user input to computing devices. A key switch mechanism provides immediate tactile feedback to a user upon user-actuation thereof. Unlike touchscreen interfaces, existing key switch mechanisms of conventional keyboards do not provide a user with a dynamically changeable interface. Described is a key switch mechanism that comprises a circuit module, a key cap and a linkage mechanism for guiding travel of the key cap substantially along a travel axis. The linkage mechanism comprises a positioning board and a main link pivotably inter-coupling the positioning board and the key cap. The main link substantially impedes tilt of the key cap away from the travel axis during travel of the key cap therealong from a released position, whereat the key cap is biased, to a depressed position whereat a control signal is generated.