公开(公告)号：US11500442B2

公开(公告)日：2022-11-15

申请号：US16353830

申请日：2019-03-14

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Vipin Tiwari ,  Mark Reiten ,  Nhan Do

IPC: G06F1/3234 ,  G11C16/04 ,  G06N3/08 ,  G06F17/16 ,  G11C11/54 ,  G06N3/04

Abstract: Numerous embodiments are disclosed for converting neuron current output by a vector-by-matrix multiplication (VMM) array into neuron current-based time pulses and providing such pulses as an input to another VMM array within an artificial neural network. Numerous embodiments are disclosed for converting the neuron current-based time pulses into analog current or voltage values if an analog input is needed for the VMM array.

公开(公告)号：US20220336011A1

公开(公告)日：2022-10-20

申请号：US17857113

申请日：2022-07-04

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  THUAN VU ,  STEPHEN TRINH ,  STANLEY HONG ,  ANH LY ,  STEVEN LEMKE ,  VIPIN TIWARI ,  NHAN DO

IPC: G11C11/54 ,  G11C16/04 ,  G11C16/08 ,  G11C16/16 ,  G11C16/34 ,  G06N3/063 ,  G11C16/10

Abstract: Numerous examples for performing tuning of a page or a word of non-volatile memory cells in an analog neural memory are disclosed. In one example, a method comprises programming a word or page of non-volatile memory cells in an analog neural memory system; and identifying any fast bits in the word or page of non-volatile memory cells.

公开(公告)号：US11380698B2

公开(公告)日：2022-07-05

申请号：US17178520

申请日：2021-02-18

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Hung Quoc Nguyen ,  Nhan Do

IPC: G11C16/04 ,  H01L27/11526 ,  H01L27/11519 ,  H01L27/11521 ,  G11C16/14 ,  G11C16/26 ,  H01L29/423 ,  H01L29/788

Abstract: A memory device with memory cell pairs each having a single continuous channel region, first and second floating gates over first and second portions of the channel region, an erase gate over a third portion of the channel region between the first and second channel region portions, and first and second control gates over the first and second floating gates. For each of the pairs of memory cells, the first region is electrically connected to the second region of an adjacent pair of memory cells in the same active region, and the second region is electrically connected to the first region of an adjacent pair of the memory cells in the same active region.

公开(公告)号：US20220208277A1

公开(公告)日：2022-06-30

申请号：US17199383

申请日：2021-03-11

Applicant: Silicon Storage Technology, Inc.

Inventor： Xian Liu ,  Chunming Wang ,  Nhan Do ,  Hieu Van Tran

IPC: G11C16/26 ,  H03K19/20 ,  G06F11/10

Abstract: Numerous embodiments are disclosed of improved architectures for storing and retrieving system data in a non-volatile memory system. Using these embodiments, system data is much less likely to become corrupted due to charge loss, charge redistribution, disturb effects, and other phenomena that have caused corruption in prior art non-volatile memory systems.

公开(公告)号：US20220172781A1

公开(公告)日：2022-06-02

申请号：US17672617

申请日：2022-02-15

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Thuan Vu ,  Stanley Hong ,  Stephen Trinh ,  Anh Ly

IPC: G11C16/08 ,  G06N3/063 ,  G11C11/54

Abstract: Various embodiments of tandem row decoders are disclosed. Each embodiment of a tandem row decoder comprises a word line decoder and a control gate decoder. The tandem row decoder exhibits reduced leakage current on the word line and the control gate line when the tandem row decoder is not enabled.

公开(公告)号：US20220139940A1

公开(公告)日：2022-05-05

申请号：US17152441

申请日：2021-01-19

Applicant: Silicon Storage Technology, Inc.

Inventor： Guo Xiang Song ,  CHUNMING WANG ,  LEO XING ,  XIAN LIU ,  NHAN DO

IPC: H01L27/11531 ,  H01L27/11521 ,  H01L29/423 ,  H01L29/78 ,  H01L29/788 ,  H01L21/28 ,  H01L29/66

Abstract: A method of forming memory cells, high voltage devices and logic devices on fins of a semiconductor substrate's upper surface, and the resulting memory device formed thereby. The memory cells are formed on a pair of the fins, where the floating gate is disposed between the pair of fins, the word line gate wraps around the pair of fins, the control gate is disposed over the floating gate, and the erase gate is disposed over the pair of fins and partially over the floating gate. The high voltage devices include HV gates that wrap around respective fins, and the logic devices include logic gates that are metal and wrap around respective fins.

公开(公告)号：US20220102517A1

公开(公告)日：2022-03-31

申请号：US17165934

申请日：2021-02-02

Applicant: Silicon Storage Technology, Inc.

Inventor： Chunming Wang ,  Xian Liu ,  Guo Xiang Song ,  Leo Xing ,  Nhan Do

IPC: H01L29/423 ,  G11C16/04 ,  H01L29/66 ,  H01L29/788

Abstract: A memory device, and method of making the same, that includes a substrate of semiconductor material of a first conductivity type, first and second regions spaced apart in the substrate and having a second conductivity type different than the first conductivity type, with a first channel region in the substrate extending between the first and second regions, a first floating gate disposed over and insulated from a first portion of the first channel region adjacent to the second region, a first coupling gate disposed over and insulated from the first floating gate, a first word line gate disposed over and insulated from a second portion of the first channel region adjacent the first region, and a first erase gate disposed over and insulated from the first word line gate.

公开(公告)号：US20210407588A1

公开(公告)日：2021-12-30

申请号：US17471099

申请日：2021-09-09

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Steven Lemke ,  Vipin Tiwari ,  Nhan Do ,  Mark Reiten

IPC: G11C11/54 ,  H01L27/11521 ,  H01L29/423 ,  G11C16/04 ,  G06N3/04 ,  G11C16/10 ,  G11C16/14 ,  H01L29/788

Abstract: A neural network device with synapses having memory cells each having a floating gate and a first gate over first and second portions of a channel region disposed between source and drain regions, and a second gate over the floating gate or the source region. First lines each electrically connect the first gates in one of the memory cell rows, second lines each electrically connect the second gates in one of the memory cell rows, third lines each electrically connect the source regions in one of the memory cell columns, and fourth lines each electrically connect the drain regions in one of the memory cell columns. The synapses receive a first plurality of inputs as electrical voltages on the first or second lines, and provide a first plurality of outputs as electrical currents on the third or fourth lines.

公开(公告)号：US20210398995A1

公开(公告)日：2021-12-23

申请号：US17129865

申请日：2020-12-21

Applicant: Silicon Storage Technology, Inc.

Inventor： Jack Sun ,  Chunming Wang ,  Xian Liu ,  Andy Yang ,  Guo Xiang Song ,  Leo Xing ,  Nhan Do

IPC: H01L27/11531 ,  H01L27/11524 ,  H01L27/11529 ,  H01L29/423 ,  H01L29/66

Abstract: A method of forming a semiconductor device by recessing the upper surface of a semiconductor substrate in first and second areas but not a third area, forming a first conductive layer in the first and second areas, forming a second conductive layer in all three areas, removing the first and second conductive layers from the second area and portions thereof from the first area resulting in pairs of stack structures each with a control gate over a floating gate, forming a third conductive layer in the first and second areas, forming a protective layer in the first and second areas and then removing the second conductive layer from the third area, then forming blocks of conductive material in the third area, then etching in the first and second areas to form select and HV gates, and replacing the blocks of conductive material with blocks of metal material.

公开(公告)号：US11183506B2

公开(公告)日：2021-11-23

申请号：US17005139

申请日：2020-08-27

Applicant: Silicon Storage Technology, Inc.

Inventor： Jinho Kim ,  Xian Liu ,  Feng Zhou ,  Parviz Ghazavi ,  Steven Lemke ,  Nhan Do

IPC: H01L27/11536 ,  H01L29/66 ,  H01L21/3205 ,  H01L27/11521 ,  H01L27/12 ,  H01L21/84 ,  H01L21/3213 ,  H01L29/08 ,  H01L29/423 ,  H01L21/28 ,  H01L21/027 ,  H01L21/3105 ,  H01L21/265 ,  H01L21/321

Abstract: A method of forming a semiconductor device where memory cells and some logic devices are formed on bulk silicon while other logic devices are formed on a thin silicon layer over insulation over the bulk silicon of the same substrate. The memory cell stacks, select gate poly, and source regions for the memory devices are formed in the memory area before the logic devices are formed in the logic areas. The various oxide, nitride and poly layers used to form the gate stacks in the memory area are formed in the logic areas as well. Only after the memory cell stacks and select gate poly are formed, and the memory area protected by one or more protective layers, are the oxide, nitride and poly layers used to form the memory cell stacks removed from the logic areas, and the logic devices are then formed.