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    Cleaning mechanism for semiconductor singulation saws
    22.
    发明授权
    Cleaning mechanism for semiconductor singulation saws 有权
    半导体单片锯清洗机构

    公开(公告)号：US09498898B2

    公开(公告)日：2016-11-22

    申请号：US14555562

    申请日：2014-11-26

    Applicant: Zhijie Wang ,  Zhigang Bai ,  Mei Liu ,  Jiyong Niu ,  Zhimei Sun ,  Huchang Zhang

    Inventor： Zhijie Wang ,  Zhigang Bai ,  Mei Liu ,  Jiyong Niu ,  Zhimei Sun ,  Huchang Zhang

    IPC: B28D7/02 ,  H01L21/67 ,  B28D5/02 ,  B28D1/04

    CPC classification number: B28D7/02 ,  B28D1/04 ,  B28D5/022 ,  H01L21/67046 ,  H01L21/67092

    Abstract: A cleaning subsystem removes unwanted material, such as glaze, from saw blades used in a semiconductor singulation process. A cleaning module moves radially towards the saw blade and vertically with respect to the plane of the saw blade in order to enable abrasive cleaning blocks of the cleaning module to selectively remove material from either the upper and lower surfaces of the saw blade or the outer edge of the saw blade. The cleaning assembly can remove material from the saw blade at a predetermined time or position during the singulation process or upon detection of load imbalance during the rotation of the saw blade.

    Abstract translation: 清洁子系统从用于半导体分离过程的锯片中除去不想要的材料，例如釉料。 清洁模块相对于锯片的平面径向朝向锯片并且垂直移动，以便清洁模块的研磨清洁块能够选择性地从锯片的上表面和下表面或外边缘去除材料 的锯片。 清洁组件可以在切割过程期间的预定时间或位置处或者在锯片旋转期间检测到负载不平衡时从锯片上移除材料。

    Die edge seal employing low-K dielectric material
    23.
    发明授权
    Die edge seal employing low-K dielectric material 有权
    使用低K电介质材料的密封边缘密封

    公开(公告)号：US09406625B2

    公开(公告)日：2016-08-02

    申请号：US14555558

    申请日：2014-11-26

    Applicant: Zhijie Wang ,  Zhigang Bai ,  Jiyong Niu ,  Dehong Ye ,  Huchang Zhang

    Inventor： Zhijie Wang ,  Zhigang Bai ,  Jiyong Niu ,  Dehong Ye ,  Huchang Zhang

    IPC: H01L23/544 ,  H01L27/118 ,  H01L41/338 ,  H01L23/00 ,  H01L23/58 ,  H01L21/78 ,  H01L21/66

    CPC classification number: H01L23/562 ,  H01L21/78 ,  H01L22/34 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A semiconductor wafer has a multi-stage structure that damps and contains nascent cracks generated during dicing and inhibits moisture penetration into the active region of a die. The wafer includes an array of die regions separated by scribe lanes. The die regions include an active region and a first ring that surrounds the active region. A portion of the first ring includes a low-k dielectric material. A second ring includes a stack of alternating layers of metal and interlayer dielectric (ILD) material. A dummy metal region around the rings includes a stacked dummy metal features and surrounds the active region. A regular or irregular staggered arrangement of saw grid process control (SGPC) features reduces mechanical stress during dicing.

    Abstract translation: 半导体晶片具有多级结构，其能够阻止并包含切割期间产生的新生裂纹并且抑制水分渗透到模具的有源区域。 该晶片包括由划线所隔开的芯片区域阵列。 管芯区域包括有源区和围绕有源区的第一环。 第一环的一部分包括低k电介质材料。 第二环包括金属和层间电介质（ILD）材料的交替层叠。 围绕环的虚设金属区域包括堆叠的虚拟金属特征并围绕有源区域。 锯格过程控制（SGPC）特征的规则或不规则交错排列降低了切割时的机械应力。

    CLEANING MECHANISM FOR SEMICONDUCTOR SINGULATION SAWS
    25.
    发明申请
    CLEANING MECHANISM FOR SEMICONDUCTOR SINGULATION SAWS 有权
    用于半导体谐振器的清洁机构

    公开(公告)号：US20150367529A1

    公开(公告)日：2015-12-24

    申请号：US14555562

    申请日：2014-11-26

    Applicant: Zhijie Wang ,  Zhigang Bai ,  Mei Liu ,  Jiyong Niu ,  Zhimei Sun ,  Huchang Zhang

    Inventor： Zhijie Wang ,  Zhigang Bai ,  Mei Liu ,  Jiyong Niu ,  Zhimei Sun ,  Huchang Zhang

    IPC: B28D7/02 ,  B08B1/04 ,  B28D1/04 ,  H01L21/67 ,  B28D5/02

    CPC classification number: B28D7/02 ,  B28D1/04 ,  B28D5/022 ,  H01L21/67046 ,  H01L21/67092

    Abstract: A cleaning subsystem removes unwanted material, such as glaze, from saw blades used in a semiconductor singulation process. A cleaning module moves radially towards the saw blade and vertically with respect to the plane of the saw blade in order to enable abrasive cleaning blocks of the cleaning module to selectively remove material from either the upper and lower surfaces of the saw blade or the outer edge of the saw blade. The cleaning assembly can remove material from the saw blade at a predetermined time or position during the singulation process or upon detection of load imbalance during the rotation of the saw blade.

    Abstract translation: 清洁子系统从用于半导体分离过程的锯片中除去不想要的材料，例如釉料。 清洁模块相对于锯片的平面径向朝向锯片并且垂直移动，以便清洁模块的研磨清洁块能够选择性地从锯片的上表面和下表面或外边缘去除材料 的锯片。 清洁组件可以在切割过程期间的预定时间或位置处或者在锯片旋转期间检测到负载不平衡时从锯片上移除材料。

    Enabling Comparable Data Access Control for Lightweight Mobile Devices in Clouds
    28.
    发明申请
    Enabling Comparable Data Access Control for Lightweight Mobile Devices in Clouds 有权
    为云中的轻量级移动设备启用可比较的数据访问控制

    公开(公告)号：US20140289513A1

    公开(公告)日：2014-09-25

    申请号：US14216332

    申请日：2014-03-17

    Applicant: Dijiang HUANG ,  Zhijie WANG

    Inventor： Dijiang HUANG ,  Zhijie WANG

    IPC: H04L29/06 ,  G06F21/62 ,  H04L9/08

    CPC classification number: H04L63/0428 ,  G06F21/6218 ,  H04L9/3073 ,  H04L63/06 ,  H04L63/102 ,  H04L2209/805

    Abstract: A new efficient framework based on a Constant-size Ciphertext Policy Comparative Attribute-Based Encryption (CCP-CABE) approach. CCP-CABE assists lightweight mobile devices and storing privacy-sensitive sensitive data into cloudbased storage by offloading major cryptography-computation overhead into the cloud without exposing data content to the cloud. CCP-CABE extends existing attribute-based data access control solutions by incorporating comparable attributes to incorporate more flexible security access control policies. CCP-CABE generates constant-size ciphertext regardless of the number of involved attributes, which is suitable for mobile devices considering their limited communication and storage capacities.

    Abstract translation: 一种基于常规密文策略比较属性加密（CCP-CABE）方法的新型高效框架。 CCP-CABE通过将主要的加密计算开销下载到云中，无需将数据内容暴露在云端，帮助轻量级移动设备将隐私敏感敏感数据存储到基于云的存储中。 CCP-CABE通过引入可比较的属性来扩展现有的基于属性的数据访问控制解决方案，以纳入更灵活的安全访问控制策略。 CCP-CABE生成恒定大小的密文，无论涉及的属性数量如何，这适用于考虑到其有限通信和存储容量的移动设备。

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