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21.发明申请公开(公告)号：US20140375394A1
公开(公告)日：2014-12-25
申请号：US14108838
申请日：2013-12-17
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： GWUN-JIN LIN , KUO-FU SU , CHIH-HENG CHUO
IPC: H01P3/08
CPC classification number: H01P1/22 , H01P1/227 , H01P3/026 , H03H7/38 , H05K1/00 , H05K1/0242 , H05K1/025 , H05K1/0393 , H05K2201/0969 , H05K2201/09827
Abstract: An attenuation reduction control structure for high-frequency signal transmission lines of a flexible circuit board includes an impedance control layer formed on a surface of a substrate. The impedance control layer includes an attenuation reduction pattern that is arranged in an extension direction of the high-frequency signal transmission lines of the substrate and corresponds to bottom angle structures of the high-frequency signal transmission lines in order to improve attenuation of a high-frequency signal transmitted through the high-frequency signal transmission lines. An opposite surface of the substrate includes a conductive shielding layer formed thereon. The conductive shielding layer is formed with an attenuation reduction pattern corresponding to top angle structures of the high-frequency signal transmission lines.
Abstract translation: 柔性电路板的高频信号传输线的衰减减小控制结构包括形成在基板的表面上的阻抗控制层。 阻抗控制层包括沿着衬底的高频信号传输线的延伸方向布置的衰减减小图案，并且对应于高频信号传输线的底角结构，以便改善高频信号传输线的衰减， 频率信号通过高频信号传输线路传输。 基板的相对表面包括形成在其上的导电屏蔽层。 导电屏蔽层形成有对应于高频信号传输线的顶角结构的衰减减小图案。
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22.发明申请公开(公告)号：US20140285280A1
公开(公告)日：2014-09-25
申请号：US13895444
申请日：2013-05-16
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： CHIH-HENG CHUO , GWUN-JIN LIN , KUO-FU SU
IPC: H01P3/02
CPC classification number: H05K1/0224 , H01P3/02 , H01P3/026 , H05K1/0219 , H05K1/0245 , H05K1/0253 , H05K1/117 , H05K2201/058
Abstract: Disclosed is a grounding pattern structure for high-frequency connection pads of a circuit board. A substrate of the circuit board includes a component surface on which at least a pair of high-frequency connection pads. At least a pair of differential mode signal lines are formed on the substrate and connected to the high-frequency connection pads. The grounding surface of the substrate includes a grounding layer formed at a location corresponding to the differential mode signal lines. The grounding surface of the substrate includes a grounding pattern structure formed thereon to correspond to a location adjacent to the high-frequency connection pads. The grounding pattern structure is electrically connected to the grounding layer. The component surface of the substrate can be provided with a connector mounted thereto with signal terminals of the connector soldered to the high-frequency connection pads.
Abstract translation: 公开了一种用于电路板的高频连接焊盘的接地图案结构。 电路板的基板包括一个部件表面，在该部件表面上至少有一对高频连接焊盘。 至少一对差模信号线形成在基板上并连接到高频连接焊盘。 衬底的接地表面包括形成在对应于差动模式信号线的位置处的接地层。 衬底的接地表面包括形成在其上的接地图案结构，以对应于与高频连接焊盘相邻的位置。 接地图结构与接地层电连接。 基板的部件表面可以设置有安装在其上的连接器，其中连接器的信号端子焊接到高频连接焊盘。
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公开(公告)号：US20130277095A1
公开(公告)日：2013-10-24
申请号：US13920386
申请日：2013-06-18
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： GWUN-JIN LIN , CHIH-HENG CHUO , KUO-FU SU
IPC: H05K1/02
CPC classification number: H05K1/0277 , H05K1/028 , H05K1/118 , H05K2201/0394 , H05K2201/052 , H05K2201/09063 , H05K2201/0949 , H05K2201/10598 , H05K2203/0228 , H05K2203/1572
Abstract: Disclosed is a double-side-conducting flexible-circuit flat cable with cluster section, which includes a flexible circuit substrate, a first electrical conduction path, a second electrical conduction path, a plurality of first and second conductive contact zones. The flexible circuit substrate has a first surface and a second surface and includes, in an extension direction, a first connection section, a cluster section, and at least one second connection section. The cluster section is composed of a plurality of clustered flat cable components formed by slitting in the extension direction. The first and second electrical conduction paths are respectively formed on the first and second surfaces of the flexible circuit substrate and each extends along one of the clustered flat cable components of the cluster section. The plurality of first and second conductive contact zones are respectively arranged on the first and second surfaces of the flexible circuit substrate at the first connection section. Each of the first and second conductive contact zones extends along one of the electrical conduction paths of the cluster section toward the second connection section.
Abstract translation: 公开了一种具有集束部分的双面导电柔性电路扁平电缆，其包括柔性电路基板，第一导电路径，第二导电通路，多个第一和第二导电接触区域。 柔性电路基板具有第一表面和第二表面，并且在延伸方向上包括第一连接部分，集束部分和至少一个第二连接部分。 集群部分由沿着延伸方向切割形成的多个群集扁平电缆部件组成。 第一和第二导电路径分别形成在柔性电路基板的第一和第二表面上，并且每个沿着集束部分的群集扁平电缆部件之一延伸。 多个第一和第二导电接触区域分别设置在第一连接部分处的柔性电路基板的第一和第二表面上。 第一和第二导电接触区域中的每一个沿着群集部分的导电路径中的一个朝向第二连接部分延伸。
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公开(公告)号：US20200170109A1
公开(公告)日：2020-05-28
申请号：US16412613
申请日：2019-05-15
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU , CHIH-HENG CHUO , GWUN-JIN LIN
Abstract: A circuit board structure that includes a resin-based conductive adhesive layer is disclosed, in which a conductive layer is arranged between a first circuit board and a second circuit board. The conductive layer includes a first conductive paste layer and the resin-based conductive adhesive layer is formed on the first conductive paste layer. The resin-based conductive adhesive layer contains a sticky resin material and a plurality of conductive particles distributed in the sticky resin material. The plurality of conductive particles establish an electrical connection between the first conductive paste layer and the resin-based conductive adhesive layer.
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公开(公告)号：US20190081420A1
公开(公告)日：2019-03-14
申请号：US16002186
申请日：2018-06-07
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： CHIH-HENG CHUO , KUO-FU SU , GWUN-JIN LIN
Abstract: A stacked insertion structure for a flexible circuit board is provided. The flexible circuit board has an insertion section that is connected through a bent connection section to a fold-back section. The fold-back section is backward folded, through the bent connection section, toward and stacked on the insertion section such that a second coupling surface of the fold-back section corresponds to and overlap a first coupling surface of the insertion section for being insertable into an insertion socket of a connector. The fold-back section and the insertion section are bonded together with an adhesive layer therebetween or a height adjustment layer is provided therebetween to adjust an overall height of the two.
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Patent Agency Ranking
公开(公告)号：US20180270947A1
公开(公告)日：2018-09-20
申请号：US15920915
申请日：2018-03-14
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU , CHIH-HENG CHUO , GWUN-JIN LIN
Abstract: A signal attenuation reduction structure for a flexible circuit board includes at least one conductive paste coating zone formed on surfaces of signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to at least one signal line or covers a plurality of signal lines. An anisotropic conductive film is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The anisotropic conductive film is pressed to bond between the conductive paste coating zone and a shielding layer such that the conductive paste coating zone and the shielding layer achieve electrical connection therebetween in a vertical direction through the anisotropic conductive film.
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27.发明申请FLEXIBLE CIRCUIT BOARD COMBINED WITH CARRIER BOARD AND MANUFACTURING METHOD THEREOF 有权与运输板组合的柔性电路板及其制造方法公开(公告)号：US20160360611A1
公开(公告)日：2016-12-08
申请号：US15240155
申请日：2016-08-18
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU , GWUN-JIN LIN
CPC classification number: H05K3/007 , H05K1/0281 , H05K1/0298 , H05K1/09 , H05K1/115 , H05K3/025 , H05K3/064 , H05K3/188 , H05K3/429 , H05K2201/0338 , H05K2201/0352 , H05K2201/09563 , H05K2203/0152
Abstract: Disclosed is a structure of a flexible circuit board combined with a carrier board. The carrier board includes a thick copper layer, a thin copper layer, and a release layer formed between the thick copper layer and the thin copper layer. The flexible circuit substrate and the carrier board are bonded together by an adhesive layer. In a subsequent process, the release layer, together with the thick copper layer, is peeled from a top surface of the thin copper layer and the thin copper layer is preserved by being bonded by the adhesive layer to the flexible circuit substrate.
Abstract translation: 公开了与载板组合的柔性电路板的结构。 载体板包括厚铜层，薄铜层和形成在厚铜层和薄铜层之间的剥离层。 柔性电路基板和载板通过粘合剂层粘合在一起。 在随后的工艺中，剥离层与厚铜层一起从薄铜层的顶表面剥离，并且通过粘合剂层粘合到柔性电路基板来保护薄铜层。
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28.发明申请FLEXIBLE CIRCUIT BOARD COMBINED WITH CARRIER BOARD AND MANUFACTURING METHOD THEREOF 审中-公开与运输板组合的柔性电路板及其制造方法公开(公告)号：US20150359086A1
公开(公告)日：2015-12-10
申请号：US14714492
申请日：2015-05-18
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU , GWUN-JIN LIN
CPC classification number: H05K3/007 , H05K1/0281 , H05K1/0298 , H05K1/09 , H05K1/115 , H05K3/025 , H05K3/064 , H05K3/188 , H05K3/429 , H05K2201/0338 , H05K2201/0352 , H05K2201/09563 , H05K2203/0152
Abstract: Disclosed is a structure of a flexible circuit board combined with a carrier board. The carrier board includes a thick copper layer, a thin copper layer, and a release layer formed between the thick copper layer and the thin copper layer. The flexible circuit substrate and the carrier board are bonded together by an adhesive layer. In a subsequent process, the release layer, together with the thick copper layer, is peeled from atop surface of the thin copper layer and the thin copper layer is preserved by being bonded by the adhesive layer to the flexible circuit substrate.
Abstract translation: 公开了与载板组合的柔性电路板的结构。 载体板包括厚铜层，薄铜层和形成在厚铜层和薄铜层之间的剥离层。 柔性电路基板和载板通过粘合剂层粘合在一起。 在随后的工艺中，剥离层与厚铜层一起从薄铜层的顶表面剥离，并且通过粘合剂层粘合到柔性电路基板来保护薄铜层。
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29.发明申请公开(公告)号：US20150327368A1
公开(公告)日：2015-11-12
申请号：US14446605
申请日：2014-07-30
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU , GWUN-JIN LIN
CPC classification number: H05K1/118 , H05K1/0215 , H05K1/113 , H05K1/144 , H05K2201/058
Abstract: An interconnecting conduction structure for electrically connecting conductive traces of a lapped flexible circuit board is disclosed. The lapped flexible circuit board includes a first flexible circuit board and a second flexible circuit board. A through hole is formed in the second flexible circuit board and an interconnecting conduction member is filled in the through hole of the second flexible circuit board. The interconnecting conduction member is electrically connected to a second solder pad of the second flexible circuit board and a first solder pad of the first flexible circuit board in order to formed a lapped connection between conductive traces of the first flexible circuit board and the second flexible circuit board.
Abstract translation: 公开了用于电连接重叠的柔性电路板的导电迹线的互连导电结构。 重叠的柔性电路板包括第一柔性电路板和第二柔性电路板。 在第二柔性电路板中形成通孔，并且在第二柔性电路板的通孔中填充互连导电部件。 互连导电构件电连接到第二柔性电路板的第二焊盘和第一柔性电路板的第一焊盘，以便在第一柔性电路板和第二柔性电路板的导电迹线之间形成重叠连接 板。
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公开(公告)号：US20150237716A1
公开(公告)日：2015-08-20
申请号：US14283372
申请日：2014-05-21
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU , CHIH-HENG CHUO , GWUN-JIN LIN
CPC classification number: H05K1/0271 , H05K1/0277 , H05K1/028 , H05K1/0281 , H05K1/118 , H05K2201/09063 , H05K2201/09145
Abstract: Disclosed is a tear protection structure for a flexible circuit board. In an extension section of a flexible circuit board, at least a slit line is formed. The slit line has at least a terminal end from which a stress-diverting cut segment extends. The stress-diverting cut segment is formed by cutting in a cutting direction that defines an angle with respect to an extension direction of the extension section to serve as the tear protection structure of the flexible circuit board. The extension section of the flexible circuit board is foldable along the slit line. The stress-diverting cut segment may further include a tear protection hole formed in a termination end thereof.
Abstract translation: 公开了一种用于柔性电路板的撕裂保护结构。 在柔性电路板的延伸部中，至少形成有切割线。 切割线至少具有应力分流切割部分从该终端延伸的终端。 应力转向切割段通过沿切割方向切割形成，该切割方向限定相对于延伸部分的延伸方向的角度，以用作柔性电路板的撕裂保护结构。 柔性电路板的延伸部分沿着切口线可折叠。 应力转向切割段还可以包括在其终止端中形成的撕裂保护孔。
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