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45 条记录 (耗时 0.026 秒)

    Microelectronic package with tubular housing
    22.
    发明授权
    Microelectronic package with tubular housing 有权
    微电子封装带管状外壳

    公开(公告)号：US06778389B1

    公开(公告)日：2004-08-17

    申请号：US10613447

    申请日：2003-07-03

    申请人： Andrew Z. Glovatsky ,  Vladimir Stoica

    发明人： Andrew Z. Glovatsky ,  Vladimir Stoica

    IPC分类号： H05K720

    CPC分类号： H01L25/065 ,  H01L2924/0002 ,  H05K1/148 ,  H05K1/189 ,  H05K7/1434 ,  H05K2201/064 ,  H05K2201/09018 ,  H05K2201/09809 ,  H01L2924/00

    摘要： A microelectronic package comprises a tubular housing and a microelectronic assembly affixed to a support that is received in the housing. The support may be a cage-like structure that comprises axial ribs to which the microelectronic assembly is attached. Alternately, the support may comprise a solid surface for affixing a flexible substrate. The microelectronic assembly is arranged with a major surface facing and spaced apart from the inner wall of the housing. Thus, the microelectronic assembly is proximate to the wall to provide an optimum volume for packaging other components. Movement, the spacing between the microelectronic assembly and the tubular housing facilitates coolant gas flow during use to enhance thermal dissipation.

    摘要翻译： 微电子封装包括管状壳体和固定到容纳在壳体中的支撑件的微电子组件。 支撑件可以是笼状结构，其包括微电子组件附接到的轴向肋。 或者，支撑件可以包括用于固定柔性基板的固体表面。 微电子组件布置成具有面向并与壳体的内壁间隔开的主表面。 因此，微电子组件靠近壁以提供用于包装其他部件的最佳体积。 移动时，微电子组件和管状壳体之间的间隔在使用期间促进冷却剂气体流动以增强散热。

    Electronically integrated vehicle support structure
    23.
    发明授权
    Electronically integrated vehicle support structure 失效
    电子集成车辆支撑结构

    公开(公告)号：US06705671B1

    公开(公告)日：2004-03-16

    申请号：US10292553

    申请日：2002-11-12

    申请人： Andrew Z. Glovatsky ,  Daniel R. Vander sluis

    发明人： Andrew Z. Glovatsky ,  Daniel R. Vander sluis

    IPC分类号： B60K3700

    CPC分类号： B62D29/001 ,  B60K2350/302 ,  B60K2350/305 ,  B60K2350/307 ,  B60R16/0215 ,  B62D25/145 ,  B62D29/005

    摘要： An integrated vehicle structure combines the mechanical and electrical systems of the vehicle. The integrated vehicle structure generally comprises a vehicle support structure, a flatwire extending along the vehicle support structure, and an electronic site incorporated to the flatwire. Preferably, the electronic site is supported directly on the vehicle support structure, and is a flexible circuit board. Alternately, the electronic site can be a rigid circuit board. Most preferably, the electronic site is integrally formed with the flatwire. The vehicle support preferably comprises a cross-car beam, which includes both metal and plastic components.

    摘要翻译： 集成的车辆结构结合了车辆的机械和电气系统。 集成车辆结构通常包括车辆支撑结构，沿着车辆支撑结构延伸的扁线以及并入到扁线中的电子位置。 优选地，电子场所直接支撑在车辆支撑结构上，并且是柔性电路板。 或者，电子站点可以是刚性电路板。 最优选地，电子部位与扁丝一体形成。 车辆支撑件优选地包括横向车梁，其包括金属和塑料部件。

    Vehicle instrument panel structure to support electronics packaging
    28.
    发明授权
    Vehicle instrument panel structure to support electronics packaging 失效
    车载仪表板结构支持电子封装

    公开(公告)号：US06669273B1

    公开(公告)日：2003-12-30

    申请号：US10245764

    申请日：2002-09-16

    申请人： Andrew Z. Glovatsky ,  Thomas B. Krautheim ,  Daniel R. Vander Sluis

    发明人： Andrew Z. Glovatsky ,  Thomas B. Krautheim ,  Daniel R. Vander Sluis

    IPC分类号： B62D2514

    CPC分类号： B62D25/145 ,  B60K37/00

    摘要： An automobile instrument panel assembly for the cockpit of an automobile. The assembly includes, in one embodiment, a cross-car beam structure for supporting the assembly. The structure extends across a substantial portion of the cockpit and defines a plurality of generally planar mounting sites and further defines at least one recess. At least one substrate is mounted to the beam and includes at least one area of the substrate populated by electronic components on both sides of the substrate. The area is aligned over the at least one recess, and an instrument panel cover is removably positioned over the substrate and the structure.

    摘要翻译： 一种用于汽车驾驶舱的汽车仪表板组件。 在一个实施例中，组件包括用于支撑组件的十字架梁结构。 该结构延伸穿过驾驶舱的大部分并且限定多个大致平面的安装位置，并进一步限定至少一个凹部。 至少一个基板被安装到所述梁上并且包括由所述基板的两侧上的电子部件填充的所述基板的至少一个区域。 该区域在至少一个凹部上对准，并且仪表板盖可移除地定位在基板和结构上方。