公开(公告)号：US20250108474A1

公开(公告)日：2025-04-03

申请号：US18478649

申请日：2023-09-29

Applicant: Applied Materials, Inc.

Inventor： Nojan Motamedi ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Harry Q. Lee ,  Steven M. Zuniga ,  Justin Ho Kuen Wong

IPC: B24B37/005 ,  B24B49/12

Abstract: A notch finding station includes a sensor to generate a signal that depends on an proportion of a sensing region of the sensor that is covered by the substrate, and a controller. The controller is configured to cause an actuator to position a carrier head relative to the sensor such that the sensing region of the sensor is at an edge of the substrate, cause the motor to generate rotational motion such that the sensing region of the sensor scans along a circumference of the substrate, and detect an angular position of a notch in the edge of the substrate based on a signal from the sensor, including compensating for a sinusoidal component of the signal resulting from an offset of the center of the substrate from the axis of rotation.

公开(公告)号：US20240017376A1

公开(公告)日：2024-01-18

申请号：US18352446

申请日：2023-07-14

Applicant: Applied Materials, Inc.

Inventor： Brian J. Brown ,  Chirantha Rodrigo ,  Ekaterina A. Mikhaylichenko ,  Boguslaw A. Swedek ,  Thomas H. Osterheld ,  Dominic J. Benvegnu ,  Lakshmanan Karuppiah

IPC: B24B49/04 ,  B24B57/02 ,  B24B37/013 ,  B24B37/26

CPC classification number: B24B49/045 ,  B24B57/02 ,  B24B37/013 ,  B24B37/26

Abstract: A chemical mechanical polishing system includes a support configured to hold a substrate face-up, a polishing article having a polishing surface smaller than an exposed surface of the substrate, a port for dispensing a polishing liquid, one or more actuators to bring the polishing surface into contact with a first portion of the exposed surface of the substrate and to generate relative motion between the substrate and the polishing pad and optically transmissive polymer window, an in-situ optical monitoring system, and a controller configured to receive a signal from the optical in-situ monitoring system and to modifying a polishing parameter based on the signal. The optical monitoring system includes a light source and a detector, the in-situ optical monitoring system configured to direct a light beam from above the support to impinge a non-overlapping second portion of the exposed surface of the substrate.

公开(公告)号：US11774235B2

公开(公告)日：2023-10-03

申请号：US16024312

申请日：2018-06-29

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek

IPC: G01B11/06 ,  B24B37/013 ,  B24B49/12 ,  H01L21/66

CPC classification number: G01B11/06 ,  B24B37/013 ,  B24B49/12 ,  G01B11/0625 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26

Abstract: Among other things, a computer-based method is described. The method comprises receiving, by one or more computers, a plurality of measured spectra reflected from a substrate at a plurality of different positions on the substrate. The substrate comprises at least two regions having different structural features. The method also comprises performing, by the one or more computers, a clustering algorithm on the plurality of measured spectra to separate the plurality of measured spectra into a number of groups based on the spectral characteristics of the plurality of measured spectra; selecting one of the number of groups to provide a selected group having a subset of spectra from the plurality of measured spectra; and determining, in the one or more computers, at least one characterizing value for the substrate based on the subset of spectra of the selected group.

公开(公告)号：US20230213324A1

公开(公告)日：2023-07-06

申请号：US18183138

申请日：2023-03-13

Applicant: Applied Materials, Inc.

Inventor： Hassan G. Iravani ,  Kun Xu ,  Denis Ivanov ,  Shih-Haur Shen ,  Boguslaw A. Swedek

IPC: G01B7/06 ,  B24B49/10

CPC classification number: G01B7/105 ,  B24B49/10

Abstract: An apparatus for chemical mechanical polishing includes a support for a polishing pad having a polishing surface, and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by the polishing pad. The electromagnetic induction monitoring system includes a core and a coil wound around a portion of the core. The core includes a back portion, a center post extending from the back portion in a first direction normal to the polishing surface, and an annular rim extending from the back portion in parallel with the center post and surrounding and spaced apart from the center post by a gap. A width of the gap is less than a width of the center post, and a surface area of a top surface of the annular rim is at least two times greater than a surface area of a top surface of the center post.

公开(公告)号：US20220281057A1

公开(公告)日：2022-09-08

申请号：US17674768

申请日：2022-02-17

Applicant: Applied Materials, Inc.

Inventor： Nicholas A. Wiswell ,  Sohrab Pourmand ,  Dominic J. Benvegnu ,  Thomas H. Osterheld ,  Boguslaw A. Swedek

IPC: B24B37/013

Abstract: A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate, an in-situ acoustic monitoring system, and a controller. The controller is configured to detect exposure of an underlying layer due to the polishing of the substrate based on measurements from the in-situ acoustic monitoring system. The in-situ acoustic monitoring system may detect exposure of an underlying layer based on comparison of the signal to prior measurements of acoustic signals generated by stress energy of test substrates.

公开(公告)号：US20210229234A1

公开(公告)日：2021-07-29

申请号：US17232080

申请日：2021-04-15

Applicant: Applied Materials, Inc.

Inventor： Kun Xu ,  Hassan G. Iravani ,  Denis Ivanov ,  Boguslaw A. Swedek ,  Shih-Haur Shen ,  Harry Q. Lee ,  Benjamin Cherian

IPC: B24B37/013 ,  G06N3/08 ,  H01L21/306

Abstract: A method of polishing a layer on the substrate at a polishing station includes the actions of monitoring the layer during polishing at the polishing station with an in-situ monitoring system to generate a plurality of measured signals for a plurality of different locations on the layer; generating, for each location of the plurality of different locations, an estimated measure of thickness of the location, the generating including processing the plurality of measured signals through a neural network; and at least one of detecting a polishing endpoint or modifying a polishing parameter based on each estimated measure of thickness.

公开(公告)号：US11004708B2

公开(公告)日：2021-05-11

申请号：US15727297

申请日：2017-10-06

Applicant: Applied Materials, Inc.

Inventor： Hassan G. Iravani ,  Boguslaw A. Swedek ,  Tzu-Yu Liu ,  Kun Xu ,  Shih-Haur Shen

IPC: H01L21/67 ,  H01L21/304 ,  H01L21/66 ,  B24B49/10 ,  G01B7/06 ,  B24B49/02 ,  B24B37/013 ,  G01N27/90

Abstract: An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by the polishing pad. The electromagnetic induction monitoring system includes a core positioned at least partially in the platen and a coil wound around a portion of the core. The core includes a back portion and a multiplicity of posts extending from the back portion in a first direction normal to the surface of the platen. The core and coil are configured such that the multiplicity of posts include a first plurality of posts to provide a first magnetic polarity and a second plurality of posts to provide an opposite second magnetic polarity, and the first plurality of posts and the second plurality of posts are arranged in an alternating pattern.

公开(公告)号：US20190283204A1

公开(公告)日：2019-09-19

申请号：US16351954

申请日：2019-03-13

Applicant: Applied Materials, Inc.

Inventor： Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Chih Chung Chou ,  Nicholas Wiswell ,  Thomas H. Osterheld ,  Jeonghoon Oh

IPC: B24B37/013 ,  B24B49/12 ,  B24B37/04 ,  H01L21/66

Abstract: A chemical mechanical polishing apparatus includes a platen to support a polishing pad, the platen having a recess, a flexible membrane in the recess, and an in-situ vibration monitoring system to generate a signal. The in-situ acoustic monitoring system includes a vibration sensor supported by the flexible membrane and positioned to couple to an underside of the polishing pad.

公开(公告)号：US20190252274A1

公开(公告)日：2019-08-15

申请号：US16397870

申请日：2019-04-29

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Jeffrey Drue David ,  Boguslaw A. Swedek

IPC: H01L21/66 ,  H01L21/67 ,  H01L21/3105 ,  B24B37/013 ,  H01L21/321 ,  B24D7/14 ,  B24B49/12 ,  B24B49/08 ,  B24B37/20 ,  H01L21/306

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B37/205 ,  B24B49/08 ,  B24B49/12 ,  B24D7/14 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/31055 ,  H01L21/3212 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253

Abstract: A method of detecting a polishing endpoint includes storing a plurality of library spectra, measuring a sequence of spectra from the substrate in-situ during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching library spectrum from the plurality of library spectra to generate a sequence of best matching library spectra. Each library spectrum has a stored associated value representing a degree of progress through a polishing process, and the stored associated value for the best matching library spectrum is determined for each best matching library spectrum to generate a sequence of values representing a progression of polishing of the substrate. The sequence of values is compared to a target value, and a polishing endpoint is triggered when the sequence of values reaches the target value.

公开(公告)号：US20180122667A1

公开(公告)日：2018-05-03

申请号：US15727297

申请日：2017-10-06

Applicant: Applied Materials, Inc.

Inventor： Hassan G. Iravani ,  Boguslaw A. Swedek ,  Tzu-Yu Liu ,  Kun Xu ,  Shih-Haur Shen

IPC: H01L21/67 ,  H01L21/304 ,  H01L21/66 ,  G01N27/90 ,  B24B49/10 ,  G01B7/06

CPC classification number: H01L21/67253 ,  B24B49/105 ,  G01B7/107 ,  G01N27/9006 ,  H01L21/304 ,  H01L22/14 ,  H01L22/26

Abstract: An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by the polishing pad. The electromagnetic induction monitoring system includes a core positioned at least partially in the platen and a coil wound around a portion of the core. The core includes a back portion and a multiplicity of posts extending from the back portion in a first direction normal to the surface of the platen. The core and coil are configured such that the multiplicity of posts include a first plurality of posts to provide a first magnetic polarity and a second plurality of posts to provide an opposite second magnetic polarity, and the first plurality of posts and the second plurality of posts are arranged in an alternating pattern.