公开(公告)号：US20060112550A1

公开(公告)日：2006-06-01

申请号：US11178145

申请日：2005-07-07

Applicant: Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard ,  Christopher Bang

Inventor： Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard ,  Christopher Bang

IPC: H01R43/00

CPC classification number: C25D1/003 ,  G01R3/00 ,  Y10T29/49222

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.

公开(公告)号：US20060108678A1

公开(公告)日：2006-05-25

申请号：US11173241

申请日：2005-06-30

Applicant: Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard Chen ,  Christopher Bang ,  Vacit Arat ,  Michael Lockard ,  Uri Frodis ,  Pavel Lembrikov ,  Jeffrey Thompson

Inventor： Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard Chen ,  Christopher Bang ,  Vacit Arat ,  Michael Lockard ,  Uri Frodis ,  Pavel Lembrikov ,  Jeffrey Thompson

IPC: H01L23/48

CPC classification number: B23K35/0222 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  C25D1/12 ,  G01R1/06744 ,  G01R1/07307 ,  G01R1/07314 ,  G01R3/00 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/10126 ,  H01L2224/1147 ,  H01L2224/11831 ,  H01L2224/1184 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/81001 ,  H01L2224/81054 ,  H01L2224/81136 ,  H01L2224/8121 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3651 ,  H01L2924/3841 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012

Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.

Abstract translation: 本发明的实施例涉及在临时衬底上形成微探针（即柔性电气或电子接触元件），切割单独的探针阵列，然后将阵列转移到空间变压器或其它永久衬底。 在将探针从其上形成探针的临时基底分离出来之前，本发明的一些实施方案将探针转移到永久性基底上，而其他实施方案相反。 一些实施例，在转移之前去除牺牲材料，而其它实施例在转移后去除牺牲材料。 一些实施例涉及使用一个或多个具有增强的纵横比（即，高度与宽度比）的焊料凸块来将第一和第二电气部件接合在一起，这是由于至少部分地由保持材料的环围绕凸块而得到的。 保留材料可以用作焊接掩模材料。

公开(公告)号：US20060051948A1

公开(公告)日：2006-03-09

申请号：US11177771

申请日：2005-07-07

Applicant: Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard ,  Christopher Bang

Inventor： Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard ,  Christopher Bang

IPC: H01L21/44

CPC classification number: G01R1/0483 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07314 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2886 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  Y10T156/10 ,  H01L2924/00

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.

公开(公告)号：US20050223543A1

公开(公告)日：2005-10-13

申请号：US11028945

申请日：2005-01-03

Applicant: Adam Cohen ,  Vacit Arat ,  Michael Lockard ,  Christopher Bang ,  Pavel Lembrikov

Inventor： Adam Cohen ,  Vacit Arat ,  Michael Lockard ,  Christopher Bang ,  Pavel Lembrikov

IPC: H02M7/00

CPC classification number: G01R3/00 ,  B33Y10/00 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  G01R1/06716 ,  G01R1/07378 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49078 ,  Y10T29/49204 ,  Y10T29/49222

Abstract: Embodiments of the invention provide electrochemical fabrication processes that may be used for the fabrication of space transformers or the co-fabrication of microprobe arrays along with one or more space transformers.

Abstract translation: 本发明的实施例提供了可用于制造空间变压器或与一个或多个空间变压器一起共同制造微探针阵列的电化学制造工艺。

公开(公告)号：US20050212539A1

公开(公告)日：2005-09-29

申请号：US11029219

申请日：2005-01-03

Applicant: Richard Chen ,  Ezekiel Kruglick ,  Christopher Bang ,  Dennis Smalley ,  Pavel Lembrikov

Inventor： Richard Chen ,  Ezekiel Kruglick ,  Christopher Bang ,  Dennis Smalley ,  Pavel Lembrikov

IPC: G01R1/067 ,  G01R31/02

CPC classification number: G01R1/06733 ,  G01R1/06744

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.