公开(公告)号：US20190119150A1

公开(公告)日：2019-04-25

申请号：US16162644

申请日：2018-10-17

Applicant: CORNING INCORPORATED

Inventor： Robert Carl Burket ,  Daniel Wayne Levesque, JR. ,  Sasha Marjanovic ,  Garrett Andrew Piech ,  Heather Nicole Vanselous ,  Kristopher Allen Wieland

IPC: C03C15/00 ,  C03C23/00

Abstract: A method for processing a transparent workpiece includes forming a closed contour line having a plurality of defects in the transparent workpiece such that the closed contour line defines a closed contour. Forming the closed contour line includes directing a pulsed laser beam through an aspheric optical element and into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, the induced absorption producing a defect within the transparent workpiece, and translating the transparent workpiece and the pulsed laser beam relative to each other along the closed contour line. The method further includes etching the transparent workpiece with a chemical etching solution at an etching rate of about 2.5 μm/min or less to separate a portion of the transparent workpiece along the closed contour line, thereby forming an aperture extending through the transparent workpiece, the aperture comprising an aperture perimeter extending along the closed contour.

公开(公告)号：US20190084090A1

公开(公告)日：2019-03-21

申请号：US16183065

申请日：2018-11-07

Applicant: CORNING INCORPORATED

Inventor： Sasha Marjanovic ,  Garrett Andrew Piech ,  Shyamala Shanmugam ,  Carlos Alberto Pons Siepermann ,  Sergio Tsuda ,  Zsigmond Varga ,  Robert Stephen Wagner

IPC: B23K26/384 ,  B23K26/38 ,  C03B33/09 ,  C03C15/00 ,  B23K26/06 ,  B23K26/04 ,  C03B33/02 ,  B32B17/06 ,  B23K26/0622 ,  B23K26/53 ,  B23K26/402 ,  C03C17/00 ,  B23K26/55 ,  B23K103/00 ,  C09K13/00

Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.

公开(公告)号：US20190074240A1

公开(公告)日：2019-03-07

申请号：US16179048

申请日：2018-11-02

Applicant: CORNING INCORPORATED

Inventor： Daniel Wayne Levesque, JR. ,  Garrett Andrew Piech ,  Aric Bruce Shorey

IPC: H01L23/48 ,  H01L21/48 ,  H01L21/311 ,  B81B7/00 ,  B81C1/00 ,  H01L21/268 ,  H01L21/306 ,  H01L21/683 ,  H01L21/762 ,  H01L21/768 ,  H01L23/498

Abstract: A process comprises bonding a semiconductor wafer to an inorganic wafer. The semiconductor wafer is opaque to a wavelength of light to which the inorganic wafer is transparent. After the bonding, a damage track is formed in the inorganic wafer using a laser that emits the wavelength of light. The damage track in the inorganic wafer is enlarged to form a hole through the inorganic wafer by etching. The hole terminates at an interface between the semiconductor wafer and the inorganic wafer. An article is also provided, comprising a semiconductor wafer bonded to an inorganic wafer. The semiconductor wafer is opaque to a wavelength of light to which the inorganic wafer is transparent. The inorganic wafer has a hole formed through the inorganic wafer. The hole terminates at an interface between the semiconductor wafer and the inorganic wafer.

公开(公告)号：US20180179100A1

公开(公告)日：2018-06-28

申请号：US15812156

申请日：2017-11-14

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Albert Roth Nieber ,  Garrett Andrew Piech ,  Helmut Schillinger ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: C03B33/02 ,  B23K26/40 ,  B23K26/53 ,  C03B17/06

CPC classification number: C03B33/0222 ,  B23K26/0622 ,  B23K26/40 ,  B23K26/53 ,  B23K26/57 ,  B23K2103/172 ,  B23K2103/50 ,  C03B17/064 ,  C03B25/087 ,  C03B29/10 ,  C03B33/0215 ,  C03B33/07 ,  C03B33/091 ,  Y02P40/57 ,  Y10T428/24777 ,  Y10T428/249921

Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (

公开(公告)号：US20180068868A1

公开(公告)日：2018-03-08

申请号：US15696736

申请日：2017-09-06

Applicant: Corning Incorporated

Inventor： Andres Covarrubias Jaramillo ,  Yuhui Jin ,  Frank Andrew Kramer, IV ,  Ekaterina Aleksandrovna Kuksenkova ,  Daniel Wayne Levesque, JR. ,  Garrett Andrew Piech ,  Aric Bruce Shorey ,  Robert Stephen Wagner

IPC: H01L21/48 ,  C03C15/00 ,  C03C23/00 ,  H01L23/538 ,  H01L23/498

CPC classification number: H01L21/4807 ,  C03C15/00 ,  C03C23/0025 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5384 ,  H01L23/5386 ,  H01L2224/16225

Abstract: Articles including a glass-based substrate with holes, semiconductor packages including an article with holes, and methods of fabricating holes in a substrate are disclosed. In one embodiment, an article includes a glass-based substrate having a first surface, a second surface, and at least one hole extending from the first surface. The at least one hole has an interior wall having a surface roughness Ra that is less than or equal to 1 μm. The at least one hole has a first opening having a first diameter that is present the first surface. A first plane is defined by the first surface of the glass-based substrate based on an average thickness of the glass-based substrate. A ratio of a depression depth to the first diameter of the at least one hole is less than or equal to 0.007.

公开(公告)号：US20180005922A1

公开(公告)日：2018-01-04

申请号：US15630363

申请日：2017-06-22

Applicant: CORNING INCORPORATED

Inventor： Daniel Wayne Levesque, JR. ,  Garrett Andrew Piech ,  Aric Bruce Shorey

IPC: H01L23/48 ,  B81C1/00 ,  H01L21/268 ,  H01L21/683 ,  H01L21/311 ,  B81B7/00 ,  H01L21/762 ,  H01L21/768 ,  H01L21/306

CPC classification number: H01L23/481 ,  B81B7/0006 ,  B81B2207/096 ,  B81C1/00301 ,  B81C2201/013 ,  B81C2201/0143 ,  B81C2203/031 ,  H01L21/268 ,  H01L21/30604 ,  H01L21/31105 ,  H01L21/31111 ,  H01L21/486 ,  H01L21/6835 ,  H01L21/76251 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/49827 ,  H01L2221/68359

Abstract: A process comprises bonding a semiconductor wafer to an inorganic wafer. The semiconductor wafer is opaque to a wavelength of light to which the inorganic wafer is transparent. After the bonding, a damage track is formed in the inorganic wafer using a laser that emits the wavelength of light. The damage track in the inorganic wafer is enlarged to form a hole through the inorganic wafer by etching. The hole terminates at an interface between the semiconductor wafer and the inorganic wafer. An article is also provided, comprising a semiconductor wafer bonded to an inorganic wafer. The semiconductor wafer is opaque to a wavelength of light to which the inorganic wafer is transparent. The inorganic wafer has a hole formed through the inorganic wafer. The hole terminates at an interface between the semiconductor wafer and the inorganic wafer.

公开(公告)号：US09676167B2

公开(公告)日：2017-06-13

申请号：US14529976

申请日：2014-10-31

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Garrett Andrew Piech ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: B32B3/00 ,  B32B17/06 ,  C03B33/02 ,  B23K26/00 ,  B23K26/06 ,  B23K26/073 ,  B23K26/0622 ,  B23K103/00

CPC classification number: C03B33/0222 ,  B23K26/0006 ,  B23K26/0613 ,  B23K26/0624 ,  B23K26/0738 ,  B23K26/40 ,  B23K26/53 ,  B23K26/55 ,  B23K2103/50 ,  B32B17/06 ,  B32B2250/02 ,  B32B2315/02 ,  Y02P40/57 ,  Y10T428/21 ,  Y10T428/24273 ,  Y10T428/24355

Abstract: A method of laser processing a material to form a separated part. The method includes focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction, directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a hole or fault line along the laser beam focal line within the material, and directing a defocused carbon dioxide (CO2) laser from a distal edge of the material over the plurality of holes to a proximal edge of the material.

公开(公告)号：US09517963B2

公开(公告)日：2016-12-13

申请号：US14535754

申请日：2014-11-07

Applicant: CORNING INCORPORATED

Inventor： Sasha Marjanovic ,  Garrett Andrew Piech ,  Shyamala Shanmugam ,  Carlos Alberto Pons Siepermann ,  Sergio Tsuda ,  Zsigmond Varga ,  Robert Stephen Wagner

IPC: B32B3/24 ,  C03B33/09 ,  C03C15/00 ,  B32B17/06 ,  C03C17/00 ,  B23K26/06 ,  B23K26/38 ,  C03B33/02 ,  B23K26/00

CPC classification number: B23K26/384 ,  B23K26/04 ,  B23K26/0613 ,  B23K26/0617 ,  B23K26/0624 ,  B23K26/38 ,  B23K26/402 ,  B23K26/53 ,  B23K26/55 ,  B23K2103/50 ,  B32B17/064 ,  C03B33/0222 ,  C03B33/091 ,  C03C15/00 ,  C03C17/00 ,  C03C2217/70 ,  C09K13/00 ,  Y02P40/57 ,  Y10T428/24273 ,  Y10T428/24322

Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.

Abstract translation: 在材料中形成的孔包括将脉冲激光束聚焦到沿着光束传播方向定向的激光束焦线并被引导到材料中，激光束焦线在材料内产生诱导吸收，诱导吸收产生沿着 材料内的激光束焦线，并且相对于彼此平移材料和激光束，从而在材料中形成多条缺陷线，并在酸溶液中蚀刻材料以产生直径大于1微米的孔 通过扩大材料中的缺陷线。 玻璃制品包括一叠玻璃基底，其具有延伸穿过该叠层的1-100微米直径的形成的孔。

公开(公告)号：US20160279895A1

公开(公告)日：2016-09-29

申请号：US15078097

申请日：2016-03-23

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Garrett Andrew Piech ,  Kristopher Allen Wieland

IPC: B32B3/26 ,  B32B17/06

Abstract: A gas permeable glass window, suitable for use with liquid interface additive manufacturing, has an optically transparent glass article greater than about 0.5 millimeters in thickness defining a first surface and a second surface. A plurality of gas channels are disposed through the article from the first surface to the second surface. The gas channels occupy less than about 1.0% of a surface area of the article and are configured such that the article has a gas permeability between about 10 barrers and about 2000 barrers.

Abstract translation: 适用于液界面添加剂制造的透气玻璃窗具有大于约0.5毫米厚度的光学透明玻璃制品，其限定第一表面和第二表面。 多个气体通道穿过物品从第一表面到第二表面设置。 气体通道占据制品的表面积的约1.0％，并且构造成使得制品的气体渗透性介于约10巴与约2000巴之间。

公开(公告)号：US20150166391A1

公开(公告)日：2015-06-18

申请号：US14530244

申请日：2014-10-31

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Garrett Andrew Piech ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: C03B33/02 ,  B32B7/02 ,  B32B17/00

CPC classification number: B23K26/0057 ,  B23K26/0006 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/359 ,  B23K26/402 ,  B23K26/53 ,  B23K26/55 ,  B23K26/57 ,  B23K2103/172 ,  B23K2103/50 ,  B23K2103/54 ,  B32B7/02 ,  B32B17/00 ,  B32B2457/20 ,  C03B17/02 ,  C03B17/064 ,  C03B25/087 ,  C03B29/10 ,  C03B33/0215 ,  C03B33/0222 ,  C03B33/07 ,  C03B33/091 ,  Y02P40/57 ,  Y10T428/15 ,  Y10T428/24777

Abstract: The present disclosure relates to a process for cutting and separating arbitrary shapes of thin substrates of transparent materials, particularly tailored composite fusion drawn glass sheets, and the disclosure also relates to a glass article prepared by the method. The developed laser method can be tailored for manual separation of the parts from the panel or full laser separation by thermally stressing the desired profile. The self-separation method involves the utilization of an ultra-short pulse laser that can be followed by a CO2 laser (coupled with high pressure air flow) for fully automated separation.

Abstract translation: 本公开涉及一种用于切割和分离任意形状的透明材料的薄基板，特别是定制的复合融合拉制玻璃板的方法，并且本公开还涉及通过该方法制备的玻璃制品。 开发的激光方法可以通过热应力所需的轮廓来定制，从面板手动分离零件或完全激光分离。 自分离方法涉及利用可以跟随CO 2激光器（与高压空气流耦合）以实现全自动分离的超短脉冲激光器。