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公开(公告)号：US06917056B2
公开(公告)日：2005-07-12
申请号：US10066299
申请日：2002-01-31
CPC分类号： G02B6/3636 , G02B6/3652 , G02B6/3692 , G02B6/4228 , H01L31/02325 , H01S5/02252 , H01S5/02284
摘要： An optoelectronic submount for providing optical connection and electrical connection to a vertically communicating optical device, such as a vertical cavity surface-emitting laser. The submount has a trench for holding the optoelectronic device on-edge, and electrical connection pits adjoining the trench. A metallization layer is disposed in the electrical connection pits. The electrical connection pits are aligned with the trench and optoelectronic device so that compact pads on the optoelectronic device can be soldered to the metallization layer. A groove can be provided in the submount for holding an optical fiber in alignment with an active area of the optoelectronic device.
摘要翻译： 一种光电子基座，用于提供与竖直连通的光学装置（例如垂直腔表面发射激光器）的光学连接和电连接。 底座具有用于将光电子器件保持在边缘上的沟槽，并且与沟槽相邻的电连接凹坑。 金属化层设置在电连接凹坑中。 电连接凹坑与沟槽和光电子器件对准，使得光电子器件上的紧凑焊盘可以焊接到金属化层。 可以在底座中设置一个槽，用于保持与光电子器件的有效区域对准的光纤。
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公开(公告)号：US06902098B2
公开(公告)日：2005-06-07
申请号：US10126491
申请日：2002-04-19
IPC分类号： B23K35/00 , B23K35/28 , B23K35/30 , H01L21/60 , H01L23/485 , H05K3/34 , B23K31/00 , H01L21/44
CPC分类号： H01L24/13 , B23K35/007 , B23K35/28 , B23K35/30 , B23K35/3013 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01032 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H05K3/3463 , H01L2924/00
摘要： A device including a first solder pad and a second solder pad comprised of a post-soldering alloy composition on a substrate is provided. The alloy composition comprises two or more elements, and the post soldering alloy composition of the first solder pad has different amounts of the two or more elements than the alloy composition of the second solder pad. A method of making a solder pad comprises masking a substrate comprising at least a first solder pad and a second solder pad, wherein the mask exposes a greater area of the first solder pad so that the deposited element becomes part of an alloy composition of the first solder pad upon soldering thereby changing the melting point of the first solder pad.
摘要翻译： 提供了一种包括第一焊盘和在衬底上由焊后合金组合物组成的第二焊盘的装置。 该合金组合物包含两种或更多种元素，并且第一焊盘的后焊合金组合物与第二焊垫的合金组成不同的两种或更多种元素的量。 制造焊料焊盘的方法包括：掩蔽包含至少第一焊料焊盘和第二焊料焊盘的衬底，其中所述掩模暴露所述第一焊盘的较大面积，使得所沉积的元件成为所述第一焊盘 在焊接时焊锡垫，从而改变第一焊盘的熔点。
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公开(公告)号：US06549550B2
公开(公告)日：2003-04-15
申请号：US09781995
申请日：2001-02-14
IPC分类号： H01S304
CPC分类号： H01S5/02208 , G02B6/4204 , G02B6/4266 , G02B6/4271 , G02B6/4273 , G02B6/4274 , H01L35/00 , H01S5/02276 , H01S5/02284 , H01S5/02415 , H01S5/042
摘要： Flexible ground connectors are adapted to withstand temperature-induced stresses. The connectors may be formed of low thermal conductivity materials. The connectors may be used within a semiconductor package that also encloses a thermoelectric cooling device, a conductive submount, and a semiconductor light source. The submount may be grounded to the package wall by locating a pair of the flexible ground connectors across a gap to a ledge in the wall. The ground connectors may be formed of stainless steel, and they may be gold plated for improved electrical conductivity.
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公开(公告)号：US06277206B1
公开(公告)日：2001-08-21
申请号：US09366347
申请日：1999-08-02
IPC分类号： B08B700
CPC分类号： H01L21/67138 , B23K1/018 , B23K2101/40
摘要： A method for unblocking a vacuum collet channel clogged with solder includes moving a solder-clogged collet into contact with a preform of solder, and melting the solder clog and the preform into a single melted mass, cooling the melted mass to solidify it, and moving the collet away from the cooled mass, leaving the clog behind.
摘要翻译： 用于阻止由焊料堵塞的真空夹头通道的方法包括将焊料堵塞的夹头移动与焊料预成型件接触，并将焊料堵塞和预成型件熔化成单个熔化的质量，冷却熔化的质量以使其固化并移动 夹头远离冷却的质量，留下堵塞。
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公开(公告)号：US4946236A
公开(公告)日：1990-08-07
申请号：US358912
申请日：1989-05-30
申请人： Mindaugas F. Dautartas , Yinon Degani , Richard T. Kraetsch , Richard J. Pimpinella , King L. Tai
发明人： Mindaugas F. Dautartas , Yinon Degani , Richard T. Kraetsch , Richard J. Pimpinella , King L. Tai
CPC分类号： G02B6/3508 , G02B6/3558 , G02B6/3562 , G02B6/3572
摘要： An m-input/n-output (e.g., 2.times.2) optical fiber switch is disclosed which alters the location of the fibers by the application of an external force. Illustratively, the switch uses a housing with a diamond-shaped opening extending therethrough, with pairs of optical fibers positioned in orthogonally located V-grooves. Upon the application of an external force, the fibers are moved into the remaining, vacant V-grooves formed by the diamond-shaped opening. In a preferred embodiment, a (2.times.2) switch is magnetically activated.
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公开(公告)号：US06427901B2
公开(公告)日：2002-08-06
申请号：US09774850
申请日：2001-01-31
IPC分类号： B23K3102
CPC分类号： H05K3/341 , B23K1/0016 , B23K35/3013 , B23K2101/36 , B23K2101/42 , H05K1/111 , H05K3/3436 , H05K2201/09036 , H05K2201/09427 , H05K2201/09472 , H05K2203/0465 , H05K2203/048 , Y02P70/613
摘要： A solder bonding system that includes a substrate having a recess and a conductive pad having a width. The conductive pad is disposed in the recess of the substrate. The solder bonding system also includes a solder pad contacting the conductive pad. The solder pad has a width greater than the width of the conductive pad. When the solder pad is heated, it forms a stable solder bond between the conductive pads.
摘要翻译： 一种焊接接合系统，其包括具有凹部的基板和具有宽度的导电焊盘。 导电焊盘设置在基板的凹部中。 焊接接合系统还包括与导电焊盘接触的焊盘。 焊盘的宽度大于导电焊盘的宽度。 当焊盘被加热时，它在导电焊盘之间形成稳定的焊料接合。
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27.发明授权Method and apparatus for passively aligning components on semiconductor dies 失效用于半导体管芯上被动对准元件的方法和装置公开(公告)号：US06265240B1
公开(公告)日：2001-07-24
申请号：US09047014
申请日：1998-03-24
IPC分类号： H01L2100
CPC分类号： H01L31/12 , G02B6/4227 , G02B6/4228
摘要： A method and apparatus for passively aligning an optical element on an optical die wherein multiple potential mounting pads are supplied for potential mounting of the optical component. Appropriate tables are generated for 1) the response of the optical detecting component for a given light power level as a function of the mounting position of the optical detecting component, and 2) the asymmetry of the light generating component. Given the two tables an algorithm is prepared for automatically determining the appropriate mounting position to provide desired detection device response characteristics for any given light generating component to be mounted on the die.
摘要翻译： 一种用于被动地对准光学裸片上的光学元件的方法和装置，其中提供多个潜在的安装焊盘用于光学部件的潜在安装。 产生适当的表格，用于1）光学检测部件对于给定光功率电平的响应作为光学检测部件的安装位置的函数，以及2）光产生部件的不对称性。 给定两个表，准备一种算法来自动确定适当的安装位置，以便为要安装在管芯上的任何给定的光产生部件提供所需的检测装置响应特性。
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28.发明授权公开(公告)号：US06514791B2
公开(公告)日：2003-02-04
申请号：US09790526
申请日：2001-02-23
IPC分类号： H01L2144
CPC分类号： H01L35/34
摘要： A system and method for fabricating a thermoelectric cooling (TEC) device and a semiconductor device using such a TEC device are described. Adhesive-containing support structures are used to secure, respectively, positively-doped and negatively-doped TEC elements. The elements are intermeshed and an encapsulating material is applied to the intermeshed array. The support structures are then released and the ends of the encapsulated elements are smoothed and electrically coupled together. If desired, panels are secured to the ends of the elements and a heat sink may also be provided. The TEC device may be used to control and/or tune a laser device.
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公开(公告)号：US06404566B1
公开(公告)日：2002-06-11
申请号：US09542937
申请日：2000-04-04
IPC分类号： G02B702
CPC分类号： G02B6/4239 , H01L23/13 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/2919 , H01L2224/32057 , H01L2224/8314 , H01L2224/83192 , H01L2224/83385 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01033 , H01L2924/01057 , H01L2924/01058 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/00
摘要： A method and apparatus for mounting optical elements onto an optical device are described. A mounting structure is produced out of a carrier substrate. The mounting structure includes one or more walls defining a well and surrounding a plurality of protrusions. The well defined by the walls is filled with an adhesive material system, such as epoxy. An optical device is lowered into contact with the epoxy, and then into contact with the protrusions. The displaced epoxy is displaced through one or more conduits into one or more reservoirs. A plurality of such mounting structures enables one to align a plurality of optical elements together in a single plane.
摘要翻译： 描述了将光学元件安装到光学装置上的方法和装置。 由载体基板制成安装结构。 安装结构包括一个或多个限定井并围绕多个突起的壁。 由壁限定的井用诸如环氧树脂的粘合剂材料系统填充。 将光学装置降低成与环氧树脂接触，然后与突起接触。 位移的环氧树脂通过一个或多个管道移动到一个或多个储存器中。 多个这样的安装结构使得能够在单个平面中将多个光学元件对准在一起。
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公开(公告)号：US06189238B1
公开(公告)日：2001-02-20
申请号：US09201526
申请日：1998-11-30
申请人： Mindaugas F. Dautartas , Ofer Sneh
发明人： Mindaugas F. Dautartas , Ofer Sneh
IPC分类号： F26B300
CPC分类号： H01L21/67386 , H01L21/67017 , H01L21/67393
摘要： A portable purge system for transporting materials, such as semiconductor wafers used in the manufacture of ICs, comprises a carrier having compartments for releasably receiving and enclosing the materials therein. The carrier is flooded with an inert gas such as nitrogen so as to adsorb the nitrogen on the surface of the materials, dilute contaminants, and purge the contaminants from the carrier. The carrier and the flooding means are mounted in a transport case. A humidifier is connected to the flooding means so that the materials will adsorb water and thereby further resist adsorption of hydrocarbon contaminants.
摘要翻译： 用于运输诸如用于制造IC的半导体晶片的材料的便携式吹扫系统包括具有用于可释放地接收和封闭材料的隔室的载体。 载体上充满惰性气体如氮气，以吸附材料表面的氮气，稀释污染物，并从载体上清除污染物。 载体和淹没装置安装在运输箱中。 加湿器连接到淹水装置，使得材料将吸附水，从而进一步阻止烃污染物的吸附。
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