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公开(公告)号：US11180853B2
公开(公告)日：2021-11-23
申请号：US16559251
申请日：2019-09-03
Applicant: Ebara Corporation
Inventor： Yu Ishii , Fong-Jie Du , Makoto Kashiwagi
IPC: H01L21/68 , C23C16/458 , C23C16/52 , B24B21/00 , B24B9/06 , B24B37/30 , B24B37/005
Abstract: There is disclosed a substrate processing apparatus which can align a center of a substrate, such as a wafer, with a central axis of a substrate stage with high accuracy. The substrate processing apparatus includes: an eccentricity detector configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, when held on a centering stage, from a central axis of the centering stage; and an aligner configured to perform a centering operation of moving and rotating the centering stage until the center of the substrate on the centering stage is located on a central axis of a processing stage. The aligner is configured to calculate a distance by which the centering stage is to be moved and an angle through which the centering stage is to be rotated, based on an initial relative position of the central axis of the centering stage with respect to the central axis of the processing stage, the amount of eccentricity, and the eccentricity direction.
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公开(公告)号：US10926376B2
公开(公告)日：2021-02-23
申请号：US16003779
申请日：2018-06-08
Applicant: Ebara Corporation
Inventor： Masayuki Nakanishi , Yu Ishii , Kenya Ito , Keisuke Uchiyama , Makoto Kashiwagi
Abstract: A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.
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公开(公告)号：US09821429B2
公开(公告)日：2017-11-21
申请号：US13891702
申请日：2013-05-10
Applicant: EBARA CORPORATION
Inventor： Yu Ishii , Kenya Ito , Shozo Takahashi , Mika Suzuki
IPC: B24B37/005 , B24B37/10 , B24B37/30 , B24B37/04 , B24B37/24
CPC classification number: B24B37/005 , B24B37/042 , B24B37/10 , B24B37/24 , B24B37/30
Abstract: A polishing pad for polishing a workpiece to a mirror finish is attached to a rotatable polishing table of a chemical mechanical polishing apparatus. The workpiece, such as a metal body, is held by a carrier and pressed against the polishing pad. This polishing pad includes: an elastic pad having a polishing surface; a deformable base layer that supports the elastic pad; and an adhesive layer that joins the elastic pad to the base layer.
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公开(公告)号：US20130213437A1
公开(公告)日：2013-08-22
申请号：US13772031
申请日：2013-02-20
Applicant: Ebara Corporation , Kabushiki Kaisha Toshiba
Inventor： Yu Ishii , Hiroyuki Kawasaki , Kenichi Nagaoka , Kenya Ito , Masako Kodera , Hiroshi Tomita , Takeshi Nishioka
IPC: B08B1/00
CPC classification number: B08B1/001 , H01L21/67046 , H01L21/67051 , H01L21/68728
Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.
Abstract translation: 基板处理装置以高的去除效率从基板中去除异物。 基板处理装置包括：洗涤器，其通过使洗涤部件与基板的第一表面滑动接触来进行基板的表面处理;流体静力支撑机构，用于经由流体压力而不接触基板来支撑基板的第二表面 所述第二表面是所述第一表面的相对表面，用于清洁所述经处理的基底的清洁剂以及用于干燥所述经清洁的基底的干燥器。 洗涤器使洗涤构件与第一表面滑动接触，同时围绕洗涤器的中心轴旋转洗涤构件。
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公开(公告)号：US11618123B2
公开(公告)日：2023-04-04
申请号：US17072870
申请日：2020-10-16
Applicant: EBARA CORPORATION
Inventor： Yu Ishii , Tetsuji Togawa , Atsushi Yoshida
IPC: B24B37/005 , B24B49/16
Abstract: A polishing method capable of accurately determining a polishing end point of a substrate is disclosed. The method comprises: rotating a polishing table supporting a polishing pad; and polishing the substrate by pressing the substrate against a polishing surface of the polishing pad by a polishing head, wherein polishing the substrate includes: an oscillation polishing process of polishing the substrate while causing the polishing head to oscillate along the polishing surface; and a static polishing process of polishing the substrate with the oscillation of the polishing head stopped, the static polishing process is performed after the oscillation polishing process, and the static polishing process comprises determining a static polishing end point which is a point in time at which a rate of change of torque for rotating the polishing table has reached a change-rate threshold value.
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Patent Agency Ranking
公开(公告)号：US11511389B2
公开(公告)日：2022-11-29
申请号：US16575844
申请日：2019-09-19
Applicant: EBARA CORPORATION
Inventor： Kenichi Akazawa , Makoto Kashiwagi , Yu Ishii , Atsushi Yoshida , Kenichi Kobayashi , Tetsuji Togawa , Hozumi Yasuda
Abstract: Disclosed is a polishing head for a polishing apparatus for polishing a quadrangular substrate using a polishing pad attached to a polishing table, comprising a head body portion, a plurality of elastic bags disposed in a surface of the head body portion, which is to face the polishing table, and a substrate holding plate for holding the substrate, the substrate holding plate being pressed by the elastic bags in a direction away from the head body portion, the head body portion being provided with channels for bags, which are in communication with the respective elastic bags, the polishing head further including at least two support plates disposed between the elastic bags on one hand and the substrate holding plate on the other, the elastic bags being configured to press the substrate holding plate through the support plates.
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公开(公告)号：US11192147B2
公开(公告)日：2021-12-07
申请号：US16405631
申请日：2019-05-07
Applicant: EBARA CORPORATION
Inventor： Yu Ishii , Hiroyuki Kawasaki , Kenichi Nagaoka , Kenya Ito
IPC: B08B1/00 , H01L21/67 , H01L21/687
Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.
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公开(公告)号：US10458020B2
公开(公告)日：2019-10-29
申请号：US15095330
申请日：2016-04-11
Applicant: Ebara Corporation
Inventor： Yu Ishii , Fong-Jie Du , Makoto Kashiwagi
IPC: H01L21/68 , B24B9/06 , C23C16/458 , C23C16/52 , B24B21/00 , B24B37/30 , B24B37/005
Abstract: There is disclosed a substrate processing apparatus which can align a center of a substrate, such as a wafer, with a central axis of a substrate stage with high accuracy. The substrate processing apparatus includes: an eccentricity detector configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, when held on a centering stage, from a central axis of the centering stage; and an aligner configured to perform a centering operation of moving and rotating the centering stage until the center of the substrate on the centering stage is located on a central axis of a processing stage. The aligner is configured to calculate a distance by which the centering stage is to be moved and an angle through which the centering stage is to be rotated, based on an initial relative position of the central axis of the centering stage with respect to the central axis of the processing stage, the amount of eccentricity, and the eccentricity direction.
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公开(公告)号：US20190262870A1
公开(公告)日：2019-08-29
申请号：US16405631
申请日：2019-05-07
Applicant: EBARA CORPORATION
Inventor： Yu Ishii , Hiroyuki Kawasaki , Kenichi Nagaoka , Kenya Ito , Masako Kodera , Hiroshi Tomita , Takeshi Nishioka
IPC: B08B1/00 , H01L21/67 , H01L21/687
Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.
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公开(公告)号：US10328465B2
公开(公告)日：2019-06-25
申请号：US13772031
申请日：2013-02-20
Applicant: Ebara Corporation , TOSHIBA MEMORY CORPORATION
Inventor： Yu Ishii , Hiroyuki Kawasaki , Kenichi Nagaoka , Kenya Ito , Masako Kodera , Hiroshi Tomita , Takeshi Nishioka
IPC: B08B1/00 , H01L21/67 , H01L21/687
Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.
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