Chemical mechanical polishing compositions, and process for the CMP removal of iridium thin using same
    22.
    发明授权
    Chemical mechanical polishing compositions, and process for the CMP removal of iridium thin using same 失效
    化学机械抛光组合物,以及使用其去除铱薄膜的CMP的方法

    公开(公告)号:US06395194B1

    公开(公告)日:2002-05-28

    申请号:US09216679

    申请日:1998-12-18

    IPC分类号: C09K1300

    摘要: A method of removing noble metal material from a substrate having the noble metal material deposited thereon, such as a semiconductor device structure including thereon a layer of the noble metal material, e.g., iridium, patterned for use as an electrode. The substrate is subjected to chemical mechanical polishing with a chemical mechanical polishing composition containing abrasive polishing particles and a halide-based oxidizing agent. The CMP composition and method of the invention provide efficient planarization and noble metal material removal from the substrate, in applications such as the fabrication of ferroelectric or high permittivity capacitor devices.

    摘要翻译: 从其上沉积有贵金属材料的基板去除贵金属材料的方法,例如在其上包括图案化为电极的贵金属材料(例如铱)的层的半导体器件结构。 用含有研磨抛光颗粒和卤化物基氧化剂的化学机械抛光组合物对衬底进行化学机械抛光。 本发明的CMP组合物和方法在诸如铁电或高介电常数电容器器件的制造等应用中提供了有效的平面化和从衬底去除贵金属材料。

    Compositions and structures for chemical mechanical polishing of FeRAM capacitors and method of fabricating FeRAM capacitors using same
    23.
    发明授权
    Compositions and structures for chemical mechanical polishing of FeRAM capacitors and method of fabricating FeRAM capacitors using same 有权
    FeRAM电容器的化学机械抛光的组成和结构以及使用其制造FeRAM电容器的方法

    公开(公告)号:US06346741B1

    公开(公告)日:2002-02-12

    申请号:US09200499

    申请日:1998-11-25

    IPC分类号: H01L2940

    摘要: An integrated circuit structures formed by chemical mechanical polishing (CMP) process, which comprises a conductive pathway recessed in a dielectric substrate, wherein the conductive pathway comprises conductive transmission lines encapsulated in a transmission-enhancement material, and wherein the conductive pathway is filled sequentially by a first layer of the transmission-enhancement material followed by the conductive transmission line; a second layer of transmission-enhancement material encapsulating the conductive transmission line and contacting the first layer of the transmission-enhancement material, wherein the transmission-enhancement material is selected from the group consisting of high magnetic permeability material and high permittivity material. Such integrated circuit structure may comprise a device structure selected from the group consisting of capacitors, inductors, and resistors. Preferably, the transmission-enhancement material comprises MgMn ferrites, MgMnAl ferrites, barium strontium titanate, lead zirconium titanate, titanium oxide, tantalum oxide, etc.

    摘要翻译: 通过化学机械抛光(CMP)工艺形成的集成电路结构,其包括凹入电介质基底中的导电通路,其中导电路径包括封装在透射增强材料中的导电传输线,并且其中导电通路依次由 传输增强材料的第一层,随后是导电传输线; 传输增强材料的第二层,其封装所述导电传输线并与所述透射增强材料的第一层接触,其中所述透射增强材料选自高磁导率材料和高介电常数材料。 这种集成电路结构可以包括从由电容器,电感器和电阻器组成的组中选择的器件结构。 优选地,透射增强材料包括MgMn铁氧体,MgMnAl铁氧体,钛酸锶钡,钛酸铅锆,氧化钛,氧化钽等

    Confinement of E-fields in high density ferroelectric memory device structures
    24.
    发明授权
    Confinement of E-fields in high density ferroelectric memory device structures 失效
    限制高密度铁电存储器件结构中的电场

    公开(公告)号:US06342711B1

    公开(公告)日:2002-01-29

    申请号:US09264047

    申请日:1999-03-08

    IPC分类号: H01L2976

    摘要: A ferroelectric capacitor device structure, including a ferroelectric stack capacitor comprising a ferroelectric material capacitor element on a substrate containing buried transistor circuitry beneath an insulator layer having a via therein containing a conductive plug to the transistor circuitry, wherein E-fields are structurally confined to the ferroelectric capacitor material element. Such E-fields confinement may be effected by fabrication of the device structure including: (a) patterning the stack capacitor, and depositing a non-ferroelectric, high ∈ material layer over and on the sides of the stack capacitor; (b) forming the stack capacitor without patterning the ferroelectric material and rendering a portion of the material non-ferroelectric in character; or (c) forming the ferroelectric stack capacitor with an aspect ratio, of effective lateral dimension d of the ferroelectric capacitor material element to thickness t of the ferroelectric capacitor material element, that is greater than 5, with d and t being measured in same dimensional units.

    摘要翻译: 一种强电介质电容器器件结构,包括铁电堆叠电容器,该铁电体堆叠电容器包括位于绝缘体层下方的包含埋入晶体管电路的衬底上的铁电材料电容器元件,所述绝缘体层具有其中包含导体插塞到晶体管电路的通孔,其中电场被结构地局限于 铁电电容材料元件。 这样的电场限制可以通过制造器件结构来实现,该器件结构包括:(a)图案化叠层电容器,并且在堆叠电容器的侧面上和之上沉积非铁电的高ε材料层; (b)形成堆叠电容器,而不对铁电材料进行构图,并使材料的一部分非铁电性能; 或(c)形成强电介质电容器材料元素的有效横向尺寸d与铁电电容器材料元件的厚度t的长宽比大于5的铁电堆叠电容器,其中d和t以相同的尺寸被测量 单位。

    Photocatalytic devices and systems
    27.
    发明授权
    Photocatalytic devices and systems 有权
    光催化装置和系统

    公开(公告)号:US09480766B2

    公开(公告)日:2016-11-01

    申请号:US14520321

    申请日:2014-10-21

    摘要: Novel photocatalytic devices are disclosed, that utilize ultrathin titania based photocatalytic materials formed on optical elements with high transmissivity, high reflectivity or scattering characteristics, or on high surface area or high porosity open cell materials. The disclosure includes methods to fabricate such devices, including MOCVD and ALD. The disclosure also includes photocatalytic systems that are either standalone or combined with general illumination (lighting) utility, and which may incorporate passive fluid exchange, user configurable photocatalytic optical elements, photocatalytic illumination achieved either by the general illumination light source, dedicated blue or UV light sources, or combinations thereof, and operating methodologies for combined photocatalytic and lighting systems. The disclosure also includes photocatalytic materials incorporated on the surface of packaged LEDs, LED lamps and LED luminaires, with photocatalytic materials incorporated on optically useful luminaire surfaces or on the surface of the remote phosphor. The disclosure also includes ultrathin photocatalytic materials incorporated on surfaces to affect antibacterial and antiviral properties.

    摘要翻译: 公开了新型光催化装置,其利用形成在具有高透射率,高反射率或散射特性的光学元件上形成的超薄二氧化钛基光催化材料,或在高表面积或高孔隙率开孔材料上。 本公开包括制造这样的装置的方法,包括MOCVD和ALD。 本公开还包括独立的或与一般照明(照明)实用程序组合的光催化体系,其可以包括无源流体交换,用户可配置的光催化光学元件,通过一般照明光源,专用蓝光或UV光实现的光催化照明 来源或其组合,以及组合的光催化和照明系统的操作方法。 本公开还包括结合在封装的LED,LED灯和LED灯具的表面上的光催化材料,其中光催化材料结合在光学上有用的照明器表面上或在远程荧光体的表面上。 本公开还包括掺入表面的超薄光催化材料以影响抗菌和抗病毒性质。

    PHOTOCATALYTIC THIN FILM DEVICES
    28.
    发明申请
    PHOTOCATALYTIC THIN FILM DEVICES 审中-公开
    光电薄膜装置

    公开(公告)号:US20150111725A1

    公开(公告)日:2015-04-23

    申请号:US14520328

    申请日:2014-10-21

    IPC分类号: B01J21/06

    摘要: Novel photocatalytic devices are disclosed, that utilize ultrathin titania based photocatalytic materials formed on optical elements with high transmissivity, high reflectivity or scattering characteristics, or on high surface area or high porosity open cell materials. The disclosure includes methods to fabricate such devices, including MOCVD and ALD. The disclosure also includes photocatalytic systems that are either standalone or combined with general illumination (lighting) utility, and which may incorporate passive fluid exchange, user configurable photocatalytic optical elements, photocatalytic illumination achieved either by the general illumination light source, dedicated blue or UV light sources, or combinations thereof, and operating methodologies for combined photocatalytic and lighting systems. The disclosure also includes photocatalytic materials incorporated on the surface of packaged LEDs, LED lamps and LED luminaires, with photocatalytic materials incorporated on optically useful luminaire surfaces or on the surface of the remote phosphor. The disclosure also includes ultrathin photocatalytic materials incorporated on surfaces to affect antibacterial and antiviral properties.

    摘要翻译: 公开了新型光催化装置,其利用形成在具有高透射率,高反射率或散射特性的光学元件上形成的超薄二氧化钛基光催化材料,或在高表面积或高孔隙率开孔材料上。 本公开包括制造这样的装置的方法,包括MOCVD和ALD。 本公开还包括独立的或与一般照明(照明)实用程序组合的光催化体系,其可以包括无源流体交换,用户可配置的光催化光学元件,通过一般照明光源,专用蓝光或UV光实现的光催化照明 来源或其组合,以及组合的光催化和照明系统的操作方法。 本公开还包括结合在封装的LED,LED灯和LED灯具的表面上的光催化材料,其中光催化材料结合在光学上有用的照明器表面上或在远程荧光体的表面上。 本公开还包括掺入表面的超薄光催化材料以影响抗菌和抗病毒性质。