Abstract:
An overspeed system for a vehicle is disclosed. The overspeed system may have a power source, a transmission unit, and a torque converter assembly operatively coupling the power source to the transmission unit. The overspeed system may also have a travel speed sensor configured to generate a signal indicative of a vehicle speed, and a controller in communication with the torque converter assembly and the travel speed sensor. The controller may be configured to prevent a decoupling of the torque converter assembly in response to the signal.
Abstract:
The invention relates to leadframe semiconductor packages mounted on a heat-sink and fabrication thereof. A system in package (SiP) comprises a leadframe having extension leads, configured with divisional heat sinks serving as power and ground nets. A set of semiconductor dies is attached by adhesive on the central region of the lead frame. Pluralities of wire bonds electrically connect the set of semiconductor dies to the leadframe and to the divisional heat sinks respectively. An encapsulation encloses the leadframe, but leaves the extension leads and the divisional heat sink uncovered, exposing a heat dissipating surface.
Abstract:
A control system for a skid steer vehicle reads a load height sensor, a load amount sensor, and a vehicle speed sensor to derate the otherwise commanded acceleration, deceleration and turning rate on the vehicle when the vehicle has too great a load, too high a load, or the vehicle is going too fast.
Abstract:
A skid steer vehicle has sprung suspensions that can be locked to prevent vertical movement with respect to the chassis of the vehicle. The operator controls include a switch that the operator can manipulate to lock the suspensions on command. The switch is mounted on a joystick that is used to perform other vehicle functions such as moving the vehicle, raising loader arms, or tilting the bucket or other implement attached to the loader arms. The switch is located on the joystick such that the operator can manipulate the switch without having to remove his hands from the joystick.
Abstract:
A skid steer vehicle has sprung suspensions, variable displacement pumps and motors connected to those pumps that drive the wheels on the vehicle as well as an electronic controller that receives signals that indicate lateral acceleration of the skid steer vehicle during turns. The controller determines whether the lateral acceleration exceeds a predetermined value, and locks up the outboard suspensions if that value is exceeded. The signals can be provided by an accelerometer, a satellite receiver, wheel/motor speed sensors, sensors in the pumps that signal the specific displacement of the pumps (such as their swash plate position, or memory locations that contain previously calculated specific displacement commands that are used to drive the pumps to a particular displacement.
Abstract:
A hydraulic implement system for a machine is disclosed. The hydraulic implement system may have a boom member, a boom actuator, and a boom operator control device movable to indicate a related operator desired boom member velocity. The hydraulic implement system may also have an implement pivotally connected to the boom member, an implement actuator, and an implement operator control device movable to indicated a related operator desired implement velocity. The range of the implement operator control device may be divided into a first portion and a second portion. The hydraulic implement system may also have a controller configured to selectively limit a velocity of the implement during manipulation of the implement operator control device within the first portion such that a lift velocity of the boom member of at least 65% of the desired boom member velocity is always possible.
Abstract:
A leadframe package includes a die pad with four unitary, outwardly extending slender bars; a plurality of leads arranged along periphery of the die pad; a separate pad segment separated from the die pad and isolated from the plurality of leads; a semiconductor die mounted on an upper side of the die pad, wherein the semiconductor die contains first bond pads wire-bonded to respective the plurality of leads and a second bond pad wire-bonded to the separate pad segment; and a molding compound encapsulating the semiconductor die, the upper side of the die pad, the first suspended pad segment and inner portions of the plurality of leads.
Abstract:
An overspeed system for a vehicle is disclosed. The overspeed system may have a power source, a transmission unit, and a torque converter assembly operatively coupling the power source to the transmission unit. The overspeed system may also have a travel speed sensor configured to generate a signal indicative of a vehicle speed, and a controller in communication with the torque converter assembly and the travel speed sensor. The controller may be configured to prevent a decoupling of the torque converter assembly in response to the signal.
Abstract:
Apparatus and methods are provided for controlling a double-acting hydraulic cylinder during a load-induced rod-extending operation. The apparatus includes a activation circuit and valve for providing a flow path from a pump to the cylinder head end; a flow regeneration circuit and valve fluidly connecting the cylinder rod end and the cylinder head end and configured for providing flow from the rod end to the head end during rod extension; and a controller responsive to rod-extending rate demands and rod-position sensor signals, and operatively connected to the regeneration flow valve and the activation valve. The activation valve also includes a return valve part to control flow from the rod end to the fluid reservoir during rod extension. Both the activation valve and the return valve part are controllable by the controller independently from the regeneration flow valve.
Abstract:
A leadframe package includes a die pad with four unitary, outwardly extending slender bars; a plurality of leads arranged along periphery of the die pad; a separate pad segment separated from the die pad and isolated from the plurality of leads; a semiconductor die mounted on an upper side of the die pad, wherein the semiconductor die contains first bond pads wire-bonded to respective the plurality of leads and a second bond pad wire-bonded to the separate pad segment; and a molding compound encapsulating the semiconductor die, the upper side of the die pad, the first suspended pad segment and inner portions of the plurality of leads.