公开(公告)号：US10955877B2

公开(公告)日：2021-03-23

申请号：US16216240

申请日：2018-12-11

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Tim Liu ,  Yihua Lai ,  Lance Lin ,  Gavin Sung

IPC: G06F1/16 ,  G06F3/02 ,  G06F3/0354

Abstract: Apparatus, systems, articles of manufacture, and methods are disclosed for physical keyboards with multi-display computing devices. An example computing device includes a first display and a second display coupled to the first display via a first hinge. The example computing device also includes a keyboard coupled to the second display via a second hinge.

公开(公告)号：US10798235B2

公开(公告)日：2020-10-06

申请号：US16088584

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Simon Tsai ,  Tim Liu ,  Gavin Sung ,  Jeff Ku ,  Simon S. Yuan

IPC: H04M1/23 ,  G06F1/16 ,  H04M1/02 ,  H05K5/00 ,  H05K5/02 ,  H04M1/725

Abstract: A mobile device having an internal frame and a sidebar configured to be coupled to the internal frame. The sidebar can include at least one button positioned in a button configuration on an exterior face of the sidebar and a sidebar contact positioned on an interior face of the sidebar. The sidebar can be positioned to interface with a frame contact when the sidebar is coupled to the internal frame. The frame can be operably coupled to a controller for a mobile device such that coupling the sidebar contact to the frame contact operably connects the at least one button of the sidebar to the controller. The sidebar can be exchanged with or decoupled from the frame and replaced with a second sidebar having a different button configuration from the original sidebar.

公开(公告)号：US20190116253A1

公开(公告)日：2019-04-18

申请号：US16088584

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Simon Tsai ,  Tim Liu ,  Gavin Sung ,  Jeff Ku ,  Simon S. Yuan

IPC: H04M1/23 ,  H04M1/02 ,  G06F1/16 ,  H05K5/02 ,  H05K5/00

CPC classification number: H04M1/236 ,  G06F1/1632 ,  H04M1/0281 ,  H04M1/0283 ,  H04M1/72575 ,  H05K5/0086 ,  H05K5/0221

Abstract: A mobile device having an internal frame and a sidebar configured to be coupled to the internal frame. The sidebar can include at least one button positioned in a button configuration on an exterior face of the sidebar and a sidebar contact positioned on an interior face of the sidebar. The sidebar can be positioned to interface with a frame contact when the sidebar is coupled to the internal frame. The frame can be operably coupled to a controller for a mobile device such that coupling the sidebar contact to the frame contact operably connects the at least one button of the sidebar to the controller. The sidebar can be exchanged with or decoupled from the frame and replaced with a second sidebar having a different button configuration from the original sidebar.

公开(公告)号：US20250133698A1

公开(公告)日：2025-04-24

申请号：US18989639

申请日：2024-12-20

Applicant: Intel Corporation

Inventor： Chi Chou Cheng ,  Jeff Ku ,  Chung Jen Ho ,  Chihtsung Hu ,  Tsung-Kai Lin

IPC: H05K7/20 ,  G06F1/20

Abstract: An electronic device is provided that implements thermally conductive plastic supports that may replace the typical use of “feet” used in conventional electronic devices. The thermally conductive supports may extend through the bottom chassis cover (e.g. the “D cover”) of the electronic device, and be mechanically and thermally coupled to a heat pipe that is in turn coupled to a heat source for which thermal regulation is utilized. The thermally conductive plastic supports may provide a heat path from the heat source to the bottom chassis cover and, when the electronic device is disposed on a surface, an additional heat path may be provided from the heat source to this surface.

公开(公告)号：US20250008680A1

公开(公告)日：2025-01-02

申请号：US18344638

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Min Suet Lim ,  Lance Lin ,  Arnab Sen ,  Jiacheng Wu

IPC: H05K7/20 ,  G06F1/20

Abstract: Thermal management systems for electronic devices and related methods are disclosed. An example electronic device includes a chassis including a first cover and a second cover, the first cover including an upper surface and a plurality of side walls and the second cover including a lower surface of the chassis, the first cover and the second cover defining an internal cavity of the chassis, the first cover including a first device inlet formed in a first side wall of the first cover; a fan positioned in the internal cavity, the fan including a first fan inlet and a second fan inlet opposite the first fan inlet; and a side channel positioned between the first device inlet and the first fan inlet to direct fluid flow between the first device inlet and the first fan inlet.

公开(公告)号：US20240397662A1

公开(公告)日：2024-11-28

申请号：US18200994

申请日：2023-05-23

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Mark McDonald ,  Min Suet Lim ,  Tongyan Zhai ,  Shantanu D. Kulkarni ,  Arnab A. Sen ,  Juha Paavola

IPC: H05K7/20 ,  H05K5/02

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for accessories for electronic devices and removable fan cartridges for electronic devices. An example electronic device accessory includes a backplate panel removably couplable to a first chassis of a first electronic device to replace a portion of a first cover of the first chassis and removably couplable to a second chassis of a second electronic device to replace a portion of a second cover of the second chassis. The example electronic device accessory also includes a mating device to releasably couple the backplate panel to the first chassis and independently releasably couple the backplate panel to the second chassis and a fan coupled to the backplate panel. The fan is to increase a Z height of the first electronic device when the backplate panel is coupled to the first electronic device and increase a Z height of the second electronic device when the backplate panel is coupled to the second electronic device.

公开(公告)号：US20240385654A1

公开(公告)日：2024-11-21

申请号：US18329148

申请日：2023-06-05

Applicant: Intel Corporation

Inventor： Jeff Ku ,  MING-SHENG Tsai ,  Twan Sing Loo ,  Jeffrey Ho ,  Songlin Zhou

IPC: G06F1/16 ,  G06F1/20

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for deploying feet and/or including hinge gaskets to improve thermal solutions and/or acoustic experience with electronic devices. An example electronic device includes a first panel; a second panel; a hinge coupling the first panel and the second panel; a foot coupled to the second panel, the foot movable between a deployed position and a retracted position; a sensor to detect a position of the first panel; and programmable circuitry to execute instructions to cause the foot to be moved between the deployed position and the retracted position based on the position of the first panel.

公开(公告)号：US20240210988A1

公开(公告)日：2024-06-27

申请号：US18129524

申请日：2023-03-31

Applicant: Intel Corporation

Inventor： David Pidwerbecki ,  Arvind S ,  Jeff Ku ,  Juha Tapani Paavola ,  Prakash Kurma Raju ,  Amruta Krishnakumar Ranade ,  Sudheera Sudhakar ,  Mousumi Deka ,  Snehal Chaudhari ,  Akarsha R. Kadadevaramath

IPC: G06F1/16 ,  B32B5/02 ,  B32B5/26 ,  C23C14/20 ,  C23C14/35 ,  C23C16/06

CPC classification number: G06F1/1615 ,  B32B5/02 ,  B32B5/26 ,  C23C14/205 ,  C23C14/35 ,  C23C16/06 ,  B32B2255/02 ,  B32B2255/205 ,  B32B2255/28 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2457/00

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed related to composite materials for electronic device chassis. An example electronic device includes a chassis including a layer of a magnesium alloy or a layer of polyether ether ketone and carbon fiber reinforced plastic and an anodized aluminum coating.

公开(公告)号：US11930620B2

公开(公告)日：2024-03-12

申请号：US16914294

申请日：2020-06-27

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Cora Nien ,  Gavin Sung ,  Tim Liu ,  Lance Lin ,  Wan Yu Liu ,  Gerry Juan ,  Jason Y. Jiang ,  Justin M. Huttula ,  Evan Piotr Kuklinski ,  Juha Tapani Paavola ,  Arnab Sen ,  Hari Shanker Thakur ,  Prakash Kurma Raju

IPC: G06F1/20 ,  H01L23/427 ,  H05K7/20

CPC classification number: H05K7/20309 ,  G06F1/203 ,  H01L23/427 ,  H05K7/20136 ,  H05K7/20336

Abstract: There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.

公开(公告)号：US11487326B2

公开(公告)日：2022-11-01

申请号：US17088611

申请日：2020-11-04

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Tin Poay Chuah ,  Yew San Lim ,  Min Suet Lim ,  Chee Chun Yee

IPC: G06F1/16 ,  G06F13/42 ,  H05K7/20 ,  G06F1/20

Abstract: The present disclosure relates to a docking station including a triangular prism shaped body, and a cradle proximal to a top section of the triangular prism shaped body for detachably receiving a mobile device, wherein the cradle may include a plurality of different connection interfaces to provide a selectable connection with a complementary connection interface of the mobile device.