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45 条记录 (耗时 0.041 秒)

    Semi-compliant joining mechanism for semiconductor cooling applications
    23.
    发明授权
    Semi-compliant joining mechanism for semiconductor cooling applications 有权
    半合规半导体冷却应用的连接机制

    公开(公告)号：US07301773B2

    公开(公告)日：2007-11-27

    申请号：US10945807

    申请日：2004-09-20

    申请人： Richard Grant Brewer ,  Paul Tsao ,  Richard Herms ,  Mark Munch ,  Mark McMaster ,  Dave Corbin

    发明人： Richard Grant Brewer ,  Paul Tsao ,  Richard Herms ,  Mark Munch ,  Mark McMaster ,  Dave Corbin

    IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

    CPC分类号： H01L23/4006 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a vector that is collinear to the face-centered normal vector of the thermal interface of the heat source. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of mating force directed through the gimbal joint to the heat collection device. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.

    摘要翻译： 热收集装置使用包括万向接头的万向板安装在热源上。 万向节接头可以作为单点负载将作用于吸收装置的保持力作为单点负载。 保持力沿着与热源的热界面的面心法线向量共线的矢量施加。 这导致保持力在热界面区域上的平衡和集中应用。 万向节板使用弹簧装置直接安装到电路板上。 弹簧意味着调节通过万向节接头到集热装置的配合力的量。 由于万向节关节是旋转柔性的，构成热界面的两个配合面被强制并联配合。 以这种方式，产生高性能的TIM接口。

    Pump and fan control concepts in a cooling system
    24.
    发明授权
    Pump and fan control concepts in a cooling system 有权
    冷却系统中的泵和风扇控制概念

    公开(公告)号：US08602092B2

    公开(公告)日：2013-12-10

    申请号：US11400347

    申请日：2006-04-06

    申请人： Daniel J. Lenehan ,  Kenneth Goodson ,  Thomas W. Kenny ,  Mark Munch ,  Saroj Sahu

    发明人： Daniel J. Lenehan ,  Kenneth Goodson ,  Thomas W. Kenny ,  Mark Munch ,  Saroj Sahu

    IPC分类号： F24F11/06

    CPC分类号： H01L23/473 ,  H01L23/34 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A closed loop cooling system and apparatus for controlling a fluid flow rate through the closed loop cooling system, the apparatus comprising a heat exchanger coupled to at least one heat generating device for removing waste heat from the heat generating device, at least one pump for circulating the fluid, a heat rejector for receiving the fluid, at least one fan for removing waste heat from the heat rejector, at least one temperature sensor coupled to the heat generating device to measure the temperature value of the at least one heat generating device, and a controller electrically coupled to the at least one pump, the at least one fan, and the at least one temperature sensor for receiving the temperature value to selectively control the fluid flow rate and the air flow rate, based on the temperature value.

    摘要翻译： 一种用于控制通过闭环冷却系统的流体流速的闭环冷却系统和装置，该装置包括耦合到至少一个用于从发热装置排出废热的至少一个发热装置的热交换器，至少一个用于循环的泵 所述流体，用于接收流体的热排出器，用于从所述热排出器去除废热的至少一个风扇，耦合到所述发热装置的至少一个温度传感器以测量所述至少一个发热装置的温度值;以及 电耦合到所述至少一个泵，所述至少一个风扇和所述至少一个温度传感器的控制器，用于接收所述温度值，以基于所述温度值选择性地控制所述流体流速和所述空气流速。

    Pump and fan control concepts in a cooling system
    25.
    发明申请
    Pump and fan control concepts in a cooling system 有权
    冷却系统中的泵和风扇控制概念

    公开(公告)号：US20060180300A1

    公开(公告)日：2006-08-17

    申请号：US11400347

    申请日：2006-04-06

    申请人： Daniel Lenehan ,  Kenneth Goodson ,  Thomas Kenny ,  Mark Munch ,  Saroj Sahu

    发明人： Daniel Lenehan ,  Kenneth Goodson ,  Thomas Kenny ,  Mark Munch ,  Saroj Sahu

    IPC分类号： H05K7/20

    CPC分类号： H01L23/473 ,  H01L23/34 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of and apparatus for cooling heat-generating devices in a cooling system is disclosed. The apparatus includes various sensors, control schemes and thermal models, to control pump flow rates and fan flow rates in a concerted manner, while minimizing power consumption, noise, and noise transients. The apparatus further includes at least one heat-generating device, at lease one heat exchanger, and at least one heat rejector. The apparatus can also include many pumps and fans.

    摘要翻译： 公开了一种用于冷却冷却系统中的发热装置的方法和装置。 该装置包括各种传感器，控制方案和热模型，以一致的方式控制泵流量和风扇流量，同时最小化功耗，噪声和噪声瞬变。 该装置还包括至少一个热产生装置，至少一个热交换器和至少一个热排出器。 该设备还可以包括许多泵和风扇。

    Hermetic closed loop fluid system
    26.
    发明申请
    Hermetic closed loop fluid system 失效
    密闭闭环流体系统

    公开(公告)号：US20050016715A1

    公开(公告)日：2005-01-27

    申请号：US10769717

    申请日：2004-01-29

    申请人： Douglas Werner ,  Mark Munch ,  Thomas Kenny

    发明人： Douglas Werner ,  Mark Munch ,  Thomas Kenny

    IPC分类号： H01L23/473 ,  H05K7/20

    CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

    摘要： A hermetic closed loop fluid system for controlling temperature of a heat source includes at least one component including at least one heat exchanger in contact with the heat source. The heat exchanger is configured to pass a fluid therethrough, wherein the fluid performs thermal exchange with the heat source. A predetermined amount of the fluid remains within the fluid system for a desired amount of operating time. The desired amount of operating time is preferably at least 10 years. Alternatively, the desired amount of operating time is at least 3 years. The predetermined amount of fluid is preferably ninety percent of an initial amount of fluid. Alternatively, the predetermined amount of fluid is seventy five percent of an initial amount of fluid. Still alternatively, at least fifty percent of the fluid can remain within the fluid system for the desired amount of operating time. The fluid can be a single phase fluid. The fluid can also be a two phase fluid.

    摘要翻译： 用于控制热源的温度的密封闭环流体系统包括至少一个部件，其包括与热源接触的至少一个热交换器。 热交换器被配置为使流体通过其中，其中流体与热源进行热交换。 预定量的流体在流体系统内保持期望的操作时间量。 期望的操作时间量优选为至少10年。 或者，期望的操作时间量为至少3年。 流体的预定量优选为初始量的90％。 或者，预定量的流体是初始量的流体的百分之七十五。 或者，至少50％的流体可以在流体系统内保持期望的操作时间量。 流体可以是单相流体。 流体也可以是两相流体。

    Probe and method of manufacture for semiconductor wafer characterization
    28.
    发明授权
    Probe and method of manufacture for semiconductor wafer characterization 有权
    用于半导体晶圆表征的探头和制造方法

    公开(公告)号：US09176167B1

    公开(公告)日：2015-11-03

    申请号：US13715486

    申请日：2012-12-14

    申请人： Dong Chen ,  Mark Munch

    发明人： Dong Chen ,  Mark Munch

    IPC分类号： G01R3/00 ,  G01R1/067 ,  G01R31/44 ,  G01R31/26 ,  G01R31/02 ,  G09G3/00

    CPC分类号： G01R1/06761 ,  G01R3/00 ,  G01R31/025 ,  G01R31/2635 ,  G01R31/2648 ,  G01R31/2656 ,  G01R31/44 ,  G09G3/006

    摘要： A conductive probe for semiconductor material characterization includes a distal metallic layer of micrometer-size particles, an intermediate layer of conformable conductive elastomer material, and a pin attached to the elastomer layer. The probe is preferably manufactured by filling a recess in a bottom plate with the metallic particles, coupling a top plate thereto with a perforation aligned with the recess, and filling the perforation with uncured conductive elastomer. The pin, preferably spring-loaded, is pressed into the perforation to compress the silicone to its intended probe size. The silicone is then allowed to cure at room temperature or in a heated environment, or both.

    摘要翻译： 用于半导体材料表征的导电探针包括微米尺寸颗粒的远端金属层，适形导电弹性体材料的中间层和连接到弹性体层的销。 探针优选通过用金属颗粒填充底板中的凹部，将顶板与其上的孔对准，并与凹陷对准的穿孔，并用未固化的导电弹性体填充穿孔来制造。 优选弹簧加载的销被压入穿孔中以将硅胶压缩到其预期的探针尺寸。 然后将硅酮在室温或加热环境中或两者均可固化。