公开(公告)号：US08709875B2

公开(公告)日：2014-04-29

申请号：US13549518

申请日：2012-07-16

申请人： Jinzhong Yao ,  Zhigang Bai ,  Xuesong Xu

发明人： Jinzhong Yao ,  Zhigang Bai ,  Xuesong Xu

IPC分类号： H01L21/48

CPC分类号： H01L23/49537 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49551 ,  H01L23/49568 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/13101 ,  H01L2224/1329 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92242 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/00012

摘要： A method of packaging a power semiconductor die includes providing a first lead frame of a dual gauge lead frame. The first lead frame includes a thick die pad. A tape is attached to a first side of the thick die pad and the power die is attached to a second side of the thick die pad. A second lead frame of the dual gauge lead frame is provided. The second lead frame has thin lead fingers. One end of the lead fingers is attached to an active surface of the power die such that the lead fingers are electrically connected to bonding pads of the power die. A molding compound is then dispensed onto a top surface of the dual gauge lead frame such that the molding compound covers the power die and the lead fingers.

摘要翻译： 封装功率半导体管芯的方法包括提供双量规引线框架的第一引线框架。 第一引线框架包括厚的芯片焊盘。 磁带附着到厚芯片焊盘的第一侧，并且功率管芯附接到厚芯片焊盘的第二侧。 提供了双量规引线框架的第二引线框架。 第二引线框架具有薄的引线指。 引线指的一端连接到功率管芯的有源表面，使得引线指电连接到功率管芯的焊盘。 然后将模塑料分配到双量规引线框架的顶表面上，使得模制化合物覆盖电源模具和引线指。

公开(公告)号：US09443746B2

公开(公告)日：2016-09-13

申请号：US14562770

申请日：2014-12-07

申请人： Zhigang Bai ,  Xingshou Pang ,  Jinzhong Yao

发明人： Zhigang Bai ,  Xingshou Pang ,  Jinzhong Yao

IPC分类号： H01L23/495 ,  H01L21/67 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L21/67126 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Tooling for molding a packaged semiconductor device includes a clamping plate, a cavity bar, and an attachment mechanism. The cavity bar has a mold half that has a mold cavity for molding the packaged semiconductor device. The mold half has teeth and a space between pairs of adjacent teeth. The teeth and the spaces support bending of leads of a lead frame of the packaged semiconductor device. The attachment mechanism affixes the cavity bar to the clamping plate and permits the cavity bar to slide relative to the clamping plate. This sliding of the cavity bar enables proper alignment with a mating cavity bar to reduce the likelihood of resin bleed.

摘要翻译： 用于模制封装的半导体器件的模具包括夹板，空腔棒和附接机构。 空腔棒具有模具半部，其具有用于模制封装半导体器件的模腔。 模具半部具有齿和相邻齿对之间的空间。 所述齿和所述间隙支撑所述封装半导体器件的引线框架的引线的弯曲。 连接机构将空腔棒固定到夹紧板上，并允许空腔棒相对于夹紧板滑动。 空腔棒的这种滑动使得能够与配合的腔棒正确对准以减少树脂流出的可能性。

公开(公告)号：US20160049318A1

公开(公告)日：2016-02-18

申请号：US14562770

申请日：2014-12-07

申请人： Zhigang Bai ,  Xingshou Pang ,  Jinzhong Yao

发明人： Zhigang Bai ,  Xingshou Pang ,  Jinzhong Yao

IPC分类号： H01L21/67 ,  H01L21/48 ,  H01L23/495 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L21/67126 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Tooling for molding a packaged semiconductor device includes a clamping plate, a cavity bar, and an attachment mechanism. The cavity bar has a mold half that has a mold cavity for molding the packaged semiconductor device. The mold half has teeth and a space between pairs of adjacent teeth. The teeth and the spaces support bending of leads of a lead frame of the packaged semiconductor device. The attachment mechanism affixes the cavity bar to the clamping plate and permits the cavity bar to slide relative to the clamping plate. This sliding of the cavity bar enables proper alignment with a mating cavity bar to reduce the likelihood of resin bleed.

摘要翻译： 用于模制封装的半导体器件的模具包括夹板，空腔棒和附接机构。 空腔棒具有模具半部，其具有用于模制封装半导体器件的模腔。 模具半部具有齿和相邻齿对之间的空间。 所述齿和所述间隙支撑所述封装半导体器件的引线框架的引线的弯曲。 连接机构将空腔棒固定到夹紧板上，并允许空腔棒相对于夹紧板滑动。 空腔棒的这种滑动使得能够与配合的腔棒正确对准以减少树脂流出的可能性。

公开(公告)号：US20150028468A1

公开(公告)日：2015-01-29

申请号：US14277061

申请日：2014-05-14

申请人： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

发明人： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

IPC分类号： H01L23/08 ,  H01L23/00 ,  H01L21/56

CPC分类号： H01L24/85 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A no-lead type semiconductor package has a mold cap that forms a mold body. The corners of the mold body are reinforced with mold columns such that the corners have rounded protrusions and do not form 90° angles. The mold columns prevent the corner pads from peeling.

摘要翻译： 无引线型半导体封装具有形成模体的模盖。 模具体的角部用模具柱加强，使得拐角具有圆形的突起并且不形成90°的角度。 模具柱防止角垫脱落。

公开(公告)号：US20140361421A1

公开(公告)日：2014-12-11

申请号：US13972885

申请日：2013-08-21

申请人： Zhigang Bai ,  Jinzhong Yao ,  Yuan Zang

发明人： Zhigang Bai ,  Jinzhong Yao ,  Yuan Zang

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49517 ,  H01L23/3107 ,  H01L23/49555 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A lead frame based semiconductor die package includes a lead frame having a die pad that supports a semiconductor die and lead fingers that surround the die and die pad. The die is electrically connected to the lead fingers with bond wires. The die and bond wires are covered with an encapsulant with ends of the lead fingers projecting out from the encapsulant. One set of the lead fingers are bent and project down and another set of the lead fingers are bent and project inwardly, and under a bottom surface of the encapsulant. The encapsulant includes a slot or groove for receiving the lead fingers of the second set.

摘要翻译： 基于引线框架的半导体管芯封装包括引线框架，其具有支撑半导体管芯的管芯焊盘和围绕管芯和管芯焊盘的引线指。 模具通过接合线电连接到引线指。 管芯和接合线用密封剂覆盖，引线的端部从密封剂突出。 一组引导指弯曲并向下突出，另一组引导指弯曲并向内突出，并在密封剂的底表面下方。 密封剂包括用于接收第二组的引导指的槽或槽。

公开(公告)号：US20130196473A1

公开(公告)日：2013-08-01

申请号：US13794789

申请日：2013-03-12

申请人： Zhigang Bai ,  Jinzhong Yao

发明人： Zhigang Bai ,  Jinzhong Yao

IPC分类号： H01L21/56

CPC分类号： H01L21/565 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H03K19/018521 ,  H01L2924/00014

摘要： A mold chase for packaging a semiconductor die includes first and second toothed mold clamps, each having teeth, recesses located between the teeth, and an open cavity located in a center of the first mold clamp. The second mold clamp is in facing arrangement with the first mold clamp and the teeth in the first mold clamp mate with corresponding recesses in the second mold clamp and vice-versa. In an open position a lead frame can be inserted into one of the first or second mold clamps and in a closed position, the teeth and recesses of the first and second mold clamps bend leads of the lead frame into two spaced, planar rows.

摘要翻译： 用于包装半导体模具的模具行包括第一和第二齿形模具夹具，每个具有齿，位于齿之间的凹部和位于第一模具夹具的中心的开口腔。 第二模具夹具与第一模具夹具面对配置，并且第一模具夹具中的齿与第二模具夹具中的相应凹部配合，反之亦然。 在打开位置，引线框架可以插入第一或第二模具夹具中的一个中，并且在关闭位置，第一和第二模具夹具的齿和凹部将引线框架的引线弯曲成两个间隔开的平面行。

公开(公告)号：US20110193237A1

公开(公告)日：2011-08-11

申请号：US13004029

申请日：2011-01-11

申请人： Bin Tian ,  Nan Xu ,  Jinzhong Yao

发明人： Bin Tian ,  Nan Xu ,  Jinzhong Yao

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/3107 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for assembling a semiconductor package includes a rapid cooling step after post mold curing of an encapsulation material. The rapid cooling step includes blowing chilled, compressed air over the package for about two minutes. The rapid cooling step does not require any clamping pressure be simultaneously applied to the package. The rapid cooling step reduces a temperature of the encapsulation material from a curing temperature to the cooled temperature within a maximum period of less than five minutes. By using rapid cooling, as opposed to cooling the package under a clamping pressure with ambient air, package warpage due to CTE mismatches is prevented.

摘要翻译： 一种组装半导体封装的方法包括在封装材料的后模塑固化之后的快速冷却步骤。 快速冷却步骤包括将冷却的压缩空气吹在包装上约两分钟。 快速冷却步骤不需要同时对包装施加任何夹紧压力。 快速冷却步骤将封装材料的温度从低于5分钟的最长时间内将固化温度降低到冷却温度。 通过使用快速冷却，与在环境空气下的夹紧压力下冷却封装相反，防止由于CTE错配引起的封装翘曲。

公开(公告)号：US08115288B2

公开(公告)日：2012-02-14

申请号：US13021716

申请日：2011-02-05

申请人： Yongsheng Lu ,  Bin Tian ,  Nan Xu ,  Jinzhong Yao ,  Shufeng Zhao

发明人： Yongsheng Lu ,  Bin Tian ,  Nan Xu ,  Jinzhong Yao ,  Shufeng Zhao

IPC分类号： H01L21/60 ,  H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/49548 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A lead frame for reducing detrimental effects of burr formation includes a lead frame that has leads where a portion of a top surface is removed from a first lead and a portion of a bottom surface is removed from a second lead adjacent to the first lead to reduce spacing between leads while reducing the detrimental effects of burr formation, such as shorting and the like, caused during singulation of a semiconductor device manufactured with the lead frame.

摘要翻译： 用于减少毛刺形成的有害影响的引线框架包括引线框架，其具有引线，其中顶表面的一部分从第一引线移除，并且底表面的一部分从邻近第一引线的第二引线移除以减少 导线之间的间隔，同时减少了由引线框制造的半导体器件的分割期间引起的毛刺形成的不利影响，例如短路等。

公开(公告)号：US08216886B2

公开(公告)日：2012-07-10

申请号：US13004029

申请日：2011-01-11

申请人： Bin Tian ,  Nan Xu ,  Jinzhong Yao

发明人： Bin Tian ,  Nan Xu ,  Jinzhong Yao

IPC分类号： H01L21/00

CPC分类号： H01L23/3107 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for assembling a semiconductor package includes a rapid cooling step after post mold curing of an encapsulation material. The rapid cooling step includes blowing chilled, compressed air over the package for about two minutes. The rapid cooling step does not require any clamping pressure be simultaneously applied to the package. The rapid cooling step reduces a temperature of the encapsulation material from a curing temperature to the cooled temperature within a maximum period of less than five minutes. By using rapid cooling, as opposed to cooling the package under a clamping pressure with ambient air, package warpage due to CTE mismatches is prevented.

摘要翻译： 一种组装半导体封装的方法包括在封装材料的后模塑固化之后的快速冷却步骤。 快速冷却步骤包括将冷却的压缩空气吹在包装上约两分钟。 快速冷却步骤不需要同时对包装施加任何夹紧压力。 快速冷却步骤将封装材料的温度从低于5分钟的最长时间内将固化温度降低到冷却温度。 通过使用快速冷却，与在环境空气下的夹紧压力下冷却封装相反，防止由于CTE错配引起的封装翘曲。

公开(公告)号：US07727817B2

公开(公告)日：2010-06-01

申请号：US12403400

申请日：2009-03-13

申请人： Xuesong Xu ,  Nan Xu ,  Jinzhong Yao

发明人： Xuesong Xu ,  Nan Xu ,  Jinzhong Yao

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a method of packaging a semiconductor IC, a tape is attached to a back surface of a lead frame array, and the lead frame array is held between an upper mold chase and a lower mold chase of a mold, with the back surface of the lead frame array upward. The upper and lower mold chases form an upper cavity and a lower cavity with respect to the lead frame array respectively. A mold compound is injected into the upper and lower cavities respectively. With respect to clearances between leads, between die pads and/or between the leads and the die pads, the mold compound injected into the upper cavity covers the portion of the tape over the clearances before the mold compound injected into the lower cavity fills the clearances, so that the tape is depressed. After curing the mold compound, removing the mold and de-taping, the mold compound filled in the clearances is recessed inward from the back surface, which increases the solderability in the subsequent surface mount process and decreases the possibility of the occurrence of lead short-circuits.

摘要翻译： 在封装半导体IC的方法中，将带附接到引线框架阵列的后表面，并且引线框架阵列保持在模具的上模追逐和下模追逐之间，其中 引线框阵列向上。 上下模具分别相对于引线框架阵列形成上腔体和下腔体。 模具化合物分别注入上腔和下穴。 关于引线之间，芯片之间和/或引线和芯片焊盘之间的间隙，注入上腔的模具复合体在注入到下腔内的模具化合物填充间隙之前在间隙上覆盖磁带的部分 ，使得磁带被压下。 在固化模具化合物之后，除去模具和脱胶，填充间隙的模具化合物从后表面向内凹入，这增加了随后的表面贴装工艺中的可焊性，并且降低了引线短路的可能性， 电路。