公开(公告)号：US20160056097A1

公开(公告)日：2016-02-25

申请号：US14556225

申请日：2014-11-30

申请人： Zhigang Bai ,  Xingshou Pang ,  Nan Xu ,  Jinzhong Yao

发明人： Zhigang Bai ,  Xingshou Pang ,  Nan Xu ,  Jinzhong Yao

IPC分类号： H01L23/495 ,  H01L21/52 ,  H01L21/78 ,  H01L21/56 ,  H01L21/311 ,  H01L21/3205 ,  H01L23/31 ,  H01L21/48

CPC分类号： H01L21/78 ,  H01L21/4842 ,  H01L21/52 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49551 ,  H01L23/49582 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A Quad Flat Non-leaded (QFN) semiconductor die package has a semiconductor die mounted on a die flag of a lead frame. A covers the semiconductor die. The housing has a base and sides. There are electrically conductive mounting feet, each of which has an exposed base portion in the base of the housing and an exposed side portion in the one of the sides of the housing. Bond wires electrically connect electrodes of the semiconductor die to respective ones of the mounting feet.

摘要翻译： 四边形扁平无引线（QFN）半导体管芯封装具有安装在引线框架的管芯标记上的半导体管芯。 A覆盖半导体管芯。 房屋有一个基地和两侧。 存在导电安装脚，每个脚在壳体的基部中具有暴露的基部，并且在壳体的一侧中的暴露的侧部。 接合线将半导体管芯的电极与相应的安装脚电连接。

公开(公告)号：US20150294929A1

公开(公告)日：2015-10-15

申请号：US14552491

申请日：2014-11-25

申请人： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

发明人： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

IPC分类号： H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L21/565 ,  H01L21/4839 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49558 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15156 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00

摘要： A semiconductor die package is assembled from a lead frame having lead fingers with a bonding end adjacent a die flag, and an elongate region extending away from the die flag. A semiconductor die is mounted on the die flag and electrodes of the semiconductor die are electrically connected to the bonding ends with bond wires. Each elongate region is bent into an external connector lead with mounting feet. The elongate region of each of the lead fingers protrudes from a housing formed from a mold compound. The mold compound extends from the housing to provide insulated support fingers molded to the external connector leads.

摘要翻译： 半导体管芯封装由具有引线指的引线框架组装，引线框具有邻近管芯标记的结合端，以及远离管芯标记延伸的细长区域。 半导体管芯安装在管芯标记上，半导体管芯的电极通过接合线与接合端电连接。 每个细长区域被弯曲成具有安装脚的外部连接器引线。 每个引线指的细长区域从由模具化合物形成的壳体突出。 模具化合物从壳体延伸，以提供模制到外部连接器引线的绝缘支撑指。

公开(公告)号：US08525311B2

公开(公告)日：2013-09-03

申请号：US13170206

申请日：2011-06-28

申请人： Zhigang Bai ,  Jinzhong Yao ,  Xuesong Xu

发明人： Zhigang Bai ,  Jinzhong Yao ,  Xuesong Xu

IPC分类号： H01L33/62

CPC分类号： H01L23/49558 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead frame for a semiconductor device has a die pad with a first major surface for receiving an semiconductor die and a connection bar that encircles the die pad. First lead fingers that project from the connection bar towards the die pad have proximal ends close to the die pad and distal ends connected to the connection bar. The proximal ends of the first lead fingers lie in a first plane. Second lead fingers that project from the connection bar towards the die pad have proximal ends close to the die pad and distal ends connected to the connection bar. The proximal ends of the second lead fingers lie in a second plane that is parallel and spaced from the first plane. An isolation frame is disposed between the proximal ends of the first and second lead fingers. The isolation frame separates but supports the proximal ends of the first and second lead fingers.

摘要翻译： 用于半导体器件的引线框具有具有用于接收半导体管芯的第一主表面的管芯焊盘和环绕管芯焊盘的连接杆。 从连接杆朝向管芯焊盘突出的第一引线指端具有靠近管芯焊盘的近端，并且远端连接到连接杆。 第一引线指的近端位于第一平面中。 从连接杆朝向管芯焊盘突出的第二引线指端具有靠近管芯焊盘的近端，并且远端连接到连接杆。 第二引线指的近端位于与第一平面平行并间隔开的第二平面中。 隔离框架设置在第一和第二引线指的近端之间。 隔离框架分离但支撑第一和第二引线指的近端。

公开(公告)号：US20120056311A1

公开(公告)日：2012-03-08

申请号：US13170206

申请日：2011-06-28

申请人： Zhigang BAI ,  Jinzhong Yao ,  Xuesong Xu

发明人： Zhigang BAI ,  Jinzhong Yao ,  Xuesong Xu

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49558 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead frame for a semiconductor device has a die pad with a first major surface for receiving an semiconductor die and a connection bar that encircles the die pad. First lead fingers that project from the connection bar towards the die pad have proximal ends close to the die pad and distal ends connected to the connection bar. The proximal ends of the first lead fingers lie in a first plane. Second lead fingers that project from the connection bar towards the die pad have proximal ends close to the die pad and distal ends connected to the connection bar. The proximal ends of the second lead fingers lie in a second plane that is parallel and spaced from the first plane. An isolation frame is disposed between the proximal ends of the first and second lead fingers. The isolation frame separates but supports the proximal ends of the first and second lead fingers.

摘要翻译： 用于半导体器件的引线框具有具有用于接收半导体管芯的第一主表面的管芯焊盘和环绕管芯焊盘的连接杆。 从连接杆朝向管芯焊盘突出的第一引线指端具有靠近管芯焊盘的近端，并且远端连接到连接杆。 第一引线指的近端位于第一平面中。 从连接杆朝向管芯焊盘突出的第二引线指端具有靠近管芯焊盘的近端，并且远端连接到连接杆。 第二引线指的近端位于与第一平面平行并间隔开的第二平面中。 隔离框架设置在第一和第二引线指的近端之间。 隔离框架分离但支撑第一和第二引线指的近端。

公开(公告)号：US09214447B2

公开(公告)日：2015-12-15

申请号：US14277061

申请日：2014-05-14

申请人： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

发明人： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48

CPC分类号： H01L24/85 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A no-lead type semiconductor package has a mold cap that forms a mold body. The corners of the mold body are reinforced with mold columns such that the corners have rounded protrusions and do not form 90° angles. The mold columns prevent the corner pads from peeling.

摘要翻译： 无引线型半导体封装具有形成模体的模盖。 模具体的角部用模具柱加强，使得拐角具有圆形的突起并且不形成90°的角度。 模具柱防止角垫脱落。

公开(公告)号：US20150294924A1

公开(公告)日：2015-10-15

申请号：US14552497

申请日：2014-11-25

申请人： Zhigang Bai ,  Jinzhong Yao ,  Lan Chu Tan

发明人： Zhigang Bai ,  Jinzhong Yao ,  Lan Chu Tan

IPC分类号： H01L23/495 ,  H01L21/56 ,  H01L23/58 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L24/85 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49861 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a first lead frame type having a first type of package leads and a pre-molded portion, and a second lead frame type having a second type of package leads that surround a die pad and are supported by the pre-molded portion. An integrated circuit is attached to the die pad and electrically connected to the first and second types of leads with bond wires. A mold compound, which forms a mold cap, covers the first and second lead frame types, the integrated circuit and the bond wires. The first lead frame type may be a QFP type and the second lead frame type may be a QFN type.

摘要翻译： 半导体封装包括具有第一类型的封装引线和预成型部分的第一引线框架型和具有围绕芯片焊盘并由预模制部分支撑的第二类型的封装引线的第二引线框架型 。 集成电路附接到管芯焊盘并且用接合线电连接到第一和第二类型的引线。 形成模具帽的模具复合体覆盖第一和第二引线框架类型，集成电路和接合线。 第一引线框类型可以是QFP型，第二引线框类型可以是QFN型。

公开(公告)号：US08901721B1

公开(公告)日：2014-12-02

申请号：US13972885

申请日：2013-08-21

申请人： Zhigang Bai ,  Jinzhong Yao ,  Yuan Zang

发明人： Zhigang Bai ,  Jinzhong Yao ,  Yuan Zang

IPC分类号： H01L23/48 ,  H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49517 ,  H01L23/3107 ,  H01L23/49555 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A lead frame based semiconductor die package includes a lead frame having a die pad that supports a semiconductor die and lead fingers that surround the die and die pad. The die is electrically connected to the lead fingers with bond wires. The die and bond wires are covered with an encapsulant with ends of the lead fingers projecting out from the encapsulant. One set of the lead fingers are bent and project down and another set of the lead fingers are bent and project inwardly, and under a bottom surface of the encapsulant. The encapsulant includes a slot or groove for receiving the lead fingers of the second set.

摘要翻译： 基于引线框架的半导体管芯封装包括引线框架，其具有支撑半导体管芯的管芯焊盘和围绕管芯和管芯焊盘的引线指。 模具通过接合线电连接到引线指。 管芯和接合线用密封剂覆盖，引线的端部从密封剂突出。 一组引导指弯曲并向下突出，另一组引导指弯曲并向内突出，并在密封剂的底表面下方。 密封剂包括用于接收第二组的引导指的槽或槽。

公开(公告)号：US08859339B2

公开(公告)日：2014-10-14

申请号：US13794789

申请日：2013-03-12

申请人： Zhigang Bai ,  Jinzhong Yao

发明人： Zhigang Bai ,  Jinzhong Yao

IPC分类号： H01L21/56 ,  B29C45/14 ,  B29C70/72 ,  H03K19/0185

CPC分类号： H01L21/565 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H03K19/018521 ,  H01L2924/00014

摘要： A mold chase for packaging a semiconductor die includes first and second toothed mold clamps, each having teeth, recesses located between the teeth, and an open cavity located in a center of the first mold clamp. The second mold clamp is in facing arrangement with the first mold clamp and the teeth in the first mold clamp mate with corresponding recesses in the second mold clamp and vice-versa. In an open position a lead frame can be inserted into one of the first or second mold clamps and in a closed position, the teeth and recesses of the first and second mold clamps bend leads of the lead frame into two spaced, planar rows.

摘要翻译： 用于包装半导体模具的模具行包括第一和第二齿形模具夹具，每个具有齿，位于齿之间的凹部和位于第一模具夹具的中心的开口腔。 第二模具夹具与第一模具夹具面对配置，并且第一模具夹具中的齿与第二模具夹具中的相应凹部配合，反之亦然。 在打开位置，引线框架可以插入第一或第二模具夹具中的一个中，并且在关闭位置，第一和第二模具夹具的齿和凹部将引线框架的引线弯曲成两个间隔开的平面行。

公开(公告)号：US08859336B2

公开(公告)日：2014-10-14

申请号：US13398816

申请日：2012-02-16

申请人： Junhua Luo ,  Zhigang Bai ,  Nan Xu ,  Jinzhong Yao

发明人： Junhua Luo ,  Zhigang Bai ,  Nan Xu ,  Jinzhong Yao

IPC分类号： H01L21/50 ,  H01L23/433 ,  H01L23/31 ,  H01L23/16 ,  H01L23/00 ,  H01L23/552 ,  H01L21/56

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L21/565 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of assembling semiconductor devices includes placing an array of semiconductor dies on a die support. A cap array structure is provided that has a corresponding array of caps supported by a cap frame structure. The cap array structure and the array of semiconductor dies on the die support are aligned, with the caps extending over corresponding semiconductor dies, in a mold chase. The array of semiconductor dies and the array of caps are encapsulated with a molding compound in the mold chase. The encapsulated units of the semiconductor dies with the corresponding caps are removed from the mold chase and singulated. Singulating the encapsulated units may include removing the cap frame structure from the encapsulated units.

摘要翻译： 一种组装半导体器件的方法包括将半导体管芯的阵列放置在管芯支撑件上。 提供一种帽阵列结构，其具有由帽框架结构支撑的相应的帽阵列。 在模具追逐中，盖阵列结构和模具支撑件上的半导体管芯阵列与盖延伸在对应的半导体管芯上对齐。 半导体管芯阵列和盖阵列通过模具化合物封装在模具追逐中。 将具有相应盖的半导体管芯的封装单元从模具中取出并分离。 编码封装的单元可以包括从封装单元去除盖框架结构。

公开(公告)号：US20130249071A1

公开(公告)日：2013-09-26

申请号：US13854140

申请日：2013-04-01

申请人： Jinzhong Yao ,  Zhigang Bai ,  Yuan Zang

发明人： Jinzhong Yao ,  Zhigang Bai ,  Yuan Zang

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/495 ,  B29C33/005 ,  B29C45/14221 ,  B29C45/14655 ,  H01L21/4842 ,  H01L21/561 ,  H01L21/565 ,  H01L23/49555 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A method of assembling a semiconductor device includes providing a lead frame having a die pad and a fame member with lead fingers that surround the die pad. The lead fingers have distal ends connected to the frame member and proximal ends near the die pad. A die is attached to the die pad and die connection pads are electrically connected to the proximal ends of the lead fingers with bond wires. The die, bond wires, and part of the lead fingers are encapsulated with an encapsulant. The encapsulating process includes separating the lead fingers into first and second sets of lead fingers. The proximal ends of the first set lie in a first plane and the proximal ends of the second set lie in a second plane that is spaced and maintained from the first plane solely by the encapsulation material.

摘要翻译： 一种组装半导体器件的方法包括提供引线框架，该引线框架具有管芯焊盘和引导指围绕管芯焊盘的成形构件。 引线指具有连接到框架构件的远端和靠近管芯焊盘的近端。 模具附接到管芯焊盘，管芯连接焊盘通过接合线电连接到引线指的近端。 管芯，接合线和引线的一部分用密封剂封装。 封装过程包括将引线分离成第一和第二组引线指。 第一组的近端位于第一平面中，并且第二组的近端位于第二平面中，第二平面仅与第一平面间隔开并由包封材料保持。