公开(公告)号：US5166228A

公开(公告)日：1992-11-24

申请号：US739447

申请日：1991-08-02

申请人： Toshio Shiobara ,  Kazutoshi Tomiyoshi ,  Koji Futatsumori ,  Takashi Tsuchiya ,  Takayuki Aoki

发明人： Toshio Shiobara ,  Kazutoshi Tomiyoshi ,  Koji Futatsumori ,  Takashi Tsuchiya ,  Takayuki Aoki

IPC分类号： C08G59/62 ,  C08G8/00 ,  C08G8/08 ,  C08G59/00 ,  C08G59/08 ,  C08G59/20 ,  C08G59/32 ,  C08L63/00 ,  C08L63/04 ,  C08L83/05 ,  H01B3/40 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01B3/40 ,  C08G59/08 ,  C08L63/04

摘要： An epoxy resin composition comprising (A) a specific epoxy resin, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is suitable for encapsulating semiconductor devices.

摘要翻译： 包含（A）特定环氧树脂，（B）在分子中具有至少一个萘环的酚醛树脂和（C）无机填料的环氧树脂组合物具有改善的流动性并固化成具有低膨胀系数的产品， 高Tg，低吸湿性。 该组合物适用于封装半导体器件。

公开(公告)号：US5137940A

公开(公告)日：1992-08-11

申请号：US476700

申请日：1990-02-08

申请人： Kazutoshi Tomiyoshi ,  Toshio Shiobara ,  Hatuji Shiraishi ,  Koji Futatsumori

发明人： Kazutoshi Tomiyoshi ,  Toshio Shiobara ,  Hatuji Shiraishi ,  Koji Futatsumori

IPC分类号： C08K3/36 ,  H01B3/40

CPC分类号： H01B3/40 ,  C08K3/36

摘要： A semiconductor encapsulating epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler is improved in melt flow and moldability when the filler comprises spherical silica having a mean particle size of 5 to 35 .mu.m and a specific surface area of up to 1.4 m.sup.2 /g. A mixture of (A) spherical silica having a mean particle size of 0.1 to 2 .mu.m, and (C) ground silica having a mean particle size of 2 to 15 .mu.m is also useful as the filler. A cured product thereof has a low coefficient of expansion and improved crack resistance upon soldering after moisture absorption.

摘要翻译： 包含环氧树脂，固化剂和无机填料的半导体封装环氧树脂组合物在熔体流动性和成型性方面得到改善，当填料包括平均粒度为5至35μm的球形二氧化硅和比表面积 至1.4m2 / g。 平均粒径为0.1〜2μm的（A）球状二氧化硅和（C）平均粒径为2〜15μm的研磨二氧化硅的混合物也可用作填料。 其固化产物在吸湿后焊接时具有低膨胀系数和改善的抗裂性。

公开(公告)号：US4902732A

公开(公告)日：1990-02-20

申请号：US928654

申请日：1986-11-05

申请人： Kunio Itoh ,  Sumiko Komiya ,  Toshio Shiobara ,  Kazutoshi Tomiyoshi ,  Yoshio Fujimura

发明人： Kunio Itoh ,  Sumiko Komiya ,  Toshio Shiobara ,  Kazutoshi Tomiyoshi ,  Yoshio Fujimura

IPC分类号： C08G77/42 ,  C08L63/00 ,  C08L83/10 ,  H01B3/36 ,  H01B3/40 ,  H01B3/46

CPC分类号： H01B3/46 ,  C08G77/42 ,  C08L63/00 ,  C08L83/10 ,  H01B3/36 ,  H01B3/40

摘要： The present invention provides a novel epoxy resin-based curable composition suitable for use as an encapsulating resin composition for semiconductor devices capable of being highly resistant against crack formation with low internal stress by curing and yet having very high heat conductivity and maintaining high glass transition temperature. The inventive composition comprises (a) 100 parts by weight of a curable epoxy resin blend which is a mixture of an epoxy resin and a curing agent therefor, (b) from 5 to 100 parts by weight of a block copolymer composed of at least one segment of an aromatic polymeric moiety, phenyl novolac, and at least one segment of an organopolysiloxane moiety having 30 to 200 silicon atoms and bonded to the aromatic polymeric moiety through a carbon-to-silicon linkage, and optionally (c) an inorganic filler which is preferably a silica filler such as powdered quartz in an amount not exceeding 1000 parts by weight.

摘要翻译： 本发明提供一种适用于半导体器件的封装树脂组合物的新型环氧树脂类固化性组合物，能够通过固化而具有低内应力的高裂纹形成，并具有非常高的导热性和保持高的玻璃化转变温度 。 本发明的组合物包含（a）100重量份作为环氧树脂和其固化剂的混合物的可固化环氧树脂共混物，（b）5至100重量份的由至少一种 芳族聚合物部分的段，苯基酚醛清漆和至少一个具有30-200个硅原子的有机聚硅氧烷部分，并通过碳 - 硅键连接到芳族聚合物部分，和任选地（c）无机填料， 优选为不超过1000重量份的二氧化硅填料，例如石英粉末。

公开(公告)号：US07095125B2

公开(公告)日：2006-08-22

申请号：US10617827

申请日：2003-07-14

申请人： Shoichi Osada ,  Eiichi Asano ,  Shigeki Ino ,  Takayuki Aoki ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

发明人： Shoichi Osada ,  Eiichi Asano ,  Shigeki Ino ,  Takayuki Aoki ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

IPC分类号： H01L23/29

CPC分类号： H01L23/293 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/12528 ,  Y10T428/31511 ,  C08L83/00 ,  H01L2924/00

摘要： A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.

公开(公告)号：US06894091B2

公开(公告)日：2005-05-17

申请号：US09883276

申请日：2001-06-19

申请人： Shoichi Osada ,  Toshio Shiobara ,  Eiichi Asano ,  Kazutoshi Tomiyoshi ,  Takayuki Aoki ,  Shigeki Ino

发明人： Shoichi Osada ,  Toshio Shiobara ,  Eiichi Asano ,  Kazutoshi Tomiyoshi ,  Takayuki Aoki ,  Shigeki Ino

IPC分类号： C08K3/00 ,  C08G59/28 ,  C08G59/62 ,  C08K9/02 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31 ,  C08K5/00

CPC分类号： H01L23/293 ,  C08L63/00 ,  H01L2924/0002 ,  C08L61/04 ,  H01L2924/00

摘要： A semiconductor encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, and (D) 300-900 parts by weight per 100 parts by weight of components (A) and (B) combined of an inorganic filler contains nitrogen atoms in an amount of 1.5-20% by weight based on the weight of components (A) and (B) combined. Cured parts of the composition exhibit high-temperature capabilities and flame retardance despite the absence of halogenated epoxy resins and antimony trioxide.

摘要翻译： 一种半导体封装环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）钼化合物和（D）每100重量份组分（A）300-900重量份， 和（B）组合的无机填料含有以组分（A）和（B）的重量计为1.5-20重量％的氮原子。 尽管没有卤化环氧树脂和三氧化锑，组合物的固化部分表现出高温能力和阻燃性。

公开(公告)号：US5418266A

公开(公告)日：1995-05-23

申请号：US187262

申请日：1994-01-27

申请人： Toshio Shiobara ,  Takayuki Aoki ,  Kazutoshi Tomiyoshi

发明人： Toshio Shiobara ,  Takayuki Aoki ,  Kazutoshi Tomiyoshi

IPC分类号： C08G59/20 ,  C08G59/00 ,  C08G59/08 ,  C08G59/32 ,  C08K3/00 ,  C08L63/00 ,  C08L63/04 ,  H01B3/40 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01L23/293 ,  C08G59/08 ,  C08G59/3218 ,  C08L63/00 ,  C08L63/04 ,  H01B3/40 ,  H01L2924/0002

摘要： An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a specific phenolic resin preferably in admixture with a conventional phenolic resin, especially naphthalene ring-containing phenolic resin, and (C) an inorganic filler shows good flow and cures to products having low modulus of elasticity, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition remain highly reliable even after being subject to thermal shocks upon surface mounting.

摘要翻译： 包含（A）含萘环的环氧树脂的环氧树脂组合物，（B）优选与常规酚醛树脂（特别是含萘环酚醛树脂）混合的特定酚醛树脂和（C）无机填料显示出良好的流动性 并且固化成具有低弹性模量，低膨胀系数，高Tg而与低应力无关的产品和最小化的吸水性。 然后，即使在表面安装时受到热冲击，用本发明组合物封装的半导体器件也保持高度可靠性。

公开(公告)号：US5312878A

公开(公告)日：1994-05-17

申请号：US955613

申请日：1992-10-01

申请人： Toshio Shiobara ,  Kazutoshi Tomiyoshi ,  Takayuki Aoki ,  Hatsuji Shiraishi

发明人： Toshio Shiobara ,  Kazutoshi Tomiyoshi ,  Takayuki Aoki ,  Hatsuji Shiraishi

IPC分类号： C08G59/20 ,  C08G59/00 ,  C08G59/32 ,  C08G59/62 ,  C08L63/00 ,  H01B3/40 ,  H01L23/29 ,  H01L23/31 ,  C08F283/00

CPC分类号： H01B3/40 ,  C08G59/3218 ,  C08L63/00

摘要： A thermosetting resin composition comprising (A) a naphthalene ring-bearing epoxy resin, (B) a dicyclopentadiene-modified phenolic resin, and (C) an inorganic filler is suitable for encapsulating semiconductor devices since the composition cures into a product having a low coefficient of expansion, good adhesion and low moisture absorption.

摘要翻译： 包含（A）含萘环的环氧树脂，（B）二环戊二烯改性酚醛树脂和（C）无机填料的热固性树脂组合物适合于封装半导体器件，因为组合物固化成具有低系数的产物 膨胀，附着力好，吸湿性低。

公开(公告)号：US5250637A

公开(公告)日：1993-10-05

申请号：US981209

申请日：1992-11-25

申请人： Toshio Shiobara ,  Kazutoshi Tomiyoshi ,  Yasuo Tarumi ,  Hiromasa Yamaguchi

发明人： Toshio Shiobara ,  Kazutoshi Tomiyoshi ,  Yasuo Tarumi ,  Hiromasa Yamaguchi

IPC分类号： C08L63/00 ,  C07D303/22 ,  C07F7/18 ,  C08G59/00 ,  C08G59/14 ,  C08G59/40 ,  C08K5/5419 ,  H01L23/29 ,  H01L23/31 ,  C08F283/10

CPC分类号： C07D303/22 ,  C07F7/182 ,  C07F7/1836 ,  C07F7/184 ,  C08G59/145 ,  C08G59/4085 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/12044

摘要： An epoxy resin composition comprising an epoxy resin, a curing agent and an inorganic filler is adapted for semiconductor encapsulation. A fluorinated organic silicon compound is blended in the composition as a coupling agent whereby the composition is improved in adhesion and moisture resistance.

摘要翻译： 包含环氧树脂，固化剂和无机填料的环氧树脂组合物适用于半导体封装。 氟化有机硅化合物作为偶联剂混合在组合物中，由此组合物的粘合性和耐湿性得到改善。

公开(公告)号：US5190995A

公开(公告)日：1993-03-02

申请号：US645498

申请日：1991-01-24

申请人： Toshio Shiobara ,  Kazutoshi Tomiyoshi

发明人： Toshio Shiobara ,  Kazutoshi Tomiyoshi

IPC分类号： C08G59/08 ,  C08G59/32 ,  C08G59/62 ,  C08L61/10 ,  C08L63/04 ,  H01B3/40 ,  H01L23/29

CPC分类号： H01L23/293 ,  C08G59/08 ,  C08G59/3218 ,  C08G59/621 ,  C08L63/04 ,  H01B3/40 ,  H01L2924/0002

摘要： Epoxy resin compositions comprising (A) an epoxy resin of formula (1), (B) a curing agent based on a novolak type phenol resin and/or a triphenolalkane resin of formula (2), and (C) an inorganic filler are suitable for encapsulating semiconductor elements because they show good flow behavior upon casting and cure into less stressed products having improved mechanical strength, Tg, and moisture resistance. ##STR1## R.sup.1 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, OG is ##STR2## m is 0, 1 or 2, n is 1 or 2, and l is 0, 1, 2 or 3.

公开(公告)号：US5173544A

公开(公告)日：1992-12-22

申请号：US523814

申请日：1990-05-16

申请人： Hisashi Shimizu ,  Kazutoshi Tomiyoshi ,  Hatsuji Shiraishi ,  Toshio Shiobara

发明人： Hisashi Shimizu ,  Kazutoshi Tomiyoshi ,  Hatsuji Shiraishi ,  Toshio Shiobara

IPC分类号： C08G59/00 ,  C08G59/14 ,  C08G59/20 ,  C08G59/30 ,  C08G77/42 ,  C08L63/00

CPC分类号： C08G77/42 ,  C08L63/00

摘要： An epoxy resin composition comprising an epoxy resin, a curing agent, and a copolymer mixture comprising a long-chain organopolysiloxane copolymer [I] and a short-chain organopolysiloxane copolymer [II] which are each prepared by the addition reaction of an alkenyl-containing epoxy resin with a long-chain or short-chain organopolysiloxane containing pendant phenyl groups at a weight ratio of [II] to [I] of 0.3 to 0.6 is disclosed. The epoxy resin composition exhibits excellent printability, crack resistance, and moldability properties.

摘要翻译： 包含环氧树脂，固化剂和包含长链有机聚硅氧烷共聚物[I]和短链有机聚硅氧烷共聚物[II]的共聚物混合物的环氧树脂组合物，其各自通过含链烯基的 公开了具有含有重量比[II]至[I]为0.3至0.6的侧基苯基的长链或短链有机聚硅氧烷的环氧树脂。 环氧树脂组合物表现出优异的可印刷性，抗龟裂性和成型性。