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193 条记录 (耗时 0.027 秒)

    Epoxy resin composition
    3.
    发明授权
    Epoxy resin composition 失效
    环氧树脂组合物

    公开(公告)号：US6001901A

    公开(公告)日：1999-12-14

    申请号：US993867

    申请日：1997-12-18

    申请人： Toshio Shiobara ,  Eiichi Asano ,  Shigeki Ino ,  Kazutoshi Tomiyoshi

    发明人： Toshio Shiobara ,  Eiichi Asano ,  Shigeki Ino ,  Kazutoshi Tomiyoshi

    IPC分类号： C08K3/36 ,  C08L63/00 ,  C08L63/02

    CPC分类号： C08L63/00 ,  C08K3/36

    摘要： An epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler has a melt viscosity of at most 150 poise at 175.degree. C. The inorganic filler has a BET specific surface area of 1.5-6 m.sup.2 /g and is such that when a 75/25 mixture of the inorganic filler and a bisphenol F type liquid epoxy resin is measured for viscosity at shear rates of 0.6/sec. and 10/sec. at a temperature of 25.+-.0.05.degree. C. by an E type viscometer, the ratio of the viscosity at 0.6/sec. to the viscosity at 10/sec. is at least 3.5/1. The amount of the inorganic filler loaded is 80-90% by weight of the composition. The composition is suitable for the encapsulation of matrix frames.

    摘要翻译： 包含环氧树脂，固化剂和无机填料的环氧树脂组合物在175℃下的熔融粘度至多为150泊。无机填料的BET比表面积为1.5-6m 2 / g，为 当以0.6 /秒的剪切速率测量无机填料和双酚F型液体环氧树脂的75/25混合物的粘度时。 和10 /秒。 通过E型粘度计在25 +/- 0.05℃的温度下，粘度在0.6 /秒的比例。 以10 /秒的粘度。 至少为3.5 / 1。 无机填料的加入量为组合物重量的80-90％。 该组合物适用于矩阵框架的封装。

    Naphthol novolac epoxy resin compositions and semiconductor devices encapsulated therewith
    5.
    发明授权
    Naphthol novolac epoxy resin compositions and semiconductor devices encapsulated therewith 失效
    萘酚酚醛环氧树脂组合物和用其封装的半导体器件

    公开(公告)号：US5358980A

    公开(公告)日：1994-10-25

    申请号：US181540

    申请日：1994-01-14

    申请人： Toshio Shiobara ,  Kazutoshi Tomiyoshi

    发明人： Toshio Shiobara ,  Kazutoshi Tomiyoshi

    IPC分类号： C08G59/14 ,  C08G59/32 ,  C08L63/00 ,  H01B3/40 ,  C08L61/06 ,  C08K3/22 ,  C08K3/28 ,  C08L61/08 ,  C08L61/12

    CPC分类号： H01B3/40 ,  C08G59/145 ,  C08G59/3218 ,  C08L63/00

    摘要： A thermosetting resin composition comprising (A) a naphthalene ring-bearing epoxy resin containing 1 to 10% by weight of a glycidyl naphthol derivative, (B) a naphthalene ring-bearing phenolic resin containing 1 to 10% by weight of a naphthol derivative, and (C) an inorganic filler wherein the content of the naphthol derivatives is 1 to 5% by weight based on the total resin components is suitable for encapsulating semiconductor devices since the composition has a good moldability and cures into a product having a low coefficient of expansion, heat resistance and low moisture absorption.

    摘要翻译： 一种热固性树脂组合物，其包含（A）含有1-10重量％的缩水甘油基萘酚衍生物的含萘环的环氧树脂，（B）含有1至10重量％的萘酚衍生物的含萘环的酚醛树脂， 和（C）无机填料，其中萘酚衍生物的含量相对于总树脂成分为1〜5重量％适合于包封半导体器件，因为该组合物具有良好的成型性，并且固化成具有低系数 膨胀，耐热性和低吸湿性。

    Semiconductor encapsulating epoxy resin compositions
    8.
    发明授权
    Semiconductor encapsulating epoxy resin compositions 失效
    半导体包封环氧树脂组合物

    公开(公告)号：US5137940A

    公开(公告)日：1992-08-11

    申请号：US476700

    申请日：1990-02-08

    申请人： Kazutoshi Tomiyoshi ,  Toshio Shiobara ,  Hatuji Shiraishi ,  Koji Futatsumori

    发明人： Kazutoshi Tomiyoshi ,  Toshio Shiobara ,  Hatuji Shiraishi ,  Koji Futatsumori

    IPC分类号： C08K3/36 ,  H01B3/40

    CPC分类号： H01B3/40 ,  C08K3/36

    摘要： A semiconductor encapsulating epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler is improved in melt flow and moldability when the filler comprises spherical silica having a mean particle size of 5 to 35 .mu.m and a specific surface area of up to 1.4 m.sup.2 /g. A mixture of (A) spherical silica having a mean particle size of 0.1 to 2 .mu.m, and (C) ground silica having a mean particle size of 2 to 15 .mu.m is also useful as the filler. A cured product thereof has a low coefficient of expansion and improved crack resistance upon soldering after moisture absorption.

    摘要翻译： 包含环氧树脂，固化剂和无机填料的半导体封装环氧树脂组合物在熔体流动性和成型性方面得到改善，当填料包括平均粒度为5至35μm的球形二氧化硅和比表面积 至1.4m2 / g。 平均粒径为0.1〜2μm的（A）球状二氧化硅和（C）平均粒径为2〜15μm的研磨二氧化硅的混合物也可用作填料。 其固化产物在吸湿后焊接时具有低膨胀系数和改善的抗裂性。

    Epoxy resin-based curable compositions
    9.
    发明授权
    Epoxy resin-based curable compositions 失效
    环氧树脂基可固化组合物

    公开(公告)号：US4902732A

    公开(公告)日：1990-02-20

    申请号：US928654

    申请日：1986-11-05

    申请人： Kunio Itoh ,  Sumiko Komiya ,  Toshio Shiobara ,  Kazutoshi Tomiyoshi ,  Yoshio Fujimura

    发明人： Kunio Itoh ,  Sumiko Komiya ,  Toshio Shiobara ,  Kazutoshi Tomiyoshi ,  Yoshio Fujimura

    IPC分类号： C08G77/42 ,  C08L63/00 ,  C08L83/10 ,  H01B3/36 ,  H01B3/40 ,  H01B3/46

    CPC分类号： H01B3/46 ,  C08G77/42 ,  C08L63/00 ,  C08L83/10 ,  H01B3/36 ,  H01B3/40

    摘要： The present invention provides a novel epoxy resin-based curable composition suitable for use as an encapsulating resin composition for semiconductor devices capable of being highly resistant against crack formation with low internal stress by curing and yet having very high heat conductivity and maintaining high glass transition temperature. The inventive composition comprises (a) 100 parts by weight of a curable epoxy resin blend which is a mixture of an epoxy resin and a curing agent therefor, (b) from 5 to 100 parts by weight of a block copolymer composed of at least one segment of an aromatic polymeric moiety, phenyl novolac, and at least one segment of an organopolysiloxane moiety having 30 to 200 silicon atoms and bonded to the aromatic polymeric moiety through a carbon-to-silicon linkage, and optionally (c) an inorganic filler which is preferably a silica filler such as powdered quartz in an amount not exceeding 1000 parts by weight.

    摘要翻译： 本发明提供一种适用于半导体器件的封装树脂组合物的新型环氧树脂类固化性组合物，能够通过固化而具有低内应力的高裂纹形成，并具有非常高的导热性和保持高的玻璃化转变温度 。 本发明的组合物包含（a）100重量份作为环氧树脂和其固化剂的混合物的可固化环氧树脂共混物，（b）5至100重量份的由至少一种 芳族聚合物部分的段，苯基酚醛清漆和至少一个具有30-200个硅原子的有机聚硅氧烷部分，并通过碳 - 硅键连接到芳族聚合物部分，和任选地（c）无机填料， 优选为不超过1000重量份的二氧化硅填料，例如石英粉末。