公开(公告)号：US06927343B2

公开(公告)日：2005-08-09

申请号：US10266866

申请日：2002-10-09

申请人： Naoyuki Watanabe ,  Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Daisuke Koizumi ,  Takafumi Hashitani

发明人： Naoyuki Watanabe ,  Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Daisuke Koizumi ,  Takafumi Hashitani

IPC分类号： G01R1/06 ,  G01R1/073 ,  H01L21/66 ,  H01R13/24 ,  H05K1/00

CPC分类号： G01R1/07314 ,  G01R1/06716 ,  H01R12/52 ,  H01R12/714 ,  H01R13/24

摘要： A contactor has a film substrate of an insulating material and plural wiring patterns on the substrate. A first end of each wiring pattern extends out from a first edge of the substrate as a first contact terminal and a second end of each wiring pattern extends out from a second edge of the substrate as a second contact terminal, and a part of the contactor located between the first end and second end can be deformed resiliently.

摘要翻译： 接触器具有绝缘材料的薄膜基板和基板上的多个布线图案。 每个布线图案的第一端作为第一接触端子从基板的第一边缘延伸出来，并且每个布线图案的第二端作为第二接触端子从基板的第二边缘延伸出来，并且接触器的一部分 位于第一端部和第二端部之间的弹性体可以弹性变形。

公开(公告)号：US06882169B2

公开(公告)日：2005-04-19

申请号：US10685542

申请日：2003-10-16

申请人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama

发明人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama

IPC分类号： G01R31/302 ,  G01R31/308 ,  H05K3/32 ,  G01R31/02 ,  H01R9/00

CPC分类号： G01R31/308 ,  G01R31/302 ,  H01L2924/0002 ,  H05K3/326 ,  H01L2924/00

摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed there in at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.

摘要翻译： 半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。 该测试装置包括：绝缘基板，其在与球形连接端子的位置相对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部， 至少所述连接部分可变形并延伸到所述开口中。

公开(公告)号：US08671557B2

公开(公告)日：2014-03-18

申请号：US13242647

申请日：2011-09-23

申请人： Daisuke Koizumi ,  Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Naoyuki Watanabe

发明人： Daisuke Koizumi ,  Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Naoyuki Watanabe

IPC分类号： B23P19/00

CPC分类号： B25B27/14 ,  H05K7/1061 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53943

摘要： A tray is provided in combination with an electronic component attaching tool attached to the tray and includes an attachment depression part that includes an inner wall and to which an electronic component is attached, wherein forming of the inner wall of the attachment depression part does not substantially depend on an external shape of the electronic component, and a standard part formed in the inner wall of the attachment depression part and engaging with a first structure part of the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to a first position of the tray using the electronic component attaching tool, the standard part having a shape which does not substantially depend on the external shape of the electronic component.

摘要翻译： 托盘与附接到托盘上的电子部件连接工具组合地提供，并且包括附接凹陷部分，该附件凹陷部分包括内壁并且附接有电子部件，其中，附接凹陷部分的内壁的形成基本上不 取决于电子部件的外部形状，以及形成在安装凹部的内壁中的标准部分，并与电子部件安装工具的第一结构部分接合，以将电子部件安装工具的位置对准到标准 当使用电子部件安装工具将电子部件的位置与托盘的第一位置对准时，标准部件具有基本上不依赖于电子部件的外形的形状。

公开(公告)号：US07161370B2

公开(公告)日：2007-01-09

申请号：US11046883

申请日：2005-02-01

申请人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama

发明人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama

IPC分类号： G01R31/26

CPC分类号： G01R31/308 ,  G01R31/302 ,  H01L2924/0002 ,  H05K3/326 ,  H01L2924/00

摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.

摘要翻译： 半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。 该测试装置包括：绝缘基板，其在与球形连接端子的位置对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部， 所述连接部分至少可变形并延伸到所述开口中。

公开(公告)号：US20060097356A1

公开(公告)日：2006-05-11

申请号：US11062488

申请日：2005-02-23

申请人： Shigeru Fujii ,  Yoshikazu Arisaka ,  Hitoshi Izuru ,  Kazuhiro Tashiro ,  Shigeyuki Maruyama

发明人： Shigeru Fujii ,  Yoshikazu Arisaka ,  Hitoshi Izuru ,  Kazuhiro Tashiro ,  Shigeyuki Maruyama

IPC分类号： H01L23/544

CPC分类号： H01L21/78 ,  H01L23/544 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor substrate eliminates a restriction caused by a width of scribe lines so as to increase a number of semiconductor elements formed on the semiconductor substrate. A plurality of semiconductor element areas are formed by forming a plurality of unit exposed and printed areas, each of which contains the semiconductor element areas. A first scribe line extends between the semiconductor element areas formed within the unit exposed and printed area. A second scribe line extends between the unit exposed and printed areas. A width of the first scribe line is different from a width of the second scribe line.

摘要翻译： 半导体衬底消除了由划线的宽度引起的限制，从而增加形成在半导体衬底上的半导体元件的数量。 多个半导体元件区域通过形成多个单位曝光和印刷区域而形成，每个单元暴露和印刷区域都包含半导体元件区域。 第一刻划线在形成在单元曝光和印刷区域内的半导体元件区域之间延伸。 第二划线在单元曝光和打印区域之间延伸。 第一划线的宽度与第二划线的宽度不同。

公开(公告)号：US07430798B2

公开(公告)日：2008-10-07

申请号：US11126246

申请日：2005-05-11

申请人： Daisuke Koizumi ,  Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Naoyuki Watanabe

发明人： Daisuke Koizumi ,  Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Naoyuki Watanabe

IPC分类号： B23P19/00 ,  H01L21/44

CPC分类号： B25B27/14 ,  H05K7/1061 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53943

摘要： An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.

摘要翻译： 准备适用于半导体器件外形的电子部件安装工具。 电子部件安装工具具有将半导体器件的位置与IC插座对准的功能。 电子部件安装工具安装在形成在IC插座上的标准表面上，基本上与半导体器件的外部形状无关。 然后通过使用电子部件安装工具将半导体器件对准并附接到IC插座，并且将电子部件附接工具从IC插座移除。 准备适用于另一半导体器件的外部形状的另一个电子部件附接工具，并且执行与上述相同的步骤以将该半导体器件对准并附接到相同类型的IC插座。

公开(公告)号：US07403024B2

公开(公告)日：2008-07-22

申请号：US10900362

申请日：2004-07-28

申请人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Naoyuki Watanabe ,  Daisuke Koizumi ,  Takafumi Hashitani ,  Ei Yano

发明人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Naoyuki Watanabe ,  Daisuke Koizumi ,  Takafumi Hashitani ,  Ei Yano

IPC分类号： G01R31/26

CPC分类号： G01R1/06716 ,  G01R1/06733 ,  G01R1/07357 ,  G01R3/00

摘要： A contactor has contact electrodes elastically deformable in a direction of thickness of the contactor so that the contactor can make a contact with a semiconductor device with an appropriate contact pressure. The contactor is positioned between the semiconductor device and a test board so as to electrically connect the semiconductor device to the test board. Each of a plurality of contact electrodes has a first contact electrode part, a second contact electrode part and a connecting part electrically connecting the first contact electrode part to the second contact electrode part. The first contact electrode part contacts an electrode of the semiconductor device. The second contact electrode part contacts a terminal of the test board. A combining member has an insulating characteristic and holds the connecting part of each of the contact electrodes in a predetermined arrangement.

摘要翻译： 接触器具有可在接触器的厚度方向上弹性变形的接触电极，使得接触器能够以适当的接触压力与半导体器件接触。 接触器位于半导体器件和测试板之间，以将半导体器件电连接到测试板。 多个接触电极中的每一个具有第一接触电极部分，第二接触电极部分和将第一接触电极部分电连接到第二接触电极部分的连接部分。 第一接触电极部分接触半导体器件的电极。 第二接触电极部分接触测试板的端子。 组合构件具有绝缘特性，并且以预定的布置保持每个接触电极的连接部分。

公开(公告)号：US07355421B2

公开(公告)日：2008-04-08

申请号：US11339826

申请日：2006-01-26

申请人： Shigeyuki Maruyama ,  Yoshikazu Arisaka ,  Kazuhiro Tashiro ,  Takayuki Katayama ,  Tetsu Ozawa ,  Yuushin Kimura

发明人： Shigeyuki Maruyama ,  Yoshikazu Arisaka ,  Kazuhiro Tashiro ,  Takayuki Katayama ,  Tetsu Ozawa ,  Yuushin Kimura

IPC分类号： G01R31/02 ,  G01R31/26 ,  G06K5/04

CPC分类号： G01R1/0433

摘要： A semiconductor apparatus testing arrangement for testing a plurality of semiconductor devices produced on a semiconductor substrate, has a substrate on which a plurality of testing units are arranged, each unit comprising a probe needles corresponding to electrode terminals of the semiconductor device and electric conductor parts connected with the probe needles.

摘要翻译： 一种用于测试在半导体衬底上制造的多个半导体器件的半导体器件测试装置，具有布置有多个测试单元的衬底，每个单元包括与半导体器件的电极端子相对应的探针和连接的导体部件 用探针。

公开(公告)号：US20060279003A1

公开(公告)日：2006-12-14

申请号：US11439119

申请日：2006-05-24

申请人： Shigeyuki Maruyama ,  Yasuyuki Itoh ,  Tetsurou Honda ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Kenichi Nagashige ,  Yoshiyuki Yoneda ,  Hirohisa Matsuki

发明人： Shigeyuki Maruyama ,  Yasuyuki Itoh ,  Tetsurou Honda ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Kenichi Nagashige ,  Yoshiyuki Yoneda ,  Hirohisa Matsuki

IPC分类号： H01L23/544

CPC分类号： H01L22/12 ,  G01R31/2891 ,  H01L21/67282 ,  H01L21/6838 ,  H01L22/32 ,  H01L23/544 ,  H01L24/97 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/5448 ,  H01L2223/54493 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  Y10T29/49998 ,  Y10T279/11 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.

摘要翻译： 半导体器件具有可以被常规晶片探测器识别的对准标记。 再分布层将半导体器件的电极连接到位于再分布层的预定位置的电极焊盘。 在再分配层的电极焊盘上形成配置有外部连接电极的金属柱。 在再分布层上形成由与金属柱相同的材料制成的标记构件。 标记构件用作与金属柱形成预定位置关系的对准标记。

公开(公告)号：US07145250B2

公开(公告)日：2006-12-05

申请号：US11113063

申请日：2005-04-25

申请人： Shigeyuki Maruyama ,  Toru Nishino ,  Kazuhiro Tashiro

发明人： Shigeyuki Maruyama ,  Toru Nishino ,  Kazuhiro Tashiro

IPC分类号： H01L29/40 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L23/49838 ,  G01R31/2886 ,  H01L21/6835 ,  H01L22/32 ,  H01L24/48 ,  H01L24/72 ,  H01L24/81 ,  H01L2221/68354 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15173 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An LSI package comprises an LSI element and a wiring board. The plurality of pin terminals of the LSI element each includes a first conductive layer and a second conductive layer superposed on the first conductive layer. The plurality of pin terminals of the wiring board each includes a third conductive layer joined to the second conductive layer, and the wiring board further comprises outer joining terminals. The first, second, and third conductive layers are made of materials causing the metallic bond between the second conductive layer and third conductive layer to be stronger than the metallic bond between the first conductive layer and second conductive layer. The LSI element is tested using the outer joining terminals of the wiring board. The second conductive layer and third conductive layer are joined to attain a metallic bond through aggregation derived from pressure, and are reliably brought into electrical contact with each other for a test. After the test is completed, the terminals of the LSI element are peeled off from the terminals of the wiring board. At this time, the second conductive layer is transferred to the third conductive layer, and the first conductive layer is left intact in each of the terminals of the LSI element. The LSI element is then mounted on another wiring board.

摘要翻译： LSI封装包括LSI元件和布线板。 LSI元件的多个引脚端子各自包括叠置在第一导电层上的第一导电层和第二导电层。 布线基板的多个引脚端子各自包括接合到第二导电层的第三导电层，并且布线板还包括外连接端子。 第一，第二和第三导电层由使得第二导电层和第三导电层之间的金属键合比第一导电层和第二导电层之间的金属键更强的材料制成。 使用布线板的外部接合端子来测试LSI元件。 第二导电层和第三导电层被接合以通过来自压力的聚集获得金属键，并且可靠地彼此进行电接触以进行测试。 测试完成后，LSI元件的端子从布线板的端子剥离。 此时，第二导电层被转移到第三导电层，并且第一导电层在LSI元件的每个端子中保持完整。 然后将LSI元件安装在另一个布线板上。