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    SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    21.
    发明申请
    SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权

    公开(公告)号：US20090317932A1

    公开(公告)日：2009-12-24

    申请号：US12548907

    申请日：2009-08-27

    申请人： Yasushi Maruyama ,  Hideshi Abe ,  Hiroyuki Mori

    发明人： Yasushi Maruyama ,  Hideshi Abe ,  Hiroyuki Mori

    IPC分类号： H01L21/50

    CPC分类号： H01L27/14645 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14658 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/14689

    摘要： A solid-state imaging device having a high sensitivity and a structure in which a miniaturized pixel is obtained, and a method for manufacturing the solid-state imaging device in which an interface is stable, a spectroscopic characteristic is excellent and which can be manufactured with a high yield ratio are provided. The solid-state imaging device includes at least a silicon layer formed with a photo sensor portion and a wiring layer formed on the front-surface side of the silicon layer, and in which light L is made to enter from the rear-surface side opposite to the front-surface side of the silicon layer and the thickness of the silicon layer 4 is 10 μm or less. Also, the method for manufacturing the solid-state imaging device at least includes the steps of: forming a semiconductor region of a photo sensor portion in a silicon layer of a layered substrate in which a silicon substrate, an intermediate layer and a silicon layer are laminated; bonding a first supporting substrate onto the silicon layer; removing the silicon substrate and the intermediate layer; forming thereafter a wiring portion above the silicon layer; bonding a second supporting substrate onto the wiring portion, and removing the first supporting substrate to make the silicon layer exposed.

    SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    22.
    发明申请
    SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权

    公开(公告)号：US20090315134A1

    公开(公告)日：2009-12-24

    申请号：US12548931

    申请日：2009-08-27

    申请人： Yasushi Maruyama ,  Hideshi Abe ,  Hiroyuki Mori

    发明人： Yasushi Maruyama ,  Hideshi Abe ,  Hiroyuki Mori

    IPC分类号： H01L33/00

    CPC分类号： H01L27/14645 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14658 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/14689

    摘要： A solid-state imaging device having a high sensitivity and a structure in which a miniaturized pixel is obtained, and a method for manufacturing the solid-state imaging device in which an interface is stable, a spectroscopic characteristic is excellent and which can be manufactured with a high yield ratio are provided. The solid-state imaging device includes at least a silicon layer formed with a photo sensor portion and a wiring layer formed on the front-surface side of the silicon layer, and in which light L is made to enter from the rear-surface side opposite to the front-surface side of the silicon layer and the thickness of the silicon layer 4 is 10 μm or less. Also, the method for manufacturing the solid-state imaging device at least includes the steps of: forming a semiconductor region of a photo sensor portion in a silicon layer of a layered substrate in which a silicon substrate, an intermediate layer and a silicon layer are laminated; bonding a first supporting substrate onto the silicon layer; removing the silicon substrate and the intermediate layer; forming thereafter a wiring portion above the silicon layer; bonding a second supporting substrate onto the wiring portion, and removing the first supporting substrate to make the silicon layer exposed.

    SYSTEMS AND METHODS FOR MANIPULATING LIQUID FILMS ON SEMICONDUCTOR SUBSTRATES
    25.
    发明申请
    SYSTEMS AND METHODS FOR MANIPULATING LIQUID FILMS ON SEMICONDUCTOR SUBSTRATES 有权
    用于在半导体衬底上操作液膜的系统和方法

    公开(公告)号：US20090068848A1

    公开(公告)日：2009-03-12

    申请号：US12272500

    申请日：2008-11-17

    申请人： Paul D. Shirley ,  Hiroyuki Mori

    发明人： Paul D. Shirley ,  Hiroyuki Mori

    IPC分类号： H01L21/30

    CPC分类号： H01L21/6715

    摘要： A semiconductor substrate undergoing processing to fabricate integrated circuit devices thereon is spun about a rotational axis while introducing liquid onto a surface of the substrate. An annular-shaped sheet of liquid is formed on the surface, the sheet of liquid having an inner diameter defining a liquid-free void. The size of a diameter of the void is reduced by manipulation of the annular-shaped sheet of liquid. The void may then be enlarged until the surface is substantially dry. The annular-shaped sheet of liquid may be formed and altered by selectively moving a contact area on the surface of the substrate on which the liquid is introduced. Systems for processing a substrate and configured to deposit and manipulate a sheet of liquid thereon are also disclosed.

    摘要翻译： 在其上制造集成电路器件的处理的半导体衬底围绕旋转轴旋转，同时将液体引入到衬底的表面上。 在表面上形成环状的液体片，该液体片具有限定无液体空隙的内径。 通过操作环形片状液体来减小空隙直径的大小。 然后可以扩大空隙，直到表面基本上干燥。 可以通过选择性地移动在其上引入液体的基板的表面上的接触区域来形成和改变环形片状液体。 还公开了用于处理基板并且被配置为在其上沉积和操纵一片液体的系统。

    RESIN COMPOSITION
    27.
    发明申请
    RESIN COMPOSITION 失效
    树脂组合物

    公开(公告)号：US20090005475A1

    公开(公告)日：2009-01-01

    申请号：US11830276

    申请日：2007-07-30

    申请人： Noritaka Sato ,  Tsutomu Noguchi ,  Hiroyuki Mori

    发明人： Noritaka Sato ,  Tsutomu Noguchi ,  Hiroyuki Mori

    IPC分类号： C08K5/3417

    CPC分类号： C07D263/58 ,  C07D209/46 ,  C07D417/14 ,  C08K5/3417 ,  C08L67/04

    摘要： Moldings made with a polyester resin which comprises a cyclic compound represented by a following formula A1-B-A2 (In the formula, A1 and A2 are the same or different and show groups represented by a below-described formula, P shows a benzene ring which may be replaced by a material, and B shows a bivalent hydrocarbon group which may be replaced by a material) and polyester capable of having a crystal structure.

    摘要翻译： 使用包含由下式表示的环状化合物的聚酯树脂制成的模制品：在线式描述=“In-line formula”end =“lead”→> A1-B-A2 <βin-line-formula （式中，A 1和A 2相同或不同，表示由下述式表示的基团，P表示苯环，可以被 材料，B表示可被材料代替的二价烃基）和能够具有晶体结构的聚酯。

    Lens barrel and image capturing apparatus
    30.
    发明申请
    Lens barrel and image capturing apparatus 失效
    镜筒和摄像装置

    公开(公告)号：US20080024888A1

    公开(公告)日：2008-01-31

    申请号：US11825127

    申请日：2007-07-03

    申请人： Kazuhiro Hattori ,  Hiroyuki Mori

    发明人： Kazuhiro Hattori ,  Hiroyuki Mori

    IPC分类号： G02B7/04

    CPC分类号： G02B7/102

    摘要： The present invention may provide a lens barrel which may include a guide shaft, and a movable lens frame. The barrel may be with an image capturing optical system disposed therein. The guide shaft may be disposed in the barrel and may extend parallel to the optical axis of the image capturing optical system. The movable lens frame may be reciprocally movable along the guide shaft in the barrel and holding lenses of the image capturing optical system. The barrel may include a wall supporting the guide shaft. The wall may include a light shield member projecting therefrom along the guide shaft in covering relation to a surface of the guide shaft which faces the optical axis.

    摘要翻译： 本发明可以提供一种镜筒，其可以包括导向轴和可移动透镜框。 枪管可以具有设置在其中的摄像光学系统。 引导轴可以设置在镜筒中并且可以平行于图像拍摄光学系统的光轴延伸。 可移动透镜框架可以沿着镜筒中的引导轴和摄像光学系统的保持透镜往复移动。 枪管可以包括支撑引导轴的壁。 壁可以包括沿着导向轴从其突出的遮光构件，该遮光构件与导向轴的面向光轴的表面相关。