摘要:
A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.
摘要:
A device and method for providing illuminating light utilizes quantum dots to convert at least some of the original light emitted from a light source of the device to longer wavelength light to change the color characteristics of the illuminating light. The quantum dots may be included in the light source, a light panel and/or an optional interface medium of the device.
摘要:
A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.
摘要:
A variable focal length light source is constructed using a tunable focus length lens which can be adjusted in synchronization to the focal length of a camera lens. In one embodiment, a deformable lens is used in conjunction with an LED light source to provide the tunable focal length required for a camera flash device.
摘要:
A LED device including a first encapsulant that at least partially encapsulates a LED and resides within a light reflecting cavity, and a second encapsulant residing above the first encapsulant—wherein the first encapsulant is partially comprised of a first percentage of a first light reflecting substance. In addition, there is provided a method for constructing a LED device.
摘要:
A light source and method for programming the light source to provide a color that approximates that of a target light source are disclosed. The light source generates light at first and second wavelengths with intensities that are determined by first and second control signals that are set by a feedback controller that matches the outputs of a monitoring circuit to target signals. The target signals are generated from target values that are entered into the feedback controller by exposing the light source to the target light source and observing the outputs from a set of photodetectors incorporated in the light source. In one embodiment, the photodetectors in the monitoring circuit are used for this programming function.
摘要:
The invention relates to an adhesive attaching method for attaching a semiconductor die to a substrate in which an adhesive is deposited onto the substrate, the deposited adhesive is partially cured and/or dried, the partially cured and/or dried adhesive is reheated and a semiconductor die is placed onto the reheated adhesive, after which the adhesive is fully cured so that the semiconductor die is bonded, both electrically and mechanically, to the substrate.
摘要:
A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.
摘要:
A lighting apparatus having wavelength-converting materials formed in a carrier layer is disclosed. In one embodiment, the lighting apparatus has a light source attached to a substrate that is assembled in a housing. The light source is configured to emit a substantially narrow band light that is transformed into broad-spectrum white light by the wavelength-converting materials positioned on the carrier layer. The wavelength-converting materials and the carrier layer are distanced away from the light source, such that the carrier layer is thermally isolated from the light source.
摘要:
Light sources are disclosed herein. One embodiment comprises a substrate having a first surface and a second surface located opposite the first surface. At least one first electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. At least one second electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. A light emitter is affixed to the first surface of the substrate in an area not covered by either of the at least one first electrically conductive layer or the at least one second electrically conductive layer. The substrate may be thinner in the area where the light emitter is affixed than in the areas where the first and second electrically conductive layers are affixed. A heat sink may be attached to the second surface of the substrate.