公开(公告)号：US20050012131A1

公开(公告)日：2005-01-20

申请号：US10604344

申请日：2003-07-14

Applicant: Yinan Chen ,  Ming-Cheng Chang ,  Jeng-Ping Lin ,  Tse-Yao Huang ,  Chang-Rong Wu ,  Hui-Min Mao

Inventor： Yinan Chen ,  Ming-Cheng Chang ,  Jeng-Ping Lin ,  Tse-Yao Huang ,  Chang-Rong Wu ,  Hui-Min Mao

IPC: H01L21/108 ,  H01L21/334 ,  H01L21/8242 ,  H01L27/108 ,  H01L29/94

CPC classification number: H01L27/10864 ,  H01L27/10832 ,  H01L29/66181 ,  H01L29/945

Abstract: A novel trench-capacitor DRAM cell structure is disclosed. The trench-capacitor DRAM cell of this invention includes an active area island having a horizontal semiconductor surface and a vertical sidewall contiguous with the horizontal semiconductor surface. A pass transistor is disposed at the corner of the active area island. The pass transistor includes a folded gate conductor strip extending from the horizontal semiconductor surface to the vertical sidewall of the active area island, a source formed in the horizontal semiconductor surface, a drain formed in the vertical sidewall, and a gate oxide layer underneath the folded gate conductor strip. The source and drain define a folded channel. The trench-capacitor DRAM cell further includes a trench capacitor that is insulated from the folded gate conductor strip by a trench top oxide (TTO) layer and is coupled to the pass transistor via the drain.

Abstract translation: 公开了一种新颖的沟槽电容器DRAM单元结构。 本发明的沟槽电容器DRAM单元包括具有水平半导体表面的有源区域岛和与水平半导体表面邻接的垂直侧壁。 传输晶体管设置在有源区域岛的拐角处。 传输晶体管包括从水平半导体表面延伸到有源区岛的垂直侧壁的折叠栅极导体条，形成在水平半导体表面中的源，在垂直侧壁中形成的漏极和在折叠的下面的栅极氧化物层 栅极导体条。 源极和漏极限定折叠通道。 沟槽电容器DRAM单元还包括沟槽电容器，其通过沟槽顶部氧化层（TTO）层与折叠的栅极导体条绝缘，并且经由漏极耦合到传输晶体管。

公开(公告)号：US07622770B2

公开(公告)日：2009-11-24

申请号：US12021969

申请日：2008-01-29

Applicant: Jeng-Ping Lin ,  Pei-Ing Lee

Inventor： Jeng-Ping Lin ,  Pei-Ing Lee

IPC: H01L27/108 ,  H01L29/76

CPC classification number: H01L29/7834 ,  H01L27/10876 ,  H01L29/42368 ,  H01L29/66621

Abstract: A method of fabricating a semiconductor device having a trench gate is provided. First, a semiconductor substrate having a trench etch mask thereon is provided. The semiconductor substrate is etched to form a first trench having a first depth using the trench etch mask as a shield. Impurities are doped into the semiconductor substrate through the first trench to form a doped region. The doped region and the semiconductor substrate underlying the first trench are etched to form a second trench having a second depth greater than the first depth, wherein the second trench has a sidewall and a bottom. A gate insulating layer is formed on the sidewall and the bottom of the second trench. A trench gate is formed in the second trench.

Abstract translation: 提供一种制造具有沟槽栅极的半导体器件的方法。 首先，提供其上具有沟槽蚀刻掩模的半导体衬底。 蚀刻半导体衬底以形成具有第一深度的第一沟槽，使用沟槽蚀刻掩模作为屏蔽。 杂质通过第一沟槽掺杂到半导体衬底中以形成掺杂区域。 蚀刻第一沟槽下面的掺杂区域和半导体衬底以形成具有大于第一深度的第二深度的第二沟槽，其中第二沟槽具有侧壁和底部。 栅极绝缘层形成在第二沟槽的侧壁和底部上。 沟槽栅极形成在第二沟槽中。

公开(公告)号：US20090114968A1

公开(公告)日：2009-05-07

申请号：US12167231

申请日：2008-07-02

Applicant: Jer-Chyi Wang ,  Tieh-Chiang Wu ,  Chung-Yuan Lee ,  Jeng-Ping Lin

Inventor： Jer-Chyi Wang ,  Tieh-Chiang Wu ,  Chung-Yuan Lee ,  Jeng-Ping Lin

IPC: H01L21/265 ,  H01L29/78 ,  H01L27/108

CPC classification number: H01L21/26506 ,  H01L21/26586 ,  H01L27/10876 ,  H01L29/4236 ,  H01L29/42368 ,  H01L29/66621

Abstract: A recessed-gate transistor device includes a gate electrode embedded in a gate trench formed in a semiconductor substrate, wherein the gate trench includes a vertical sidewall and a U-shaped bottom. A source region is provided at one side of the gate trench within the semiconductor substrate. A drain region is provided at the other side thereof. An asymmetric gate dielectric layer is formed between the gate electrode and the semiconductor substrate. The asymmetric gate dielectric layer has a first thickness between the gate electrode and the drain region and a second thickness between the gate electrode and the source region, wherein the first thickness is thicker than the second thickness.

Abstract translation: 凹入栅极晶体管器件包括嵌入在半导体衬底中形成的栅极沟槽中的栅电极，其中栅极沟槽包括垂直侧壁和U形底部。 源区域设置在半导体衬底内的栅极沟槽的一侧。 漏极区域设置在其另一侧。 在栅电极和半导体衬底之间形成非对称栅介质层。 不对称栅极介电层在栅电极和漏极区之间具有第一厚度，并且在栅极和源极区之间具有第二厚度，其中第一厚度比第二厚度厚。

公开(公告)号：US20070138545A1

公开(公告)日：2007-06-21

申请号：US11491704

申请日：2006-07-24

Applicant: Jeng-Ping Lin ,  Pei-Ing Lee

Inventor： Jeng-Ping Lin ,  Pei-Ing Lee

IPC: H01L29/94 ,  H01L21/336

CPC classification number: H01L29/7834 ,  H01L27/10876 ,  H01L29/42368 ,  H01L29/66621

Abstract: A method of fabricating a semiconductor device having a trench gate is provided. First, a semiconductor substrate having a trench etch mask thereon is provided. The semiconductor substrate is etched to form a first trench having a first depth using the trench etch mask as a shield. Impurities are doped into the semiconductor substrate through the first trench to form a doped region. The doped region and the semiconductor substrate underlying the first trench are etched to form a second trench having a second depth greater than the first depth, wherein the second trench has a sidewall and a bottom. A gate insulating layer is formed on the sidewall and the bottom of the second trench. A trench gate is formed in the second trench.

Abstract translation: 提供一种制造具有沟槽栅极的半导体器件的方法。 首先，提供其上具有沟槽蚀刻掩模的半导体衬底。 蚀刻半导体衬底以形成具有第一深度的第一沟槽，使用沟槽蚀刻掩模作为屏蔽。 杂质通过第一沟槽掺杂到半导体衬底中以形成掺杂区域。 蚀刻第一沟槽下面的掺杂区域和半导体衬底以形成具有大于第一深度的第二深度的第二沟槽，其中第二沟槽具有侧壁和底部。 栅极绝缘层形成在第二沟槽的侧壁和底部上。 沟槽栅极形成在第二沟槽中。

公开(公告)号：US07144799B2

公开(公告)日：2006-12-05

申请号：US11101007

申请日：2005-04-06

Applicant: Yinan Chen ,  Jeng-Ping Lin ,  Feng-Chuan Lin

Inventor： Yinan Chen ,  Jeng-Ping Lin ,  Feng-Chuan Lin

IPC: H01L21/44

CPC classification number: H01L21/76897 ,  H01L21/76895 ,  H01L27/10888

Abstract: Disclosed is a method for pre-retaining CB opening in a DRAM manufacture process, wherein a CB opening is filed with a photo-resist layer and an LPD oxidation layer that is filled at room temperature to avoid damaging caused by conventional etching techniques. The LPD oxidation layer and the photo-resist are replaced easily by a polysilicon layer and a BPSG layer.

Abstract translation: 公开了一种用于在DRAM制造工艺中预保留CB开口的方法，其中CB开口与在室温下填充的光致抗蚀剂层和LPD氧化层一起提供以避免由常规蚀刻技术引起的损坏。 LPD氧化层和光致抗蚀剂容易被多晶硅层和BPSG层所替代。

公开(公告)号：US07005698B2

公开(公告)日：2006-02-28

申请号：US10668902

申请日：2003-09-23

Applicant: Chi-Hui Lin ,  Jeng-Ping Lin ,  Pei-Ing Lee ,  Jih-Chang Lien

Inventor： Chi-Hui Lin ,  Jeng-Ping Lin ,  Pei-Ing Lee ,  Jih-Chang Lien

IPC: H01L29/788

CPC classification number: H01L27/115 ,  H01L27/11553 ,  H01L29/42324 ,  H01L29/7885

Abstract: A split gate flash memory cell. The memory cell includes a substrate, a conductive line, source/drain regions, an insulating layer, a conductive spacer, an insulating stud, a first conductive layer, and a first insulating spacer. The conductive line is disposed in a lower portion of the trench of the substrate. The source region is formed in the substrate adjacent to an upper portion of the conductive line having the insulating layer thereon. The conductive spacer is disposed on the upper sidewall of the trench serving as a floating gate. The insulating stud is disposed on the insulating layer. The first conductive layer is disposed over the substrate adjacent to the conductive spacer serving as a control gate. The first insulating spacer is disposed on the sidewall of the insulating stud to cover the first conductive layer. The drain region is formed in the substrate adjacent to the first conductive layer.

Abstract translation: 分闸门闪存单元。 存储单元包括基板，导线，源极/漏极区，绝缘层，导电间隔物，绝缘柱，第一导电层和第一绝缘间隔物。 导线设置在衬底的沟槽的下部。 源极区域形成在与其上具有绝缘层的导电线的上部相邻的衬底中。 导电间隔物设置在用作浮动栅极的沟槽的上侧壁上。 绝缘支柱设置在绝缘层上。 第一导电层设置在与用作控制栅极的导电间隔物相邻的衬底上。 第一绝缘间隔件设置在绝缘螺柱的侧壁上以覆盖第一导电层。 漏极区域形成在与第一导电层相邻的衬底中。

公开(公告)号：US20050082590A1

公开(公告)日：2005-04-21

申请号：US10972505

申请日：2004-10-25

Applicant: Ming-Cheng Chang ,  Tieh-Chiang Wu ,  Yi-Nan Chen ,  Jeng-Ping Lin

Inventor： Ming-Cheng Chang ,  Tieh-Chiang Wu ,  Yi-Nan Chen ,  Jeng-Ping Lin

IPC: H01L21/334 ,  H01L21/8242 ,  H01L27/108

CPC classification number: H01L27/1087 ,  H01L27/10832 ,  H01L27/10864 ,  H01L27/10867 ,  H01L27/10876 ,  H01L27/10888 ,  H01L29/66181

Abstract: A dynamic random access memory (DRAM) cell layout for arranging deep trenches and active areas and a fabrication method thereof. An active area comprises two vertical transistors, a common bitline contact and two deep trenches. The first vertical transistor is formed on a region where the first deep trench is partially overlapped with the first gate conductive line. The second vertical transistor is formed on a region where the second deep trench is partially overlapped with the second gate conductive line.

公开(公告)号：US06801462B2

公开(公告)日：2004-10-05

申请号：US10612857

申请日：2003-07-03

Applicant: Ming Cheng Chang ,  Jeng-Ping Lin ,  Tie Jiang Wu

Inventor： Ming Cheng Chang ,  Jeng-Ping Lin ,  Tie Jiang Wu

IPC: G11C700

CPC classification number: H01L27/10894 ,  G11C11/401 ,  G11C29/02 ,  G11C29/025 ,  H01L22/34 ,  H01L27/10861 ,  H01L27/10873 ,  H01L27/10891 ,  H01L27/10897

Abstract: A test device and method for detecting alignment of word lines and deep trench capacitors in DRAM devices. In the test device, parallel first and second bar-type deep trenches capacitors are disposed in the scribe line region. The first and second bar-type deep trenches capacitors extend to the first and second pairs of memory cells in the memory region adjacent to the first active area respectively. The first and second bar-type deep trenches capacitors are electrically coupled to bit line contacts of the first and second pairs of memory cells respectively. First and second transistors have sources coupled to the first and second bar-type deep trenches capacitors respectively. A first bit line contact is electrically coupled to drains of the first and second transistors.

Abstract translation: 用于检测DRAM器件中的字线和深沟槽电容器的对准的测试装置和方法。 在测试装置中，平行的第一和第二条形深沟槽电容器设置在划线区域中。 第一和第二条形深沟槽电容器分别延伸到与第一有效区域相邻的存储器区域中的第一和第二对存储单元。 第一和第二条形深沟槽电容器分别电耦合到第一和第二对存储器单元的位线触点。 第一和第二晶体管分别具有耦合到第一和第二条形深沟槽电容器的源极。 第一位线接触件电耦合到第一和第二晶体管的漏极。

公开(公告)号：US06788598B2

公开(公告)日：2004-09-07

申请号：US10448661

申请日：2003-05-30

Applicant: Ming-Cheng Chang ,  Tie-Jiang Wu ,  Jeng-Ping Lin ,  Tse-Main Kuo ,  Hsu-Cheng Fan

Inventor： Ming-Cheng Chang ,  Tie-Jiang Wu ,  Jeng-Ping Lin ,  Tse-Main Kuo ,  Hsu-Cheng Fan

IPC: G11C700

CPC classification number: H01L27/10861 ,  G11C11/401 ,  G11C29/50 ,  G11C2029/5002 ,  G11C2029/5004 ,  H01L22/34 ,  H01L27/0207 ,  H01L27/10891 ,  H01L29/66181

Abstract: A test key disposed on a scribe line of a wafer. The test key includes: two active areas disposed on the substrate; two first deep trench capacitors disposed on the substrate outside the two active areas; a rectangular active word line disposed on the substrate covering the first deep trench capacitors and the active areas; first and second passing word lines disposed on one side of the rectangular active word line and across the parallel active areas; a third passing word line disposed on another side of the rectangular active word line and across another end of the two active areas; two second deep trench capacitors disposed on the substrate under where the two first passing word lines overlap the two active areas; and four contacts disposed on the first active areas between the first and second word lines and between the third and the rectangular active word line.

公开(公告)号：US20130075812A1

公开(公告)日：2013-03-28

申请号：US13239389

申请日：2011-09-22

Applicant: Hsin-Jung Ho ,  Jeng-Ping Lin ,  Neng-Tai Shih ,  Chang-Rong Wu ,  Chiang-Hung Lin ,  Chih-Huang Wu

Inventor： Hsin-Jung Ho ,  Jeng-Ping Lin ,  Neng-Tai Shih ,  Chang-Rong Wu ,  Chiang-Hung Lin ,  Chih-Huang Wu

IPC: H01L29/78

CPC classification number: H01L21/823431 ,  H01L21/845 ,  H01L27/10826 ,  H01L27/10879 ,  H01L29/66795 ,  H01L29/785

Abstract: A single-sided access device includes an active fin structure comprising a source contact area and a drain contact area separated from each other by an isolation region therebetween; a trench isolation structure disposed at one side of the active fin structure, wherein the trench isolation structure intersects with the isolation region between the source contact area and the drain contact area; a sidewall gate disposed under the isolation region and on the other side of the active fin structure opposite to the trench isolation structure so that the active fin structure is sandwiched by the trench isolation structure and the sidewall gate, wherein the sidewall gate has multi-fingers that engage with the active fin structure; and a gate dielectric layer between the sidewall gate and the active fin structure.

Abstract translation: 单面存取装置包括活动鳍片结构，其包括源极接触区域和通过它们之间的隔离区域彼此分离的漏极接触区域; 沟槽隔离结构，设置在所述有源鳍结构的一侧，其中所述沟槽隔离结构与所述源极接触区域和所述漏极接触区域之间的隔离区域相交; 侧壁门，其设置在所述隔离区域下方并且在所述有源鳍结构的另一侧与所述沟槽隔离结构相对，使得所述有源鳍结构被所述沟槽隔离结构和所述侧壁栅极夹持，其中所述侧壁门具有多指 与活跃的鳍结构互动; 以及在侧壁浇口和活性鳍结构之间的栅介质层。