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    LIGHT-EMITTING DIODE PACKAGE
    21.
    发明申请
    LIGHT-EMITTING DIODE PACKAGE 审中-公开
    发光二极管封装

    公开(公告)号：US20170069809A1

    公开(公告)日：2017-03-09

    申请号：US15227067

    申请日：2016-08-03

    Applicant: Lextar Electronics Corporation

    Inventor： Jo-Shung Chen ,  Chih-Hao Lin ,  Tzong-Liang Tsai

    IPC: H01L33/62 ,  H01L33/50 ,  H01L33/60

    CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/16245 ,  H01L2933/0066

    Abstract: A light-emitting diode package is provided. The light-emitting diode package includes a lead-frame, a reflective cup and a die. The lead-frame is made of a silver-free material. The reflective cup has the cavity. The die is disposed on the lead-frame in a face-down orientation, and is further electrically connected to the lead-frame and located within the cavity.

    Abstract translation: 提供了一种发光二极管封装。 发光二极管封装包括引线框架，反射杯和模具。 引线框由无银材料制成。 反射杯有空腔。 模具以正面朝下的方式设置在引线框架上，并且进一步电连接到引线框架并且位于空腔内。

    Light emitting diode packaging structure
    23.
    发明授权
    Light emitting diode packaging structure 有权

    公开(公告)号：US11949056B2

    公开(公告)日：2024-04-02

    申请号：US18303578

    申请日：2023-04-20

    Applicant: Lextar Electronics Corporation

    Inventor： Chih-Hao Lin ,  Jo-Hsiang Chen ,  Shih-Lun Lai ,  Min-Che Tsai ,  Jian-Chin Liang

    IPC: H01L33/62 ,  H01L33/00 ,  H01L33/58

    CPC classification number: H01L33/62 ,  H01L33/0095 ,  H01L33/58 ,  H01L2933/0058 ,  H01L2933/0066

    Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, micro light emitting elements, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting elements are disposed on the first adhesive layer and have a first surface facing to the first adhesive layer and an opposing second surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting elements and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A thickness of the flexible substrate is less than 100 um.

    Display device and driving method thereof
    24.
    发明授权
    Display device and driving method thereof 有权

    公开(公告)号：US11948497B2

    公开(公告)日：2024-04-02

    申请号：US17446459

    申请日：2021-08-30

    Applicant: Lextar Electronics Corporation

    Inventor： Chih-Hao Lin ,  Chien-Nan Yeh ,  Jo-Hsiang Chen ,  Shih-Lun Lai

    IPC: G09G3/20 ,  C09K11/02 ,  G09G3/32 ,  H10K59/35 ,  H10K59/38

    CPC classification number: G09G3/32 ,  G09G3/2014 ,  G09G3/2074 ,  G09G2320/0242 ,  G09G2330/12

    Abstract: A display device includes a plurality of sub-pixels. The sub-pixels include a first sub-pixel and a second sub-pixel. The first sub-pixel includes a first light emitting element and a first control circuit. The first control circuit is configured to provide a first driving current to the first light emitting element. The second sub-pixel includes a second light emitting element and a second control circuit. The second control circuit is configured to provide a second driving current to the second light emitting element. The first control circuit and the second control circuit are configured to differently control pulse amplitude of the first driving current and pulse amplitude of the second driving current, such that both of the first light emitting element and the second light emitting element emit at a target wavelength or a color point range (e.g. +/−1.5˜2 nm).

    LIGHT EMITTING DIODE CHIP SCALE PACKAGING STRUCTURE AND DIRECT TYPE BACKLIGHT MODULE
    26.
    发明申请
    LIGHT EMITTING DIODE CHIP SCALE PACKAGING STRUCTURE AND DIRECT TYPE BACKLIGHT MODULE 审中-公开

    公开(公告)号：US20180102459A1

    公开(公告)日：2018-04-12

    申请号：US15722368

    申请日：2017-10-02

    Applicant: Lextar Electronics Corporation

    Inventor： Che-Hsuan Huang ,  Hsin-Lun Su ,  Shu-Hsiu Chang ,  Chih-Hao Lin ,  Tzong-Liang Tsai

    IPC: H01L33/08

    CPC classification number: H01L33/08 ,  H01L33/50 ,  H01L33/56 ,  H01L2933/0091

    Abstract: A light emitting diode chip scale packaging structure and a direct type backlight module are disclosed. The light emitting diode chip scale packaging structure includes a light emitting diode chip, a wavelength converting layer, a diffusion structure and a lens. The wavelength converting layer is disposed on the light emitting diode chip and directly contacting the light emitting diode chip, and the wavelength converting layer includes phosphor powders. The diffusion structure covers the light emitting diode chip and the wavelength converting layer, a ratio of a height of the diffusion structure to a width of the diffusion structure is 1:2 to 5:4, and the lens covers the diffusion structure. An outer surface of the lens is a free-form surface, and a material of the lens is different from a material of the diffusion structure.

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