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    Semiconductor package
    21.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US10553526B2

    公开(公告)日：2020-02-04

    申请号：US15460583

    申请日：2017-03-16

    Applicant: MEDIATEK, INC.

    Inventor： Wen-Sung Hsu ,  Tzu-Hung Lin ,  Ta-Jen Yu

    IPC: H01L23/498 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

    Abstract: A semiconductor package is provided. In one configuration, the semiconductor package includes a substrate having a die attach surface. A conductive trace is disposed on the substrate, wherein the conductive trace is elongated and carries a signal or a ground across at least a portion of the substrate. A die is mounted on the die attach surface of the substrate via a conductive pillar bump, the conductive pillar bump being rounded and elongated such that the conductive pillar bump extends along a length of the conductive trace and contacts the conductive trace at an end or at an intermediate portion thereof. The die further includes a metal pad electrically coupling to the conductive pillar bump, wherein the metal pad has a first edge and a second edge substantially vertical to the first edge, and wherein the first edge is not adjacent to the second edge.

    Semiconductor package
    22.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US10312210B2

    公开(公告)日：2019-06-04

    申请号：US15949868

    申请日：2018-04-10

    Applicant: MediaTek Inc.

    Inventor： Ching-Liou Huang ,  Ta-Jen Yu

    IPC: H01L23/498 ,  H01L23/00 ,  H01L21/683 ,  H01L23/31

    Abstract: The invention provides a semiconductor package. The semiconductor package includes a base having a device-attach surface and a solder-ball attach surface opposite to the device-attach surface. A conductive via is disposed passing through the base. The conductive via includes a first terminal surface aligned to the device-attach surface of the base. A semiconductor die is mounted on the base by a conductive structure. The conductive structure is in contact with the first terminal surface of the conductive via.

    Chip package and package substrate
    23.
    发明授权
    Chip package and package substrate 有权

    公开(公告)号：US10236242B2

    公开(公告)日：2019-03-19

    申请号：US15817780

    申请日：2017-11-20

    Applicant: MediaTek Inc.

    Inventor： Wen-Sung Hsu ,  Ta-Jen Yu

    IPC: H01L23/04 ,  H01L21/44 ,  H01L23/498 ,  H01L23/50 ,  H01L23/538 ,  H05K1/18 ,  H05K3/20

    Abstract: A package substrate is provided. The package substrate includes a dielectric layer and a passive component embedded in the dielectric layer and contacting the dielectric layer. A circuit layer is embedded in the dielectric layer and has a first surface aligned with a second surface of the dielectric layer. A conductive structure is embedded in the dielectric layer and electrically connected to the passive component and the circuit layer. A chip package is also provided.

    CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
    28.
    发明申请
    CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME 有权

    公开(公告)号：US20220392839A1

    公开(公告)日：2022-12-08

    申请号：US17886704

    申请日：2022-08-12

    Applicant: MediaTek Inc.

    Inventor： Yen-Yao Chi ,  Nai-Wei Liu ,  Ta-Jen Yu ,  Tzu-Hung Lin ,  Wen-Sung Hsu

    IPC: H01L23/528 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/00

    Abstract: A semiconductor package structure including a semiconductor die having a first surface, a second surface opposite the first surface, and a third surface adjoined between the first surface and the second surface. A first protective insulating layer covers the first and third surfaces of the semiconductor die. A redistribution layer (RDL) structure is electrically coupled to the semiconductor die and surrounded by the first protective insulating layer on the first surface of the semiconductor die. A first passivation layer covers the first protective insulating layer and the RDL structure. At least one conductive structure passes through the first passivation layer and is electrically coupled to the RDL structure. A method of forming the semiconductor package is also provided.

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