公开(公告)号：US08729403B2

公开(公告)日：2014-05-20

申请号：US13232338

申请日：2011-09-14

申请人： Daisuke Yasukawa ,  Kazuhiko Nakano ,  Hirofumi Watanabe ,  Atsushi Yamaguchi

发明人： Daisuke Yasukawa ,  Kazuhiko Nakano ,  Hirofumi Watanabe ,  Atsushi Yamaguchi

IPC分类号： H05K1/11 ,  H05K1/16 ,  H01R9/00 ,  H01R13/40

CPC分类号： H05K3/3468 ,  H05K3/3447

摘要： First and second terminals project from a circuit board and lie adjacent to each other with an interspace formed between the first and second terminals. An electronic apparatus further includes a projecting member projecting along a neighboring terminal which is one of the first and second terminals at such a position that the neighboring terminal is located between the projecting member and the interspace. The projecting member is located at an adjacent position adjacent to the neighboring terminal, to attract molten solder from the interspace toward the projecting member during soldering to join the first and second terminals to the circuit board.

摘要翻译： 第一和第二端子从电路板突出并且彼此相邻并且在第一和第二端子之间形成间隙。 一种电子设备还包括一个突出部件，该突出部件沿相邻端子突出，该相邻端子是相邻端子位于突出部件和间隙之间的位置上的第一端子和第二端子之一。 突出构件位于与相邻端子相邻的相邻位置，以在焊接期间将熔融焊料从间隙吸引到突出构件，以将第一和第二端子连接到电路板。

公开(公告)号：US20130294997A1

公开(公告)日：2013-11-07

申请号：US13978980

申请日：2012-01-13

申请人： Atsushi Fukunaga ,  Shoichiro Sakai ,  Koji Nitta ,  Atsushi Yamaguchi ,  Masatoshi Majima ,  Shinji Inazawa

发明人： Atsushi Fukunaga ,  Shoichiro Sakai ,  Koji Nitta ,  Atsushi Yamaguchi ,  Masatoshi Majima ,  Shinji Inazawa

IPC分类号： C01B21/086

CPC分类号： C01B21/086 ,  C01B21/093 ,  H01M10/0525 ,  H01M10/0568

摘要： KN(SO2F)2 is synthesized by adding HN(SO2Cl)2 dropwise to KF to form an intermediate product, and then allowing the intermediate product and KF to react with each other in an aqueous solvent.

摘要翻译： 通过向KF中滴加HN（SO2Cl）2以形成中间产物，然后使中间产物和KF在水性溶剂中彼此反应来合成KN（SO 2 F）2。

公开(公告)号：US08540903B2

公开(公告)日：2013-09-24

申请号：US12744994

申请日：2008-11-21

申请人： Takayuki Higuchi ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Arata Kishi ,  Naomichi Ohashi

发明人： Takayuki Higuchi ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Arata Kishi ,  Naomichi Ohashi

IPC分类号： H01B1/02 ,  H01B1/22 ,  H01B1/12 ,  H05K3/20 ,  H05K3/30 ,  H05K1/00 ,  H05K1/18 ,  H05K7/00

CPC分类号： H05K3/321 ,  H01B1/22 ,  H05K2201/0272 ,  H05K2203/0425 ,  Y10T29/49128 ,  Y10T29/4913

摘要： Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.

摘要翻译： 公开了一种导电性糊剂，其能够通过使用导电性糊料，在电路板的电子部件的实施中使导电性糊剂固化后的接合部形成的导电路径中的空隙生长水平降低， 其含有减少量的粘度调节/触变性添加剂。 选择具有不同熔点和不同平均粒径的两种含Sn的低熔点合金颗粒作为用于导电浆料的导电填料组分，并将两种合金颗粒以预定的比例混合使用。

公开(公告)号：US20130202942A1

公开(公告)日：2013-08-08

申请号：US13879962

申请日：2011-10-19

申请人： Shoichiro Sakai ,  Atsushi Fukunaga ,  Atsushi Yamaguchi ,  Koji Nitta ,  Masatoshi Majima ,  Shinji Inazawa

发明人： Shoichiro Sakai ,  Atsushi Fukunaga ,  Atsushi Yamaguchi ,  Koji Nitta ,  Masatoshi Majima ,  Shinji Inazawa

IPC分类号： H01M2/26 ,  H01M2/18 ,  H01M10/39

CPC分类号： H01M2/266 ,  H01M2/18 ,  H01M2/263 ,  H01M10/0459 ,  H01M10/3909 ,  H01M10/3981 ,  H01M10/399 ,  H01M2300/0048

摘要： A molten-salt battery is provided with rectangular plate-like negative electrodes (21) and rectangular plate-like positive electrodes (41) each housed in a bag-shaped separator (31). The negative electrodes (21) and positive electrodes (41) are arranged laterally and alternately in a standing manner. A lower end of a rectangular tab (22) for collecting current is joined to an upper end of each negative electrode (21) close to a side wall (1A) of a container body (1). The upper ends of the tabs (22) are joined to the lower surface of a rectangular plate-like tab lead (23). A lower end of a rectangular tab (42) for collecting current is joined to an upper end of each positive electrode (41) close to a side wall (1B) of the container body (1). The upper ends of the tabs (42) are joined to the lower surface of a rectangular plate-like tab lead (43).

摘要翻译： 熔盐电池设置有矩形板状负极（21）和矩形板状的正极（41），各自容纳在袋状隔板（31）中。 负极（21）和正极（41）以直立的方式横向和交替地布置。 用于收集电流的矩形突片（22）的下端接合到靠近容器主体（1）的侧壁（1A）的每个负极（21）的上端。 突片（22）的上端与矩形板状突片引线（23）的下表面接合。 用于收集电流的矩形突片（42）的下端接合到靠近容器主体（1）的侧壁（1B）的每个正电极（41）的上端。 突片（42）的上端部与矩形的板状突片（43）的下表面接合。

公开(公告)号：US20130171513A1

公开(公告)日：2013-07-04

申请号：US13823595

申请日：2011-09-27

申请人： Masatoshi Majima ,  Koji Nitta ,  Atsushi Fukunaga ,  Shoichiro Sakai ,  Atsushi Yamaguchi ,  Shinji Inazawa

发明人： Masatoshi Majima ,  Koji Nitta ,  Atsushi Fukunaga ,  Shoichiro Sakai ,  Atsushi Yamaguchi ,  Shinji Inazawa

IPC分类号： H01M10/39

CPC分类号： H01M10/399 ,  H01M4/661

摘要： Provided is a molten salt battery whose cycle life is improved by using an electrolyte that is unlikely to cause corrosion of aluminum. In the molten salt battery of the present invention, the total concentration of iron ions and nickel ions contained as impurities in the electrolyte composed of a molten salt is set to be 0.1% by weight or less, preferably 0.01% by weight or less. Because of the low total concentration of iron ions and nickel ions contained in the electrolyte, corrosion of the electrode current collector composed of aluminum is inhibited, and the cycle life of the molten salt battery is improved.

摘要翻译： 提供一种通过使用不可能引起铝腐蚀的电解质来改善循环寿命的熔盐电池。 在本发明的熔盐电池中，由熔融盐构成的电解质中作为杂质含有的铁离子和镍离子的总浓度为0.1重量％以下，优选为0.01重量％以下。 由于电解液中含有的铁离子和镍离子的总浓度低，所以抑制了由铝构成的电极集电体的腐蚀，提高了熔融盐电池的循环寿命。

公开(公告)号：US20130130124A1

公开(公告)日：2013-05-23

申请号：US13812546

申请日：2011-07-25

申请人： Atsushi Fukunaga ,  Shinji Inazawa ,  Masatoshi Majima ,  Atsushi Yamaguchi ,  Koji Nitta ,  Shoichiro Sakai

发明人： Atsushi Fukunaga ,  Shinji Inazawa ,  Masatoshi Majima ,  Atsushi Yamaguchi ,  Koji Nitta ,  Shoichiro Sakai

IPC分类号： H01M4/66 ,  H01M4/04

CPC分类号： H01M4/661 ,  H01M4/0402 ,  H01M4/387 ,  H01M4/667 ,  H01M4/80 ,  H01M4/808 ,  H01M10/39

摘要： A main object is to produce a porous metal body that can be used as a battery electrode, in particular, that can be used as a negative electrode of a molten-salt battery using sodium. The porous metal body includes a hollow metal skeleton composed of a metal layer containing nickel or copper as a main component, and an aluminum covering layer that covers at least an outer surface of the metal skeleton. The porous metal body further includes a tin covering layer that covers the aluminum covering layer, and is used as a battery electrode. Preferably, the porous metal body has continuous pores due to a three-dimensional network structure thereof, and has a porosity of 90% or more.

摘要翻译： 主要的目的是制造可用作电池电极的多孔金属体，特别是可以用作使用钠的熔盐电池的负极。 多孔金属体包括由以镍或铜为主要成分的金属层构成的中空金属骨架以及覆盖金属骨架的至少外表面的铝覆盖层。 多孔金属体还包括覆盖铝覆盖层的锡覆盖层，并且用作电池电极。 优选地，多孔金属体由于其三维网状结构而具有连续的孔，并且具有90％以上的孔隙率。

公开(公告)号：US08410377B2

公开(公告)日：2013-04-02

申请号：US12260219

申请日：2008-10-29

申请人： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Shigeaki Sakatani ,  Koso Matsuno

发明人： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Shigeaki Sakatani ,  Koso Matsuno

IPC分类号： H01L23/28

CPC分类号： H05K3/3484 ,  B23K35/264 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/284 ,  H05K3/321 ,  H05K3/3463 ,  H01L2924/3512 ,  H01L2924/00

摘要： A plurality of semiconductor elements is adjacently mounted on a substrate by a solder with a melting point of 200° C. or lower, an electronic part other than the semiconductor elements is mounted on the substrate between the adjacently mounted semiconductor elements by a solder with a melting point of 200° C. or lower, and spaces between the plurality of semiconductor elements and the substrate, spaces between the electronic part and the substrate, and spaces between the plurality of semiconductor elements and the electronic part are integrally molded with a molding resin.

摘要翻译： 多个半导体元件通过熔点为200℃以下的焊料相邻地安装在基板上，除了半导体元件之外的电子部件通过焊料与相邻安装的半导体元件之间的基板安装在基板上 熔点为200℃以下，多个半导体元件与基板之间的空间，电子部件与基板之间的空间以及多个半导体元件与电子部件之间的空间与成形树脂一体成型 。

公开(公告)号：US20120320539A1

公开(公告)日：2012-12-20

申请号：US13580856

申请日：2011-04-07

申请人： Hiroe Kowada ,  Atsushi Yamaguchi

发明人： Hiroe Kowada ,  Atsushi Yamaguchi

IPC分类号： H05K7/00 ,  B23K31/02 ,  H05K13/04

CPC分类号： H01L23/293 ,  H01L21/56 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/98 ,  H01L2224/2732 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/2939 ,  H01L2224/3201 ,  H01L2224/32013 ,  H01L2224/32058 ,  H01L2224/32059 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2224/83951 ,  H05K3/284 ,  H05K3/288 ,  H05K3/3489 ,  H05K2203/0228 ,  H05K2203/0264 ,  H05K2203/176 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01029

摘要： A package structure including an electronic component 2 mounted on a circuit board 1 with a bonding metal 3, wherein a flux 4 contains a compound having a hydroxyl group and remains on the surface of the bonding metal 3, a coating resin 5 contains 10% to 50% by weight of isocyanate, and a reactant 8 of the coating resin 5 and the flux 4 is formed at an interface between the flux 4 and the coating resin 5. Water resistance and moisture resistance can be obtained without cleaning the flux 4. The coating resin 5 can be easily peeled off at a temperature not lower than the glass transition point temperature of the flux 4.

摘要翻译： 一种封装结构，其包括安装在具有接合金属3的电路板1上的电子部件2，其中焊剂4含有具有羟基的化合物并保留在接合金属3的表面上，涂布树脂5含有10％〜 50重量％的异氰酸酯，并且涂料树脂5和助熔剂4的反应物8形成在助熔剂4和涂料树脂5之间的界面处。可以在不清洗助焊剂4的情况下获得耐水性和耐湿性。 涂布树脂5可以在不低于焊剂4的玻璃化转变点温度的温度下容易地剥离。

公开(公告)号：US08217275B2

公开(公告)日：2012-07-10

申请号：US12517311

申请日：2007-12-03

申请人： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Kousou Matsuno

发明人： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Kousou Matsuno

IPC分类号： H05K1/00

CPC分类号： H01L21/563 ,  C08G59/4021 ,  C08L63/00 ,  C09K3/10 ,  C09K2200/0645 ,  C09K2200/0647 ,  C09K2200/065 ,  H01L23/293 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  Y02P20/582 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49726 ,  H01L2924/00

摘要： A sealing material is provided which has sealing characteristics with low stress and high reliability upon mounting electronic parts on a board, and good repairablity after the sealing. The sealing material contains a heat-curable resin component and is characterized by ΔE/ΔT in a range of from 0.5 MPa/° C. to 30 MPa/° C. wherein ΔE/ΔT represents a ratio of change (ΔE) in storage elastic modulus (E) relative to a temperature change (ΔT) when the storage elastic modulus (E) is determined as the temperature is raised within a temperature range including a glass transition point (Tg) of the cured sealing material.

摘要翻译： 提供了一种密封材料，其在将电子部件安装在基板上时具有低应力和高可靠性的密封特性，并且在密封之后具有良好的可维修性。 密封材料含有热固性树脂组分，其特征在于：在0.5MPa /℃至30MPa /℃的范围内，其中＆Dgr; E /＆Dgr; T表示比例 的变化（＆Dgr; E）相对于温度变化（＆Dgr; T）的储存弹性模量（E），当储存弹性模量（E）在包括玻璃化转变点（Tg） ）固化的密封材料。

公开(公告)号：US08205327B2

公开(公告)日：2012-06-26

申请号：US12094219

申请日：2006-11-13

申请人： Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Kazuhiro Nishikawa ,  Kunio Hibino

发明人： Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Kazuhiro Nishikawa ,  Kunio Hibino

IPC分类号： H05K3/30

CPC分类号： H05K3/323 ,  H05K3/321 ,  Y10T29/49114 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49165

摘要： A method for manufacturing a circuit board on which an electronic component is mounted, includes at least the steps of (a) supplying a liquid photo-polymerizable adhesive containing conductive particles dispersed therein to a surface of a printed board, to form an adhesive layer on the board surface; (b) irradiating the photo-polymerizable adhesive with ultraviolet light to turn into a gel, to provide adhesiveness to the adhesive layer; and (c) pressing the electronic component against the component mounting portion of the printed board from an upper surface side of the adhesive layer, to form an electrical connection between the electronic component and the component mounting portion, and in the method, the photo-polymerizable adhesive is a delayed reactive adhesive.

摘要翻译： 一种制造其上安装有电子部件的电路板的方法至少包括以下步骤：（a）将包含分散在其中的导电粒子的液体光聚合性粘合剂供应到印刷电路板的表面上，以形成粘合剂层 板表面; （b）用紫外线照射光聚合性粘合剂变成凝胶，以提供粘合剂层的粘附性; 以及（c）从粘合剂层的上表面侧将电子部件压靠在印刷基板的部件安装部上，形成电子部件与部件安装部之间的电连接，在该方法中， 可聚合粘合剂是延迟的反应性粘合剂。