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    SEMICONDUCTOR DEVICE
    21.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开
    半导体器件

    公开(公告)号：US20070063334A1

    公开(公告)日：2007-03-22

    申请号：US11469225

    申请日：2006-08-31

    申请人： Kenji Otani ,  Masahiro Tsuji

    发明人： Kenji Otani ,  Masahiro Tsuji

    IPC分类号： H01L23/48

    CPC分类号： H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/5286 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/4554

    摘要： In order to minimize a distance from a power supply line and/or a ground line of a semiconductor integrated circuit of a semiconductor device to electrodes of a printed board, at least either a power supply electrode or the ground line of the semiconductor integrated circuit is connected to a metal film through openings provided in a protective film over the power supply electrode. The metal film is exposed on a side of the semiconductor device, adjacent to a printed board on which the semiconductor device is mounted, or on a side thereof, opposite from the printed board, and the metal film is connected a power supply electrode and/or a ground electrode of the printed board through the exposed surface of the metal film. Alternatively, upper and lower metal films connected to each other, with a stress relief film interposed therebetween, may be disposed in place of the metal film, or a metal sheet may be disposed over the metal film. Further, in order to minimize the length of a heat radiation path of the semiconductor integrated circuit of the semiconductor device, the protective film is deposited on the semiconductor integrated circuit, and the metal film is exposed on the side of the semiconductor device, adjacent to the printed board on which the semiconductor device is mounted, or on the side thereof, opposite from the printed board, thereby effecting heat radiation. Alternatively, the upper and lower metal films connected to each other, with the stress relief film interposed therebetween, may be disposed in place of the metal film, or a metal sheet functioning as a heat sink is disposed over the metal film.

    摘要翻译： 为了最小化从半导体器件的半导体集成电路的电源线和/或接地线到印刷电路板的电极的距离，至少半导体集成电路的电源电极或接地线是 通过设置在电源电极上的保护膜中的开口连接到金属膜。 金属膜暴露在与半导体器件安装的印刷电路板相邻的半导体器件的一侧上，或者与印刷电路板相对的侧面上，金属膜与电源电极和/ 或印刷电路板的接地电极通过金属膜的暴露表面。 或者，可以设置彼此连接的上部和下部金属膜，其间插入有应力消除膜，以代替金属膜，或者可以在金属膜上设置金属片。 此外，为了使半导体器件的半导体集成电路的散热路径的长度最小化，保护膜沉积在半导体集成电路上，并且金属膜在半导体器件的侧面露出，邻近 安装有半导体器件的印刷电路板或其一侧与印刷电路板相对，从而实现热辐射。 或者，可以设置彼此连接的上部和下部金属膜，其间设置有应力消除膜，以代替金属膜，或者在金属膜上设置用作散热器的金属片。

    Aerosol composition containing middle-chain fatty acid triglyceride dispersant
    22.
    发明授权
    Aerosol composition containing middle-chain fatty acid triglyceride dispersant 失效
    含有中链脂肪酸甘油三酯分散剂的气溶胶组合物

    公开(公告)号：US06284226B1

    公开(公告)日：2001-09-04

    申请号：US09380601

    申请日：1999-09-14

    申请人： Hideki Ito ,  Masahiro Tsuji ,  Hiromitu Yoshida ,  Fumio Shimojo

    发明人： Hideki Ito ,  Masahiro Tsuji ,  Hiromitu Yoshida ,  Fumio Shimojo

    IPC分类号： A61K912

    CPC分类号： A61K9/008 ,  C07D405/06 ,  Y10S514/826

    摘要： An aerosol product comprising the following compound (A), a middle-chain fatty acid triglyceride and a liquefied hydrofluoroalkane is provided. In the production of an aerosol product using a liquefied hydrofluoroalkane as propellant, the use of a middle-chain fatty acid triglyceride as dispersant insures good dispersion of compound (A) in the propellant. The result is an aerosol product free from variation in the dispensed dose of compound (A).

    摘要翻译： 提供了包含以下化合物（A），中链脂肪酸甘油三酸酯和液化氢氟烷烃的气溶胶产品。 在使用液化氢氟烷烃作为推进剂的气溶胶产品的生产中，使用中链脂肪酸甘油三酯作为分散剂确保化合物（A）在推进剂中的良好分散。结果是在分配的情况下不含变化的气溶胶产品 化合物（A）的剂量。

    Efficient development of an electrostatic latent image
    23.
    发明授权
    Efficient development of an electrostatic latent image 失效
    静电潜像的高效发展

    公开(公告)号：US6016411A

    公开(公告)日：2000-01-18

    申请号：US94986

    申请日：1998-06-15

    申请人： Takahiko Kimura ,  Yoshiki Ichikawa ,  Jun Yamaguchi ,  Masahiro Tsuji ,  Yoshiaki Sanada

    发明人： Takahiko Kimura ,  Yoshiki Ichikawa ,  Jun Yamaguchi ,  Masahiro Tsuji ,  Yoshiaki Sanada

    IPC分类号： G03G15/08 ,  G03G15/09

    CPC分类号： G03G15/09 ,  G03G15/0898

    摘要： A developing apparatus comprises a development housing containing developer and disposed opposite to a carrier for carrying a latent image, and a developing roller rotatably provided in the development housing and rotatively driven in a predetermined direction. The developer in the development housing is carried by the developing roller and the developer carried by the developing roller is applied to the carrier through an opening formed in the development housing. A rotation speed F.beta. of the developing roller is higher than a movement speed F.alpha. of the carrier. A gap .beta. between an opening downstream side wall portion of the development housing and the developing roller is greater than a gap .alpha. between the opening downstream side wall portion and the carrier.

    摘要翻译： 一种显影装置，包括：显影壳体，其容纳显影剂并且与用于承载潜像的载体相对设置;以及显影辊，其可旋转地设置在显影壳体中并沿预定方向旋转驱动。 显影壳体中的显影剂由显影辊承载，并且由显影辊承载的显影剂通过形成在显影壳体中的开口施加到载体。 显影辊的旋转速度Fβ高于载体的移动速度Fα1。 显影壳体的开口下游侧壁部分和显影辊之间的间隙β大于开口下游侧壁部分和载体之间的间隙α。

    Packaging material for electronic components
    25.
    发明授权
    Packaging material for electronic components 失效
    电子元件包装材料

    公开(公告)号：US5698904A

    公开(公告)日：1997-12-16

    申请号：US782447

    申请日：1997-01-13

    申请人： Masahiro Tsuji

    发明人： Masahiro Tsuji

    IPC分类号： H01L23/29 ,  H01L23/31

    CPC分类号： H01L23/295 ,  H01L2924/0002

    摘要： A packaging material for electronic components is provided which inhibits the cracking of a passivation film on an encapsulated chip and inhibits the breaking of an interconnecting metallization pattern in a chip of an electronic component and meets the miniaturization trend for electronic components. The packaging material includes: a resin, and 80% to 93% by weight, relative to the total amount of the packaging material, of a filler made up of particles having an average particle size of 30 .mu.m or less, at least 90% by weight of which are spherically shaped or have rounded ends and/or edges.

    摘要翻译： 提供一种用于电子部件的包装材料，其抑制封装芯片上的钝化膜的破裂，并且抑制电子部件的芯片中的互连金属化图案的断裂，并且满足电子部件的小型化趋势。 包装材料包括：树脂，相对于包装材料的总量为80重量％至93重量％的由平均粒径为30μm以下的颗粒构成的填料为至少90重量％ 其重量为球形或具有圆形端部和/或边缘。

    Method of encapsulating semiconductor devices using a lead frame with resin tablets arranged on lead frame
    26.
    发明授权
    Method of encapsulating semiconductor devices using a lead frame with resin tablets arranged on lead frame 失效
    使用引线框将半导体器件封装在引线框架上的树脂片的封装方法

    公开(公告)号：US5672550A

    公开(公告)日：1997-09-30

    申请号：US584449

    申请日：1996-01-10

    申请人： Masahiro Tsuji ,  Osamu Miyata

    发明人： Masahiro Tsuji ,  Osamu Miyata

    IPC分类号： B29C45/02 ,  B29C45/14 ,  H01L21/56 ,  H01L21/60

    CPC分类号： B29C45/14655 ,  B29C45/02 ,  H01L21/565 ,  H01L24/97 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/181

    摘要： A method of manufacturing semiconductor devices in which a multi-series lead frame that is constructed so as to assemble semiconductor elements in a state that these elements are arrayed in a plurality of series along the longer sides of the lead frame, is set in a mold, and molding resin is injected into cavities of the mold, to thereby form packages for packing the semiconductor elements in a sealing manner. In the method, a resin tablet is positioned so that resin paths are extended at substantially equal lengths to the cavities on the lead frame set in the mold, and the molding resin is injected into the cavities disposed around the resin tablet by pressing the resin tablet with a plunger.

    摘要翻译： 一种半导体器件的制造方法，其中，将以这些元件沿引线框架的长边排列成多个串联状态的半导体元件构造的多串联引线框架设置在模具 ，将模塑树脂注入到模具的空腔中，从而形成用于以密封方式包装半导体元件的包装。 在该方法中，树脂片被定位成使得树脂路径以与模具中的引线框架上的空腔大致相等的长度延伸，并且通过压制树脂片将成型树脂注入设置在树脂片周围的空腔中 用柱塞。

    Film carrier and method of manufacturing same
    29.
    发明授权
    Film carrier and method of manufacturing same 失效
    电影载体及其制造方法

    公开(公告)号：US4908275A

    公开(公告)日：1990-03-13

    申请号：US160479

    申请日：1988-02-25

    申请人： Masahiro Tsuji ,  Susumu Kawauchi ,  Hiroshi Nakayama

    发明人： Masahiro Tsuji ,  Susumu Kawauchi ,  Hiroshi Nakayama

    IPC分类号： H01L23/498 ,  H05K1/00 ,  H05K1/09

    CPC分类号： H01L23/49866 ,  H05K1/09 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K2201/0355 ,  Y10S428/901 ,  Y10T29/49121 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31692

    摘要： There is provided a film carrier comprising a resin base film and a rolled copper foil laminated thereon, said rolled copper foil forming leads for mounting semiconductor chips or other electronic components in place, characterized in that said rolled copper foil is made of a copper alloy composition consisting essentially of a total of 0.005 to 1.5% by weight of one or two or more selected from a group consisting of______________________________________ P 0.005-0.05 wt %, B 0.005-0.05 wt %, Al 0.01-0.5 wt %, As 0.01-0.5 wt %, Cd 0.01-0.5 wt %, Co 0.01-0.5 wt %, Fe 0.01-0.5 wt %, In 0.01-0.5 wt %, Mg 0.01-0.5 wt %, Mn 0.01-0.5 wt %, Ni 0.01-0.5 wt %, Si 0.01-0.5 wt %, Sn 0.01-0.5 wt %, Te 0.01-0.5 wt %, Ag 0.01-1 wt %, Cr 0.01-1 wt %, Hf 0.01-1 wt %, Zn 0.01-1 wt % and Zn 0.01-1 wt % ______________________________________ and the remainder Cu with inevitable impurities, preferably with oxygen content of not more than 50 ppm. There is also provided a method for manufacturing a film carrier characterized in that the leads of the film carrier for mounting semiconductor chips or other electronic components in place are formed by the steps of providing a rolled copper alloy foil having the composition defined above, preferably strain relief annealing it after its final cold rolling and then laminating the annealed foil onto a resin base film followed by etching.