公开(公告)号：US20110061925A1

公开(公告)日：2011-03-17

申请号：US12654307

申请日：2009-12-16

申请人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park

发明人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park

IPC分类号： H05K9/00

CPC分类号： H05K1/0233 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0236 ,  H05K1/112 ,  H05K2201/086 ,  H05K2201/1003 ,  H01L2924/00014

摘要： Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure for blocking a noise is inserted into the printed circuit board. The electromagnetic bandgap structure can include a first conductive plate; a second conductive plate arranged on a planar surface that is different from that of the first conductive plate; a third conductive plate arranged on a planar surface that is different from that of the second conductive plate; and a stitching via unit configured to connect the first conductive plate and the third conductive plate by bypassing the planar surface on which the second conductive plate is arranged and including a first inductor element.

摘要翻译： 公开了一种包括电磁带隙结构的印刷电路板。 用于阻挡噪声的电磁带隙结构被插入到印刷电路板中。 电磁带隙结构可以包括第一导电板; 布置在与第一导电板不同的平面上的第二导电板; 布置在与第二导电板的平面不同的平面上的第三导电板; 以及缝合通孔单元，其被配置为通过旁路布置所述第二导电板的平面并且包括第一电感器元件来连接所述第一导电板和所述第三导电板。

公开(公告)号：US20080185179A1

公开(公告)日：2008-08-07

申请号：US12010872

申请日：2008-01-30

申请人： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

发明人： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

IPC分类号： H05K1/11

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/116 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09663 ,  H01L2224/0401

摘要： Disclosed are an electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit. The electromagnetic bandgap structure in which a first metal layer, a first dielectric layer, a second dielectric layer and a second metal layer are stacked can include a first metal plate, formed between the first dielectric layer and the second dielectric layer; a second metal plate, formed on a same planar surface as the first metal plate, accommodated into a hole which is formed in the first metal plate and electrically connected to the first metal plate through a metal line; and a via, connecting the second metal plate to any one of the first metal layer and the second metal layer. With the present invention, the electromagnetic bandgap structure can be not only miniaturized but also have a low bandgap frequency.

摘要翻译： 公开了一种能够解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 层叠有第一金属层，第一电介质层，第二电介质层和第二金属层的电磁带隙结构可以包括形成在第一电介质层和第二电介质层之间的第一金属板; 形成在与第一金属板相同的平面上的第二金属板，容纳在形成在第一金属板中并通过金属线电连接到第一金属板的孔中; 以及将第二金属板连接到第一金属层和第二金属层中的任一个的通孔。 利用本发明，电磁带隙结构不仅可以小型化，而且具有低带隙频率。

公开(公告)号：US08258408B2

公开(公告)日：2012-09-04

申请号：US12654545

申请日：2009-12-22

申请人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

发明人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00014

摘要： As a multi-layered board, an EMI noise reduction board, having an electromagnetic bandgap structure with band stop frequency properties inserted into an inner portion of the board, includes a first area, in which a ground layer and a power layer are formed, and a second area, placed on a side surface of the first area, in which it has the electromagnetic bandgap structure formed therein so as to shield an EMI noise radiated to the outside through the side surface of the first area. The electromagnetic bandgap structure includes a plurality of first conductive plates, placed along the edge of the board, a plurality of second conductive plates, disposed on a planar surface that is different from the first conductive plates such that the second conductive plates are alternately disposed with the first conductive plates, and a via, which connects the first conductive plates to the second conductive plates.

摘要翻译： 作为多层板，具有插入板的内部的具有带阻频率特性的电磁带隙结构的EMI降噪板包括形成有接地层和功率层的第一区域，以及 第二区域，放置在第一区域的侧表面上，其中形成有电磁带隙结构，以便屏蔽通过第一区域的侧表面辐射到外部的EMI噪声。 电磁带隙结构包括沿着板的边缘放置的多个第一导电板，设置在不同于第一导电板的平面上的多个第二导电板，使得第二导电板交替地布置有 第一导电板和将第一导电板连接到第二导电板的通孔。

公开(公告)号：US08242377B2

公开(公告)日：2012-08-14

申请号：US12654361

申请日：2009-12-17

申请人： Hyo-Jic Jung ,  Han Kim ,  Mi-Ja Han ,  Kang-Wook Bong ,  Dae-Hyun Park

发明人： Hyo-Jic Jung ,  Han Kim ,  Mi-Ja Han ,  Kang-Wook Bong ,  Dae-Hyun Park

IPC分类号： H05K9/00 ,  H05K1/11

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00014

摘要： Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductor and a second conductor arranged on different planar surfaces, a third conductor arranged on a same planar surface that is different from a planar surface where the second conductor is arranged, and a first stitching via unit configured to connect the first conductor to the third connector through the planar surface where the second conductor is arranged and being electrically separated from the second conductor. The first conductor can include a first plate, a second plate spaced from the first plate, and a second stitching unit configured to electrically connect the first plate to the second plate through a planar surface that is different from a planar surface where the first plate and the second plate are arranged.

摘要翻译： 公开了一种印刷电路板，其中插入用于阻挡噪声的电磁带隙结构。 电磁带隙结构可以包括布置在不同平面上的第一导体和第二导体，布置在与布置第二导体的平面不同的相同平面上的第三导体，以及第一缝合通孔单元， 通过布置第二导体的平面表面将第一导体连接到第三连接器，并与第二导体电分离。 第一导体可以包括第一板，与第一板间隔开的第二板，以及第二缝合单元，其被配置为通过与第一板和第二板的平坦表面不同的平面表面将第一板电连接到第二板 布置第二板。

公开(公告)号：US20110180312A1

公开(公告)日：2011-07-28

申请号：US13064541

申请日：2011-03-30

申请人： Han Kim ,  Je-Gwang Yoo ,  Mi-Ja Han ,  Dae-Hyun Park

发明人： Han Kim ,  Je-Gwang Yoo ,  Mi-Ja Han ,  Dae-Hyun Park

IPC分类号： H05K1/18

CPC分类号： H05K1/0231 ,  H01L2224/16225 ,  H05K1/0236 ,  H05K1/165 ,  H05K1/185 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09663 ,  H05K2201/10636 ,  H05K2201/10643 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49146

摘要： A printed circuit board having an embedded chip capacitor includes a first conductive layer; a second conductive layer, placed away from the first conductive layer; a chip capacitor, having a first electrode connected to the first conductive layer through being seated in a cavity formed between the first conductive layer and the second conductive layer; a filled material, filled in a space excluding a space occupied by the chip capacitor in the cavity; and a via, penetrating the filled material and connecting the second conductive layer to the second electrode of the chip capacitor.

摘要翻译： 具有嵌入式芯片电容器的印刷电路板包括：第一导电层; 远离所述第一导电层放置的第二导电层; 芯片电容器，其具有通过位于形成在第一导电层和第二导电层之间的空腔中而连接到第一导电层的第一电极; 填充材料，填充在空腔内不包括由片状电容器占据的空间的空间中; 以及通孔，穿透填充材料并将第二导电层连接到片式电容器的第二电极。

公开(公告)号：US20110067915A1

公开(公告)日：2011-03-24

申请号：US12654368

申请日：2009-12-17

申请人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

发明人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00014

摘要： An EMI noise reduction board is disclosed. The electromagnetic interference (EMI) noise reduction board having an electromagnetic bandgap structure for shielding a noise includes: a first area having a ground layer and a power layer; a second area placed in a side portion of the first area having an electromagnetic bandgap structure therein. The electromagnetic bandgap structure includes: a plurality of first conductive plates and a plurality of second conductive plates placed on a same planar surface along the side portion of the first area; and a stitching via configured to electrically connect the first conductive plate to the second conductive plate through a planar surface that is different from the first conductive plate and the second conductive plate.

摘要翻译： 公开了一种EMI降噪板。 具有用于屏蔽噪声的电磁带隙结构的电磁干扰（EMI）降噪板包括：具有接地层和功率层的第一区域; 放置在其中具有电磁带隙结构的第一区域的侧部的第二区域。 电磁带隙结构包括：多个第一导电板和沿着第一区域的侧面部分放置在同一平面上的多个第二导电板; 以及缝合通孔，其被构造成通过不同于所述第一导电板和所述第二导电板的平坦表面将所述第一导电板电连接到所述第二导电板。

公开(公告)号：US20110031007A1

公开(公告)日：2011-02-10

申请号：US12654545

申请日：2009-12-22

申请人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

发明人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00014

摘要： As a multi-layered board, an EMI noise reduction board, having an electromagnetic bandgap structure with band stop frequency properties inserted into an inner portion of the board, includes a first area, in which a ground layer and a power layer are formed, and a second area, placed on a side surface of the first area, in which it has the electromagnetic bandgap structure formed therein so as to shield an EMI noise radiated to the outside through the side surface of the first area. The electromagnetic bandgap structure includes a plurality of first conductive plates, placed along the edge of the board, a plurality of second conductive plates, disposed on a planar surface that is different from the first conductive plates such that the second conductive plates are alternately disposed with the first conductive plates, and a via, which connects the first conductive plates to the second conductive plates.

摘要翻译： 作为多层板，具有插入板的内部的具有带阻频率特性的电磁带隙结构的EMI降噪板包括形成有接地层和功率层的第一区域，以及 第二区域，放置在第一区域的侧表面上，其中形成有电磁带隙结构，以便屏蔽通过第一区域的侧表面辐射到外部的EMI噪声。 电磁带隙结构包括沿着板的边缘放置的多个第一导电板，设置在不同于第一导电板的平面上的多个第二导电板，使得第二导电板交替地布置有 第一导电板和将第一导电板连接到第二导电板的通孔。

公开(公告)号：US20080264685A1

公开(公告)日：2008-10-30

申请号：US12010437

申请日：2008-01-24

申请人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

发明人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

IPC分类号： H05K1/11 ,  H01F1/00

CPC分类号： H05K1/0236 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/115 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09781 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T428/12465

摘要： An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.

摘要翻译： 公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。

公开(公告)号：US20090236141A1

公开(公告)日：2009-09-24

申请号：US12285133

申请日：2008-09-29

申请人： Han Kim ,  Mi-Ja Han ,  Hyo-Jic Jung

发明人： Han Kim ,  Mi-Ja Han ,  Hyo-Jic Jung

IPC分类号： H05K1/02

CPC分类号： H01P1/2005 ,  H01L2224/16 ,  H01P1/203 ,  H05K1/0236 ,  H05K1/0237 ,  H05K2201/09309 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09663 ,  H05K2201/09681

摘要： According to an embodiment of the present invention, an electromagnetic bandgap structure can include: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate. In the electromagnetic bandgap structure of the present invetion, the first stitching via can electrically connect the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above the one conductive plate, and the second stitching via can electrically connect the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface below the one conductive plate.

摘要翻译： 根据本发明的实施例，电磁带隙结构可以包括：至少三个导电板; 第一缝合通孔，被配置为将任一导电板电连接到另一个导电板; 以及第二缝合通孔，其被配置为将所述一个导电板电连接到另一个导电板。 在本发明的电磁带隙结构中，第一缝合通孔可以通过允许第一缝合通孔的一部分通过一个导电板上的平面连接而将一个导电板电连接到另一个导电板， 缝合通孔可以通过允许第二缝合通孔的一部分通过一个导电板下面的平坦表面连接而将一个导电板电连接到另一个导电板。

公开(公告)号：US20090071709A1

公开(公告)日：2009-03-19

申请号：US12076650

申请日：2008-03-20

申请人： Mi-Ja Han ,  Han Kim ,  Ja-Bo Koo

发明人： Mi-Ja Han ,  Han Kim ,  Ja-Bo Koo

IPC分类号： H05K1/02

CPC分类号： H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09663

摘要： An electromagnetic bandgap structure and a printed circuit board that intercepts to transfer a signal having a predetermined frequency band are disclosed. In particularly, the electromagnetic bandgap structure includes a first metal layer and a second metal layer; a metal plate, placed between the first metal layer and a second metal layer; a multi-via, penetrating the first metal layer, passing through the same planar surface as an outer metal layer and turning toward the first metal layer to connect the metal plate and the first metal layer; and a dielectric layer, stacked in between the first metal layer and the metal plate, between the metal plate and the second metal layer and between the first metal layer and the outer metal layer. With the present invention, a bandgap frequency can be decreased without increasing the size of the metal plate.

摘要翻译： 公开了一种电磁带隙结构和用于传送具有预定频带的信号的印刷电路板。 特别地，电磁带隙结构包括第一金属层和第二金属层; 金属板，放置在第一金属层和第二金属层之间; 穿过第一金属层的多通孔，穿过与外部金属层相同的平面，并朝着第一金属层转动以连接金属板和第一金属层; 以及电介质层，层叠在所述第一金属层和所述金属板之间，所述金属板与所述第二金属层之间以及所述第一金属层与所述外部金属层之间。 通过本发明，可以在不增加金属板的尺寸的情况下降低带隙频率。