公开(公告)号：US10685933B2

公开(公告)日：2020-06-16

申请号：US15762066

申请日：2016-09-28

Applicant: NITTO DENKO CORPORATION

Inventor： Yuki Sugo ,  Nao Kamakura

IPC: H01L23/00 ,  H01L21/683 ,  C09J7/28 ,  C09J7/26 ,  C09J9/02 ,  C09J7/25 ,  C09J7/24 ,  C09J201/00 ,  C09J7/10 ,  C08K3/08 ,  C08K3/22 ,  H01L23/31

Abstract: A thermal bonding sheet includes a layer, in which an average area of a pore portion in a cross section of the layer after being heated at a heating rate of 1.5° C./sec from 80° C. to 300° C. under pressure of 10 MPa, and then held at 300° C. for 2.5 minutes is in a range of 0.005 μm2 to 0.5 μm2.

公开(公告)号：US10669452B2

公开(公告)日：2020-06-02

申请号：US15762515

申请日：2016-09-21

Applicant: NITTO DENKO CORPORATION

Inventor： Yuki Sugo ,  Nao Kamakura

IPC: H01L23/00 ,  H01L21/683 ,  C09J7/28 ,  C09J7/26 ,  C09J9/02 ,  C09J7/25 ,  C09J7/24 ,  C09J11/04 ,  C09J9/00 ,  C09J7/10 ,  H01L23/31 ,  C08K3/08 ,  C08K3/22

Abstract: Provided is a thermal bonding sheet which suppresses a compositional material of the thermal bonding sheet from protruding during bonding and from creeping up onto the surface of an object to be bonded, and provides a strong sintered layer after sintering. A thermal bonding sheet includes a layer. When the layer is analyzed by a differential thermal balance from 23° C. to 500° C. in an air atmosphere at a heating rate of 10° C./min, a value obtained by subtracting a weight decrease amount (%) at 300° C. from a weight decrease amount (%) at 500° C. is in a range of −1% to 0%.

公开(公告)号：US20190184460A1

公开(公告)日：2019-06-20

申请号：US16322086

申请日：2017-05-18

Applicant: NITTO DENKO CORPORATION

Inventor： Satoshi Honda ,  Yuki Sugo ,  Mayu Shimoda

IPC: B22F3/02 ,  H01L21/52 ,  H01L21/683 ,  H01L21/304 ,  C09J7/10

CPC classification number: B22F3/02 ,  B32B7/12 ,  B32B27/08 ,  B32B27/36 ,  B32B27/365 ,  C08F220/18 ,  C08K2201/001 ,  C09J7/10 ,  C09J7/22 ,  C09J7/30 ,  C09J9/02 ,  C09J11/04 ,  C09J133/066 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/106 ,  C23C28/00 ,  C23C28/04 ,  C23C28/30 ,  C23C28/34 ,  H01L21/3043 ,  H01L21/52 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  C08F2220/1858 ,  C08F220/20

Abstract: A sheet for heat bonding, having a pre-sintering layer that becomes a sintered layer by being heated, and an adhesion layer.

公开(公告)号：US20180277507A1

公开(公告)日：2018-09-27

申请号：US15762066

申请日：2016-09-28

Applicant: NITTO DENKO CORPORATION

Inventor： Yuki Sugo ,  Nao Kamakura

IPC: H01L23/00 ,  H01L21/683 ,  C09J7/28 ,  C09J7/26 ,  C09J9/02 ,  C09J7/25 ,  C09J7/24

Abstract: A thermal bonding sheet includes a layer, in which an average area of a pore portion in a cross section of the layer after being heated at a heating rate of 1.5° C./sec from 80° C. to 300° C. under pressure of 10 MPa, and then held at 300° C. for 2.5 minutes is in a range of 0.005 μm2 to 0.5 μm2.

公开(公告)号：US20180269175A1

公开(公告)日：2018-09-20

申请号：US15762070

申请日：2016-09-28

Applicant: NITTO DENKO CORPORATION

Inventor： Yuki Sugo ,  Nao Kamakura

IPC: H01L23/00 ,  H01L21/683 ,  H01L23/373 ,  C09J9/02 ,  C09J7/20 ,  C09J11/04

Abstract: A thermal bonding sheet includes a layer, in which hardness of the layer after being heated at a heating rate of 1.5° C./sec from 80° C. to 300° C. under pressure of 10 MPa, and then held at 300° C. for 2.5 minutes is in a range of 1.5 GPa to 10 GPa in measurement using a nanoindenter.

公开(公告)号：US09484240B2

公开(公告)日：2016-11-01

申请号：US14183823

申请日：2014-02-19

Applicant: NITTO DENKO CORPORATION

Inventor： Yuki Sugo ,  Yuta Kimura

IPC: H01L21/683 ,  H01L23/48 ,  H01L21/50 ,  C09J7/02 ,  C09J9/02 ,  C09J11/04 ,  H01L23/00 ,  C08G59/62 ,  C09J163/00 ,  C08K3/08

CPC classification number: H01L21/6836 ,  C08G59/621 ,  C08K3/02 ,  C08K3/08 ,  C08L33/06 ,  C09J7/20 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  C09J2201/36 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  H01L21/50 ,  H01L23/48 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29424 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/83885 ,  H01L2224/83907 ,  H01L2224/85207 ,  H01L2224/92 ,  H01L2224/94 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/3511 ,  Y10T428/1405 ,  Y10T428/28 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2224/27 ,  H01L21/78 ,  H01L2224/83 ,  H01L2924/00

Abstract: The present invention provides a film adhesive that can prevent a thermal effect to a semiconductor wafer and that can suppress warping of the semiconductor wafer; a dicing tape with a film adhesive; and a method of manufacturing a semiconductor device.The present invention relates to a film adhesive comprising a thermoplastic resin and electrically conductive particles, the film adhesive having an adhesion strength measured at 25° C. after the film adhesive is pasted to a mirror silicon wafer at 40° C. of 0.5 N/10 mm or more.

Abstract translation: 本发明涉及一种包含热塑性树脂和导电颗粒的薄膜粘合剂，该膜粘合剂在40℃下将膜粘合剂粘贴到镜面硅晶片上之后，在25℃下测量的粘合强度为0.5N / 10毫米以上。