III-nitride light-emitting devices with improved high-current efficiency
    21.
    发明授权
    III-nitride light-emitting devices with improved high-current efficiency 有权
    具有改善的高电流效率的III族氮化物发光器件

    公开(公告)号:US06943381B2

    公开(公告)日:2005-09-13

    申请号:US10769590

    申请日:2004-01-30

    IPC分类号: H01L33/00 H01L33/32

    CPC分类号: H01L33/32

    摘要: A light-emitting semiconductor device comprises a III-Nitride active region and a III-Nitride layer formed proximate to the active region and having a thickness that exceeds a critical thickness for relaxation of strain in the III-Nitride layer. The III-Nitride layer may be a carrier confinement layer, for example. In another aspect of the invention, a light-emitting semiconductor device comprises a III-Nitride light emitting layer, an InxAlyGa1-x-yN (0≦x≦1, 0≦y≦1, x+y≦1), and a spacer layer interposing the light emitting layer and the InxAlyGa1-x-yN layer. The spacer layer may advantageously space the InxAlyGa1-x-yN layer and any contaminants therein apart from the light emitting layer. The composition of the III-Nitride layer may be advantageously selected to determine a strength of an electric field in the III-Nitride layer and thereby increase the efficiency with which the device emits light.

    摘要翻译: 发光半导体器件包括在有源区附近形成的III-氮化物有源区和III-氮化物层,其厚度超过III-氮化物层中的应变松弛的临界厚度。 例如,III-氮化物层可以是载流子限制层。 在本发明的另一方面中,一种发光半导体器件包括III族氮化物发光层,In-Al 2 O 3,Ga 1-xy, SUB> N(0 <= x <= 1,0,0 <= y <= 1,x + y <= 1),以及插入发光层和In < 1&lt; 1&gt; Ga 1-xy N层。 间隔层可以有利地将In和/或Al 2 Y 1 Ga 1-x-y N N层及其中的任何污染物与发光层隔开。 可以有利地选择III-氮化物层的组成以确定III-氮化物层中的电场的强度,从而提高器件发光的效率。

    Controlling pit formation in a III-nitride device
    22.
    发明授权
    Controlling pit formation in a III-nitride device 有权
    控制III族氮化物器件中的凹坑形成

    公开(公告)号:US09012250B2

    公开(公告)日:2015-04-21

    申请号:US13448453

    申请日:2012-04-17

    摘要: A device includes a semiconductor structure comprising a III-nitride light emitting layer disposed between an n-type region and a p-type region and a plurality of layer pairs disposed within one of the n-type region and the p-type region. Each layer pair includes an InGaN layer and pit-filling layer in direct contact with the InGaN layer. The pit-filling layer may fill in pits formed in the InGaN layer.

    摘要翻译: 一种器件包括:半导体结构,包括设置在n型区域和p型区域之间的III族氮化物发光层和设置在n型区域和p型区域之一内的多个层对。 每层对包括与InGaN层直接接触的InGaN层和凹坑填充层。 凹坑填充层可以填充形成在InGaN层中的凹坑。

    Grown photonic crystals in semiconductor light emitting devices
    23.
    发明授权
    Grown photonic crystals in semiconductor light emitting devices 有权
    半导体发光器件中的生长光子晶体

    公开(公告)号:US09000450B2

    公开(公告)日:2015-04-07

    申请号:US13404369

    申请日:2012-02-24

    摘要: A photonic crystal is grown within a semiconductor structure, such as a III-nitride structure, which includes a light emitting region disposed between an n-type region and a p-type region. The photonic crystal may be multiple regions of semiconductor material separated by a material having a different refractive index than the semiconductor material. For example, the photonic crystal may be posts of semiconductor material grown in the structure and separated by air gaps or regions of masking material. Growing the photonic crystal, rather than etching a photonic crystal into an already-grown semiconductor layer, avoids damage caused by etching which may reduce efficiency, and provides uninterrupted, planar surfaces on which to form electric contacts.

    摘要翻译: 光子晶体在诸如III族氮化物结构的半导体结构内生长,其包括设置在n型区域和p型区域之间的发光区域。 光子晶体可以是由具有与半导体材料不同的折射率的材料分离的半导体材料的多个区域。 例如,光子晶体可以是在结构中生长并由气隙或掩模材料区域分离的半导体材料的柱。 生长光子晶体,而不是将光子晶体蚀刻成已经生长的半导体层,避免了蚀刻造成的损伤,这可能降低效率,并提供不间断的平面,在其上形成电触点。

    Relaxation of strained layers
    25.
    发明授权
    Relaxation of strained layers 有权
    应变层的松弛

    公开(公告)号:US08481408B2

    公开(公告)日:2013-07-09

    申请号:US13458587

    申请日:2012-04-27

    IPC分类号: H01L21/30

    摘要: A method for relaxing a layer of a strained material. The method includes depositing a first low-viscosity layer on a first face of a strained material layer; bonding a first substrate to the first low-viscosity layer to form a first composite structure; subjecting the composite structure to heat treatment sufficient to cause reflow of the first low-viscosity layer so as to at least partly relax the strained material layer; and applying a mechanical pressure to a second face of the strained material layer wherein the second face is opposite to the first face and with the mechanical pressure applied perpendicularly to the strained material layer during at least part of the heat treatment to relax the strained material.

    摘要翻译: 一种放松应变材料层的方法。 该方法包括在应变材料层的第一面上沉积第一低粘度层; 将第一衬底粘合到第一低粘度层以形成第一复合结构; 对所述复合结构进行热处理以使所述第一低粘度层的回流至少部分地松弛所述应变材料层; 以及向所述应变材料层的第二面施加机械压力,其中所述第二面与所述第一面相对,并且在至少部分热处理期间垂直于所述应变材料层施加机械压力以松弛所述应变材料。

    Grown Photonic Crystals in Semiconductor Light Emitting Devices
    26.
    发明申请
    Grown Photonic Crystals in Semiconductor Light Emitting Devices 有权
    半导体发光器件中的生长光子晶体

    公开(公告)号:US20120161187A1

    公开(公告)日:2012-06-28

    申请号:US13404369

    申请日:2012-02-24

    IPC分类号: H01L33/58

    摘要: A photonic crystal is grown within a semiconductor structure, such as a III-nitride structure, which includes a light emitting region disposed between an n-type region and a p-type region. The photonic crystal may be multiple regions of semiconductor material separated by a material having a different refractive index than the semiconductor material. For example, the photonic crystal may be posts of semiconductor material grown in the structure and separated by air gaps or regions of masking material. Growing the photonic crystal, rather than etching a photonic crystal into an already-grown semiconductor layer, avoids damage caused by etching which may reduce efficiency, and provides uninterrupted, planar surfaces on which to form electric contacts.

    摘要翻译: 光子晶体在诸如III族氮化物结构的半导体结构内生长,其包括设置在n型区域和p型区域之间的发光区域。 光子晶体可以是由具有与半导体材料不同的折射率的材料分离的半导体材料的多个区域。 例如,光子晶体可以是在结构中生长并由气隙或掩模材料区域分离的半导体材料的柱。 生长光子晶体,而不是将光子晶体蚀刻成已经生长的半导体层,避免了蚀刻造成的损伤,这可能降低效率,并提供不间断的平面,在其上形成电触点。

    Semiconductor light emitting devices including in-plane light emitting layers
    27.
    发明授权
    Semiconductor light emitting devices including in-plane light emitting layers 失效
    包括平面内发光层的半导体发光器件

    公开(公告)号:US07808011B2

    公开(公告)日:2010-10-05

    申请号:US10805424

    申请日:2004-03-19

    IPC分类号: H01L33/00

    摘要: A semiconductor light emitting device includes an in-plane active region that emits linearly-polarized light. An in-plane active region may include, for example, a {11 20} or {10 10} InGaN light emitting layer. In some embodiments, a polarizer oriented to pass light of a polarization of a majority of light emitted by the active region serves as a contact. In some embodiments, two active regions emitting the same or different colored light are separated by a polarizer oriented to pass light of a polarization of a majority of light emitted by the bottom active region, and to reflect light of a polarization of a majority of light emitted by the top active region. In some embodiments, a polarizer reflects light scattered by a wavelength converting layer.

    摘要翻译: 半导体发光器件包括发射线偏振光的面内有源区域。 面内有源区可以包括例如{11 20}或{10 10} InGaN发光层。 在一些实施例中,定向为使得由有源区域发射的大部分光的偏振的光通过的偏振片用作接触。 在一些实施例中,发射相同或不同有色光的两个有源区域被定向成使得通过由底部有源区域发射的大部分光的偏振光通过的偏振器分离,并且反射多数光的偏振光 由顶部活动区域发射。 在一些实施例中,偏振器反射由波长转换层散射的光。

    Heterostructures for III-nitride light emitting devices
    28.
    发明授权
    Heterostructures for III-nitride light emitting devices 有权
    III族氮化物发光器件的异质结构

    公开(公告)号:US06995389B2

    公开(公告)日:2006-02-07

    申请号:US10465775

    申请日:2003-06-18

    摘要: Heterostructure designs are disclosed that may increase the number of charge carriers available in the quantum well layers of the active region of III-nitride light emitting devices such as light emitting diodes. In a first embodiment, a reservoir layer is included with a barrier layer and quantum well layer in the active region of a light emitting device. In some embodiments, the reservoir layer is thicker than the barrier layer and quantum well layer, and has a greater indium composition than the barrier layer and a smaller indium composition than the quantum well layer. In some embodiments, the reservoir layer is graded. In a second embodiment, the active region of a light emitting device is a superlattice of alternating quantum well layers and barrier layers. In some embodiments, the barrier layers are thin such that charge carriers can tunnel between quantum well layers through a barrier layer.

    摘要翻译: 公开了异质结构设计,其可以增加III族氮化物发光器件(例如发光二极管)的有源区的量子阱层中可用的电荷载体的数量。 在第一实施例中,存储层包括在发光器件的有源区中的势垒层和量子阱层。 在一些实施例中,储存层比阻挡层和量子阱层厚,并且具有比阻挡层更大的铟组成和比量子阱层更小的铟组成。 在一些实施例中,储层被分级。 在第二实施例中,发光器件的有源区是交替的量子阱层和阻挡层的超晶格。 在一些实施例中,阻挡层是薄的,使得电荷载流子可以通过势垒层在量子阱层之间隧穿。

    Methods of forming relaxed layers of semiconductor materials, semiconductor structures, devices and engineered substrates including same
    30.
    发明授权
    Methods of forming relaxed layers of semiconductor materials, semiconductor structures, devices and engineered substrates including same 有权
    形成半导体材料的弛豫层,半导体结构,器件和包括其的工程衬底的方法

    公开(公告)号:US08486771B2

    公开(公告)日:2013-07-16

    申请号:US12563953

    申请日:2009-09-21

    IPC分类号: H01L21/00

    摘要: Methods of fabricating relaxed layers of semiconductor materials include forming structures of a semiconductor material overlying a layer of a compliant material, and subsequently altering a viscosity of the compliant material to reduce strain within the semiconductor material. The compliant material may be reflowed during deposition of a second layer of semiconductor material. The compliant material may be selected so that, as the second layer of semiconductor material is deposited, a viscosity of the compliant material is altered imparting relaxation of the structures. In some embodiments, the layer of semiconductor material may comprise a III-V type semiconductor material, such as, for example, indium gallium nitride. Methods of fabricating semiconductor structures and devices are also disclosed. Novel intermediate structures are formed during such methods. Engineered substrates include a plurality of structures comprising a semiconductor material disposed on a layer of material exhibiting a changeable viscosity.

    摘要翻译: 制造半导体材料的松弛层的方法包括形成覆盖柔性材料层的半导体材料的结构,随后改变柔性材料的粘度以减小半导体材料内的应变。 在沉积第二层半导体材料期间,柔性材料可以回流。 可以选择柔性材料,使得当沉积第二层半导体材料时,改变柔性材料的粘度赋予结构松弛性。 在一些实施例中,半导体材料层可以包括III-V型半导体材料,例如氮化铟镓。 还公开了制造半导体结构和器件的方法。 在这种方法中形成了新的中间结构。 工程衬底包括多个结构,其包括设置在表现出可变粘度的材料层上的半导体材料。