公开(公告)号：US20100213441A1

公开(公告)日：2010-08-26

申请号：US12378828

申请日：2009-02-20

申请人： Ravi Pillarisetty ,  Titash Rakshit ,  Mantu Hudait ,  Marko Radosavljevic ,  Gilbert Dewey ,  Benjamin Chu-Kung

发明人： Ravi Pillarisetty ,  Titash Rakshit ,  Mantu Hudait ,  Marko Radosavljevic ,  Gilbert Dewey ,  Benjamin Chu-Kung

IPC分类号： H01L29/80 ,  H01L21/3205

CPC分类号： H01L29/122 ,  B82Y10/00 ,  H01L29/045 ,  H01L29/205 ,  H01L29/207 ,  H01L29/4236 ,  H01L29/51 ,  H01L29/66462 ,  H01L29/7785

摘要： A quantum well (QW) layer is provided in a semiconductive device. The QW layer is provided with a beryllium-doped halo layer in a barrier structure below the QW layer. The semiconductive device includes InGaAs bottom and top barrier layers respectively below and above the QW layer. The semiconductive device also includes a high-k gate dielectric layer that sits on the InP spacer first layer in a gate recess. A process of forming the QW layer includes using an off-cut semiconductive substrate.

摘要翻译： 在半导体器件中提供量子阱（QW）层。 QW层在QW层下面的阻挡结构中设置有铍掺杂卤素层。 半导体器件包括分别在QW层下方和上方的InGaAs底部和顶部势垒层。 半导体器件还包括位于栅极凹槽中的InP间隔物第一层上的高k栅介质层。 形成QW层的方法包括使用切断的半导体衬底。

公开(公告)号：US09653548B2

公开(公告)日：2017-05-16

申请号：US15135262

申请日：2016-04-21

申请人： Gilbert Dewey ,  Marko Radosavljevic ,  Ravi Pillarisetty ,  Benjamin Chu-Kung ,  Niloy Mukherjee

发明人： Gilbert Dewey ,  Marko Radosavljevic ,  Ravi Pillarisetty ,  Benjamin Chu-Kung ,  Niloy Mukherjee

IPC分类号： H01L29/00 ,  H01L29/06 ,  H01L29/78 ,  B82Y10/00 ,  H01L29/775 ,  H01L29/205 ,  H01L29/40 ,  H01L29/423 ,  H01L29/51 ,  H01L29/786 ,  H01L29/201 ,  H01L29/66 ,  B82Y99/00

CPC分类号： H01L29/0673 ,  B82Y10/00 ,  B82Y99/00 ,  H01L29/0665 ,  H01L29/201 ,  H01L29/205 ,  H01L29/408 ,  H01L29/4236 ,  H01L29/42364 ,  H01L29/42392 ,  H01L29/511 ,  H01L29/512 ,  H01L29/513 ,  H01L29/517 ,  H01L29/518 ,  H01L29/66462 ,  H01L29/775 ,  H01L29/78 ,  H01L29/785 ,  H01L29/78696

摘要： Non-planar semiconductor devices having group III-V material active regions with multi-dielectric gate stacks are described. For example, a semiconductor device includes a hetero-structure disposed above a substrate. The hetero-structure includes a three dimensional group III-V material body with a channel region. A source and drain material region is disposed above the three-dimensional group III-V material body. A trench is disposed in the source and drain material region separating a source region from a drain region, and exposing at least a portion of the channel region. A gate stack is disposed in the trench and on the exposed portion of the channel region. The gate stack includes first and second dielectric layers and a gate electrode.

公开(公告)号：US09337291B2

公开(公告)日：2016-05-10

申请号：US14821561

申请日：2015-08-07

申请人： Ravi Pillarisetty ,  Willy Rachmady ,  Van H. Le ,  Seung Hoon Sung ,  Jessica S. Kachian ,  Jack T. Kavalieros ,  Han Wui Then ,  Gilbert Dewey ,  Marko Radosavljevic ,  Benjamin Chu-Kung ,  Niloy Mukherjee

发明人： Ravi Pillarisetty ,  Willy Rachmady ,  Van H. Le ,  Seung Hoon Sung ,  Jessica S. Kachian ,  Jack T. Kavalieros ,  Han Wui Then ,  Gilbert Dewey ,  Marko Radosavljevic ,  Benjamin Chu-Kung ,  Niloy Mukherjee

IPC分类号： H01L29/66 ,  H01L29/423 ,  H01L29/165 ,  H01L29/06 ,  H01L29/205 ,  H01L29/78 ,  H01L29/786

CPC分类号： H01L29/78609 ,  H01L29/0653 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/165 ,  H01L29/205 ,  H01L29/42392 ,  H01L29/66742 ,  H01L29/785 ,  H01L29/78606 ,  H01L29/78618 ,  H01L29/78681 ,  H01L29/78684 ,  H01L29/78696

摘要： Deep gate-all-around semiconductor devices having germanium or group III-V active layers are described. For example, a non-planar semiconductor device includes a hetero-structure disposed above a substrate. The hetero-structure includes a hetero-junction between an upper layer and a lower layer of differing composition. An active layer is disposed above the hetero-structure and has a composition different from the upper and lower layers of the hetero-structure. A gate electrode stack is disposed on and completely surrounds a channel region of the active layer, and is disposed in a trench in the upper layer and at least partially in the lower layer of the hetero-structure. Source and drain regions are disposed in the active layer and in the upper layer, but not in the lower layer, on either side of the gate electrode stack.

公开(公告)号：US09123790B2

公开(公告)日：2015-09-01

申请号：US13997897

申请日：2011-12-28

申请人： Ravi Pillarisetty ,  Benjamin Chu-Kung ,  Willy Rachmady ,  Van H. Le ,  Gilbert Dewey ,  Niloy Mukherjee ,  Matthew V. Metz ,  Han Wui Then ,  Marko Radosavljevic

发明人： Ravi Pillarisetty ,  Benjamin Chu-Kung ,  Willy Rachmady ,  Van H. Le ,  Gilbert Dewey ,  Niloy Mukherjee ,  Matthew V. Metz ,  Han Wui Then ,  Marko Radosavljevic

IPC分类号： H01L29/06 ,  H01L29/775 ,  H01L29/423 ,  H01L29/786 ,  H01L23/485 ,  H01L29/66 ,  H01L29/78 ,  B82Y99/00

CPC分类号： H01L29/41791 ,  B82Y40/00 ,  B82Y99/00 ,  G11C7/02 ,  H01L23/485 ,  H01L23/535 ,  H01L27/115 ,  H01L29/0649 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/16 ,  H01L29/42392 ,  H01L29/66477 ,  H01L29/66795 ,  H01L29/775 ,  H01L29/785 ,  H01L29/78696 ,  H01L2029/7858 ,  H01L2924/0002 ,  Y10S977/762 ,  Y10S977/89 ,  H01L2924/00

摘要： Embodiments of the present disclosure provide contact techniques and configurations for reducing parasitic resistance in nanowire transistors. In one embodiment, an apparatus includes a semiconductor substrate, an isolation layer formed on the semiconductor substrate, a channel layer including nanowire material formed on the isolation layer to provide a channel for a transistor, and a contact coupled with the channel layer, the contact being configured to surround, in at least one planar dimension, nanowire material of the channel layer and to provide a source terminal or drain terminal for the transistor.

摘要翻译： 本公开的实施例提供了用于减小纳米线晶体管中的寄生电阻的接触技术和配置。 在一个实施例中，一种装置包括半导体衬底，形成在半导体衬底上的隔离层，包括在隔离层上形成的纳米线材料以提供晶体管沟道的沟道层，以及与沟道层耦合的接触点 被配置为在至少一个平面尺寸中围绕所述沟道层的纳米线材料并且为所述晶体管提供源极端子或漏极端子。

公开(公告)号：US08785907B2

公开(公告)日：2014-07-22

申请号：US13722746

申请日：2012-12-20

申请人： Niti Goel ,  Niloy Mukherjee ,  Seung Hoon Sung ,  Van H. Le ,  Matthew V. Metz ,  Jack T. Kavalieros ,  Ravi Pillarisetty ,  Sanaz K. Gardner ,  Sansaptak Dasgupta ,  Willy Rachmady ,  Benjamin Chu-Kung ,  Marko Radosavljevic ,  Gilbert Dewey ,  Marc C. French ,  Jessica Kachian ,  Satyarth Suri ,  Robert S. Chau

发明人： Niti Goel ,  Niloy Mukherjee ,  Seung Hoon Sung ,  Van H. Le ,  Matthew V. Metz ,  Jack T. Kavalieros ,  Ravi Pillarisetty ,  Sanaz K. Gardner ,  Sansaptak Dasgupta ,  Willy Rachmady ,  Benjamin Chu-Kung ,  Marko Radosavljevic ,  Gilbert Dewey ,  Marc C. French ,  Jessica Kachian ,  Satyarth Suri ,  Robert S. Chau

IPC分类号： H01L29/06

CPC分类号： H01L21/764 ,  H01L21/02381 ,  H01L21/0245 ,  H01L21/02494 ,  H01L21/02507 ,  H01L21/02532 ,  H01L21/76232

摘要： An embodiment includes depositing a material onto a substrate where the material includes a different lattice constant than the substrate (e.g., III-V or IV epitaxial (EPI) material on a Si substrate). An embodiment includes an EPI layer formed within a trench having walls that narrow as the trench extends upwards. An embodiment includes an EPI layer formed within a trench using multiple growth temperatures. A defect barrier, formed in the EPI layer when the temperature changes, contains defects within the trench and below the defect barrier. The EPI layer above the defect barrier and within the trench is relatively defect free. An embodiment includes an EPI layer annealed within a trench to induce defect annihilation. An embodiment includes an EPI superlattice formed within a trench and covered with a relatively defect free EPI layer (that is still included in the trench). Other embodiments are described herein.

摘要翻译： 实施例包括将材料沉积到衬底上，其中材料包括与衬底（例如Si衬底上的III-V或IV外延（EPI）材料）不同的晶格常数。 一个实施例包括形成在沟槽内的EPI层，其具有随着沟槽向上延伸而变窄的壁。 实施例包括使用多个生长温度在沟槽内形成的EPI层。 当温度变化时，在EPI层中形成的缺陷屏障在沟槽内和缺陷屏障之下包含缺陷。 缺陷屏障之上和沟槽内的EPI层相对无缺陷。 一个实施方案包括在沟槽内退火以引发缺陷湮灭的EPI层。 一个实施例包括形成在沟槽内并覆盖有相对无缺陷的EPI层（仍包含在沟槽中）的EPI超晶格。 本文描述了其它实施例。

公开(公告)号：US20140103397A1

公开(公告)日：2014-04-17

申请号：US14141648

申请日：2013-12-27

申请人： Ravi Pillarisetty ,  Jack T. Kavalieros ,  Willy Rachmady ,  Uday Shah ,  Benjamin Chu-Kung ,  Marko Radosavljevic ,  Niloy Mukherjee ,  Gilbert Dewey ,  Been Y. Jin ,  Robert S. Chau

发明人： Ravi Pillarisetty ,  Jack T. Kavalieros ,  Willy Rachmady ,  Uday Shah ,  Benjamin Chu-Kung ,  Marko Radosavljevic ,  Niloy Mukherjee ,  Gilbert Dewey ,  Been Y. Jin ,  Robert S. Chau

IPC分类号： H01L29/66 ,  H01L29/78

CPC分类号： H01L29/775 ,  B82Y10/00 ,  H01L21/76 ,  H01L29/0653 ,  H01L29/1054 ,  H01L29/155 ,  H01L29/165 ,  H01L29/267 ,  H01L29/517 ,  H01L29/66431 ,  H01L29/66439 ,  H01L29/66477 ,  H01L29/66795 ,  H01L29/66977 ,  H01L29/7782 ,  H01L29/7849 ,  H01L29/785 ,  H01L29/7851

摘要： Techniques are disclosed for forming a non-planar germanium quantum well structure. In particular, the quantum well structure can be implemented with group IV or III-V semiconductor materials and includes a germanium fin structure. In one example case, a non-planar quantum well device is provided, which includes a quantum well structure having a substrate (e.g. SiGe or GaAs buffer on silicon), a IV or III-V material barrier layer (e.g., SiGe or GaAs or AlGaAs), a doping layer (e.g., delta/modulation doped), and an undoped germanium quantum well layer. An undoped germanium fin structure is formed in the quantum well structure, and a top barrier layer deposited over the fin structure. A gate metal can be deposited across the fin structure. Drain/source regions can be formed at respective ends of the fin structure.

摘要翻译： 公开了用于形成非平面锗量子阱结构的技术。 特别地，量子阱结构可以用IV或III-V族半导体材料实现，并且包括锗鳍结构。 在一个示例性情况下，提供了非平面量子阱器件，其包括具有衬底（例如硅上的SiGe或GaAs缓冲器），IV或III-V材料阻挡层（例如，SiGe或GaAs或 AlGaAs），掺杂层（例如，掺杂Δ/调制）和未掺杂的锗量子阱层。 在量子阱结构中形成未掺杂的锗鳍结构，以及沉积在鳍结构上的顶部势垒层。 栅极金属可以跨鳍片结构沉积。 排水/源极区域可以形成在翅片结构的相应端部处。

公开(公告)号：US20140084246A1

公开(公告)日：2014-03-27

申请号：US13629178

申请日：2012-09-27

申请人： Ravi Pillarisetty ,  Niti Goel ,  Han Wui Then ,  Van H. Le ,  Willy Rachmady ,  Marko Radosavljevic ,  Gilbert Dewey ,  Benjamin Chu-Kung

发明人： Ravi Pillarisetty ,  Niti Goel ,  Han Wui Then ,  Van H. Le ,  Willy Rachmady ,  Marko Radosavljevic ,  Gilbert Dewey ,  Benjamin Chu-Kung

IPC分类号： H01L29/78 ,  H01L29/775

CPC分类号： H01L29/775 ,  B82Y10/00 ,  H01L21/28255 ,  H01L29/0673 ,  H01L29/1054 ,  H01L29/1079 ,  H01L29/1083 ,  H01L29/16 ,  H01L29/42392 ,  H01L29/66439 ,  H01L29/785 ,  H01L29/78696

摘要： Semiconductor devices having germanium active layers with underlying parasitic leakage barrier layers are described. For example, a semiconductor device includes a first buffer layer disposed above a substrate. A parasitic leakage barrier is disposed above the first buffer layer. A second buffer layer is disposed above the parasitic leakage barrier. A germanium active layer is disposed above the second buffer layer. A gate electrode stack is disposed above the germanium active layer. Source and drain regions are disposed above the parasitic leakage barrier, on either side of the gate electrode stack.

摘要翻译： 描述具有底层寄生泄漏阻挡层的具有锗活性层的半导体器件。 例如，半导体器件包括设置在衬底上方的第一缓冲层。 寄生泄漏屏障设置在第一缓冲层之上。 第二缓冲层设置在寄生泄漏屏障的上方。 锗活性层设置在第二缓冲层上方。 栅电极堆叠设置在锗活性层上方。 源极和漏极区域设置在栅极电极堆叠的任一侧上的寄生泄漏屏障之上。

公开(公告)号：US20140084239A1

公开(公告)日：2014-03-27

申请号：US13629148

申请日：2012-09-27

申请人： Marko Radosavljevic ,  Gilbert Dewey ,  Benjamin Chu-Kung ,  Dipanjan Basu ,  Sanaz K. Gardner ,  Satyarth Suri ,  Ravi Pillarisetty ,  Niloy Mukherjee ,  Han Wui Then ,  Robert S. Chau

发明人： Marko Radosavljevic ,  Gilbert Dewey ,  Benjamin Chu-Kung ,  Dipanjan Basu ,  Sanaz K. Gardner ,  Satyarth Suri ,  Ravi Pillarisetty ,  Niloy Mukherjee ,  Han Wui Then ,  Robert S. Chau

IPC分类号： H01L29/78 ,  H01L29/267 ,  H01L29/06

CPC分类号： H01L29/0665 ,  B82Y10/00 ,  B82Y40/00 ,  H01L29/0673 ,  H01L29/068 ,  H01L29/201 ,  H01L29/401 ,  H01L29/42392 ,  H01L29/66469 ,  H01L29/775 ,  H01L29/785 ,  H01L29/78696 ,  H01L2924/0002 ,  H01L2924/00

摘要： Non-planar semiconductor devices having channel regions with low band-gap cladding layers are described. For example, a semiconductor device includes a vertical arrangement of a plurality of nanowires disposed above a substrate. Each nanowire includes an inner region having a first band gap and an outer cladding layer surrounding the inner region. The cladding layer has a second, lower band gap. A gate stack is disposed on and completely surrounds the channel region of each of the nanowires. The gate stack includes a gate dielectric layer disposed on and surrounding the cladding layer and a gate electrode disposed on the gate dielectric layer. Source and drain regions are disposed on either side of the channel regions of the nanowires.

摘要翻译： 描述具有低带隙包层的沟道区的非平面半导体器件。 例如，半导体器件包括布置在衬底上方的多个纳米线的垂直布置。 每个纳米线包括具有第一带隙的内部区域和围绕内部区域的外部包层。 包层具有第二较低带隙。 栅堆叠设置在每个纳米线的沟道区上并完全包围。 栅极堆叠包括设置在包层上并围绕着包层的栅极电介质层和设置在栅极介电层上的栅电极。 源区和漏区设置在纳米线的沟道区的两侧。

公开(公告)号：US20140054548A1

公开(公告)日：2014-02-27

申请号：US14069880

申请日：2013-11-01

申请人： Ravi Pillarisetty ,  Jack T. Kavalieros ,  Willy Rachmady ,  Uday Shah ,  Benjamin Chu-Kung ,  Marko Radosavljevic ,  Niloy Mukherjee ,  Gilbert Dewey ,  Been-Yih Jin ,  Robert S. Chau

发明人： Ravi Pillarisetty ,  Jack T. Kavalieros ,  Willy Rachmady ,  Uday Shah ,  Benjamin Chu-Kung ,  Marko Radosavljevic ,  Niloy Mukherjee ,  Gilbert Dewey ,  Been-Yih Jin ,  Robert S. Chau

IPC分类号： H01L29/775 ,  H01L21/76 ,  H01L29/66

CPC分类号： H01L29/775 ,  B82Y10/00 ,  H01L21/76 ,  H01L29/0653 ,  H01L29/1054 ,  H01L29/155 ,  H01L29/165 ,  H01L29/267 ,  H01L29/517 ,  H01L29/66431 ,  H01L29/66439 ,  H01L29/66477 ,  H01L29/66795 ,  H01L29/66977 ,  H01L29/7782 ,  H01L29/7849 ,  H01L29/785 ,  H01L29/7851

摘要： Techniques are disclosed for forming a non-planar germanium quantum well structure. In particular, the quantum well structure can be implemented with group IV or III-V semiconductor materials and includes a germanium fin structure. In one example case, a non-planar quantum well device is provided, which includes a quantum well structure having a substrate (e.g. SiGe or GaAs buffer on silicon), a IV or III-V material barrier layer (e.g., SiGe or GaAs or AlGaAs), a doping layer (e.g., delta/modulation doped), and an undoped germanium quantum well layer. An undoped germanium fin structure is formed in the quantum well structure, and a top barrier layer deposited over the fin structure. A gate metal can be deposited across the fin structure. Drain/source regions can be formed at respective ends of the fin structure.

公开(公告)号：US20130277683A1

公开(公告)日：2013-10-24

申请号：US13976837

申请日：2011-12-19

申请人： Han Wui Then ,  Robert Chau ,  Benjamin Chu-Kung ,  Gilbert Dewey ,  Jack Kavalieros ,  Matthew Metz ,  Niloy Mukherjee ,  Ravi Pillarisetty ,  Marko Radosavljevic

发明人： Han Wui Then ,  Robert Chau ,  Benjamin Chu-Kung ,  Gilbert Dewey ,  Jack Kavalieros ,  Matthew Metz ,  Niloy Mukherjee ,  Ravi Pillarisetty ,  Marko Radosavljevic

IPC分类号： H01L29/778 ,  H01L29/66

CPC分类号： H01L29/7787 ,  G06F1/1633 ,  G06F1/189 ,  H01L21/02381 ,  H01L21/02433 ,  H01L21/0254 ,  H01L29/045 ,  H01L29/0657 ,  H01L29/0847 ,  H01L29/1037 ,  H01L29/2003 ,  H01L29/205 ,  H01L29/402 ,  H01L29/66462 ,  H01L29/7783 ,  H01L29/7786 ,  H01L29/7789 ,  H01L29/785 ,  H03F3/195 ,  H03F3/213 ,  H03F2200/451

摘要： Transistors for high voltage and high frequency operation. A non-planar, polar crystalline semiconductor body having a top surface disposed between first and second opposite sidewalls includes a channel region with a first crystalline semiconductor layer disposed over the first and second sidewalls. The first crystalline semiconductor layer is to provide a two dimensional electron gas (2DEG) within the channel region. A gate structure is disposed over the first crystalline semiconductor layer along at least the second sidewall to modulate the 2DEG. First and second sidewalls of the non-planar polar crystalline semiconductor body may have differing polarity, with the channel proximate to a first of the sidewalls. The gate structure may be along a second of the sidewalls to gate a back barrier. The polar crystalline semiconductor body may be a group III-nitride formed on a silicon substrate with the (10 10) plane on a (110) plane of the silicon.

摘要翻译： 用于高压和高频工作的晶体管。 具有设置在第一和第二相对侧壁之间的顶表面的非平面极性结晶半导体本体包括具有设置在第一和第二侧壁上的第一晶体半导体层的沟道区。 第一晶体半导体层是在沟道区内提供二维电子气（2DEG）。 栅极结构沿至少第二侧壁设置在第一晶体半导体层上方，以调制2DEG。 非平面极性结晶半导体主体的第一和第二侧壁可具有不同的极性，其中通道靠近第一侧壁。 栅极结构可以沿着侧壁中的第二侧面以栅极背栅。 极性结晶半导体体可以是在硅衬底上形成的III族氮化物，其中（10 10）面在硅的（110）平面上。