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    COIL TYPE UNIT FOR WIRELESS POWER TRANSMISSION, WIRELESS POWER TRANSMISSION DEVICE, ELECTRONIC DEVICE AND MANUFACTURING METHOD OF COIL TYPE UNIT FOR WIRELESS POWER TRANSMISSION
    22.
    发明申请
    COIL TYPE UNIT FOR WIRELESS POWER TRANSMISSION, WIRELESS POWER TRANSMISSION DEVICE, ELECTRONIC DEVICE AND MANUFACTURING METHOD OF COIL TYPE UNIT FOR WIRELESS POWER TRANSMISSION 审中-公开
    用于无线电力传输的线圈类型单元，无线电力传输设备，电子设备和用于无线电力传输的线圈类型单元的制造方法

    公开(公告)号：US20150076919A1

    公开(公告)日：2015-03-19

    申请号：US14461958

    申请日：2014-08-18

    申请人： SAMSUNG ELECTRO-MECHANICS CO. LTD.

    发明人： Seung Wook PARK ,  No Il Park ,  Doo Sung Jung ,  Jang Su Kim ,  Chang Bae Lee

    IPC分类号： H02J5/00 ,  H01F27/24 ,  H01F27/28 ,  H01F38/14 ,  H01F41/04

    CPC分类号： H02J5/005 ,  H01F27/2804 ,  H01F38/14 ,  H01F41/046 ,  H02J7/025 ,  H02J50/10 ,  Y10T29/4902

    摘要： The present invention relates to a coil type unit for wireless power transmission, a wireless power transmission device, an electronic device, and a manufacturing method of a coil type unit for wireless power transmission.A coil type unit for wireless power transmission according to the present invention includes a coil pattern having a wiring pattern shape; a magnetic portion having the coil pattern attached to one surface thereof and a conductive pattern formed thereon; an insulating adhesive portion interposed between the magnetic portion having the conductive pattern formed thereon and the coil pattern to bond the magnetic portion and the coil pattern to each other while insulating the coil pattern and the conductive pattern from each other; and a conductive via for electrically connecting both ends of the coil pattern and the conductive pattern.

    摘要翻译： 本发明涉及一种用于无线电力传输的线圈类型单元，无线电力传输装置，电子装置以及用于无线电力传输的线圈型单元的制造方法。 根据本发明的用于无线电力传输的线圈类型单元包括具有布线图形形状的线圈图案; 具有连接到其一个表面上的线圈图案的磁性部分和形成在其上的导电图案; 绝缘粘合剂部分插入在其上形成有导电图案的磁性部分和线圈图案之间，以将磁性部分和线圈图案彼此粘合，同时使线圈图案和导电图案彼此绝缘; 以及用于电连接线圈图案的两端和导电图案的导电通孔。

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    23.
    发明申请
    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 有权
    印刷电路板及其制造方法

    公开(公告)号：US20140124258A1

    公开(公告)日：2014-05-08

    申请号：US13827248

    申请日：2013-03-14

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Seung Wook PARK ,  Dong Hwan Lee ,  Jin Gu Kim ,  Chang Bae Lee ,  Christian Romero

    IPC分类号： H05K1/02 ,  H05K3/40

    CPC分类号： H05K1/0216 ,  H05K3/4602 ,  H05K3/4673 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0723 ,  H05K2201/09581 ,  Y10T29/49165

    摘要： Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a core layer having a first circuit wiring layer formed on one surface or both surfaces thereof; an insulating layer laminated, as at least one layer, on one surface or both surfaces of the core layer; and a second circuit wiring layer formed on one surface of the insulating layer, wherein a conductive core is included in upper and lower insulating layers contacting the second circuit wiring layer requiring an electromagnetic wave shielding, or the conductive core is included in the insulating layer or the core layer contacting the first circuit wiring layer requiring the electromagnetic wave shielding.

    摘要翻译： 这里公开了一种印刷电路板及其制造方法。 印刷电路板包括：具有形成在其一个表面或两个表面上的第一电路布线层的芯层; 在芯层的一个表面或两个表面上层压作为至少一个层的绝缘层; 以及形成在所述绝缘层的一个表面上的第二电路布线层，其中在与需要电磁波屏蔽的第二电路布线层接触的上绝缘层和下绝缘层中包括导电芯，或者导电芯包括在绝缘层中或 芯层与需要电磁波屏蔽的第一电路布线层接触。

    PLUG VIA STACKED STRUCTURE, STACKED SUBSTRATE HAVING VIA STACKED STRUCTURE AND MANUFACTURING METHOD THEREOF
    24.
    发明申请
    PLUG VIA STACKED STRUCTURE, STACKED SUBSTRATE HAVING VIA STACKED STRUCTURE AND MANUFACTURING METHOD THEREOF 有权
    通过堆叠结构通过堆叠结构的堆叠基板和其制造方法

    公开(公告)号：US20130320561A1

    公开(公告)日：2013-12-05

    申请号：US13906951

    申请日：2013-05-31

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Seung Wook PARK ,  Romero CHRISTIAN ,  Chang Bae LEE ,  Mi Jin PARK

    IPC分类号： H01L23/498 ,  H01L21/768

    CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L21/76877 ,  H01L2924/0002 ,  H05K1/112 ,  H05K1/113 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09481 ,  H05K2201/0959 ,  H01L2924/00

    摘要： Disclosed herein is a plug via stacked structure including: a through hole plating layer plated on a through hole inner wall and around top and bottom of a through hole at thickness t; a via plug filled in an inner space of the through hole plating layer; a circuit pattern formed over the top and bottom of the through hole plating layer and the via plug and making a thickness t′ formed on the through hole plating layer thicker than a thickness t; and a stacked conductive via filled in a via hole formed on the top of the through hole and formed at thickness α from a top of the circuit pattern, wherein T≦t″+α is satisfied, T represents a sum of the thicknesses t and t′ and t″ is a thickness of a portion of the circuit pattern formed on the via plug.

    摘要翻译： 本文公开了一种插头通孔堆叠结构，包括：镀敷在通孔内壁上且贯穿孔的顶部和底部的通孔镀层，厚度为t; 通孔塞，其填充在所述通孔镀层的内部空间中; 形成在通孔镀层和通孔塞的顶部和底部上并形成在厚度t以上的通孔镀层上的厚度t'的电路图案; 以及填充在通孔顶部形成的通孔的叠层导电通孔，其形成为从电路图案的顶部的厚度α，其中T @ t“+α满足，T表示厚度t的和 并且t'和t“是形成在通孔塞上的电路图案的一部分的厚度。

    COIL COMPONENT
    27.
    发明申请
    COIL COMPONENT 有权
    线圈组件

    公开(公告)号：US20160225513A1

    公开(公告)日：2016-08-04

    申请号：US14937227

    申请日：2015-11-10

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Seung Wook PARK ,  Kwang Mo KIM ,  Won Chul SIM

    IPC分类号： H01F27/28 ,  H01F27/24 ,  H01F27/29

    CPC分类号： H01F17/0013 ,  H01F27/292

    摘要： A coil component includes a magnetic substrate, an insulating layer provided on the magnetic substrate and having conductive coils formed in the insulating layer, and a reinforcing layer provided on the insulating layer and having a coefficient of thermal expansion lower than a coefficient of thermal expansion of the insulating layer. High attenuation characteristics and mountability of a coil component may be improved and the deviation of the coefficient of thermal expansion between the components may be alleviated.

    摘要翻译： 线圈部件包括磁性基板，设置在磁性基板上并具有形成在绝缘层中的导电线圈的绝缘层，以及设置在绝缘层上并具有低于热膨胀系数的热膨胀系数的加强层 绝缘层。 可以提高线圈部件的高衰减特性和安装性，并且可以减轻部件之间的热膨胀系数的偏差。

    COIL TYPE UNIT FOR WIRELESS POWER TRANSMISSION, WIRELESS POWER TRANSMISSION DEVICE, ELECTRONIC DEVICE AND MANUFACTURING METHOD OF COIL TYPE UNIT FOR WIRELESS POWER TRANSMISSION
    28.
    发明申请
    COIL TYPE UNIT FOR WIRELESS POWER TRANSMISSION, WIRELESS POWER TRANSMISSION DEVICE, ELECTRONIC DEVICE AND MANUFACTURING METHOD OF COIL TYPE UNIT FOR WIRELESS POWER TRANSMISSION 有权
    用于无线电力传输的线圈类型单元，无线电力传输设备，电子设备和用于无线电力传输的线圈类型单元的制造方法

    公开(公告)号：US20150028686A1

    公开(公告)日：2015-01-29

    申请号：US14331950

    申请日：2014-07-15

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： No Il PARK ,  Jang Su KIM ,  Doo Sung JUNG ,  Seung Wook PARK

    IPC分类号： H01F38/14 ,  H01F41/00 ,  H01F41/14 ,  H02J5/00

    CPC分类号： H01F38/14 ,  H01F1/344 ,  H01F5/00 ,  H01F27/2804 ,  H01F2027/2809 ,  Y10T29/49073

    摘要： The present invention relates to a coil type unit for wireless power transmission, a wireless power transmission device, an electronic device, and a manufacturing method of a coil type unit for wireless power transmission. A coil type unit for wireless power transmission according to the present invention includes a coil pattern in the form of a wiring pattern; a magnetic portion having the coil pattern attached to one surface thereof; and an adhesive portion interposed between the magnetic portion and the coil pattern to bond the magnetic portion and the coil pattern, wherein the magnetic portion is formed by laminating one or more conductive sheets with one or more magnetic sheets and integrally firing the laminated sheets, and the magnetic portion has conductive holes in the position, where both ends of the coil pattern are disposed, to electrically connect the both ends of the coil pattern and the conductive sheet.

    摘要翻译： 本发明涉及一种用于无线电力传输的线圈类型单元，无线电力传输装置，电子设备以及用于无线电力传输的线圈型单元的制造方法。 根据本发明的用于无线电力传输的线圈类型单元包括布线图案形式的线圈图案; 具有连接到其一个表面的线圈图案的磁性部分; 以及插入在磁性部分和线圈图案之间以将磁性部分和线圈图案结合的粘合部分，其中磁性部分通过层叠一个或多个导电片材与一个或多个磁性片材并整体烧制层压片材而形成，以及 磁性部分在线圈图案的两端设置的位置上具有导电孔，以将线圈图案和导电片的两端电连接。

    SHIELD PART, METHOD OF FABRICATING THE SAME, AND CONTACTLESS POWER TRANSMISSION DEVICE HAVING THE SHIELD PART
    29.
    发明申请
    SHIELD PART, METHOD OF FABRICATING THE SAME, AND CONTACTLESS POWER TRANSMISSION DEVICE HAVING THE SHIELD PART 有权
    屏蔽部分，制造它的方法，以及具有屏蔽部分的无连接电力传输装置

    公开(公告)号：US20150001951A1

    公开(公告)日：2015-01-01

    申请号：US14033410

    申请日：2013-09-20

    申请人： Samsung Electro-Mechanics Co., Ltd.

    发明人： Seung Wook PARK ,  No Il Park ,  Doo Sung Jung ,  Jang Su Kim ,  Chang Bae Lee

    IPC分类号： H01F38/14 ,  H05K9/00 ,  H01F41/34 ,  H01F27/28

    CPC分类号： H01F38/14 ,  H01F27/2804 ,  H01F27/288 ,  H01F2027/2809 ,  H02J5/005 ,  H02J7/025 ,  H02J50/10 ,  H02J50/70 ,  H02J50/80 ,  Y10T156/1057

    摘要： There is provided a shield part including: a magnetic laminate formed by laminating a plurality of magnetic layers and having a first surface and a second surface; a coil pattern formed on the first surface; and a first lead part formed at an end portion of a central portion of the coil pattern and a second lead part formed outside of the coil pattern, wherein a portion of the second surface is removed to form a recess, the first lead part is electrically connected to the second lead part by a conductive material disposed in the recess and a first via formed in the magnetic laminate in a lamination direction, and the second lead part is electrically connected to the first lead part by the conductive material disposed in the recess and a second via formed in the magnetic laminate in the lamination direction.

    摘要翻译： 提供了一种屏蔽部件，包括：通过层叠多个磁性层并具有第一表面和第二表面而形成的磁性层压体; 形成在所述第一表面上的线圈图案; 以及形成在所述线圈图案的中心部分的端部处的第一引线部分和形成在所述线圈图案外部的第二引线部分，其中所述第二表面的一部分被去除以形成凹部，所述第一引线部分是电 通过设置在所述凹部中的导电材料连接到所述第二引线部分，以及在层叠方向上形成在所述磁性层压体中的第一通孔，并且所述第二引线部分通过设置在所述凹部中的导电材料电连接到所述第一引线部分， 在层叠方向上形成在磁性层压体中的第二通孔。