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公开(公告)号：US20220367416A1
公开(公告)日：2022-11-17
申请号：US17671065
申请日：2022-02-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yongkwan Lee , Seunghwan Kim , Jungjoo Kim , Jongwan Kim , Hyunki Kim , Junwoo Park , Hyunggil Baek , Junga Lee , Taejun Jeon
IPC: H01L25/065 , H01L23/00 , H01L23/498 , H01L23/538
Abstract: A semiconductor package includes a package substrate having a communication hole extending from an upper surface of the package substrate to a lower surface of the package substrate, a semiconductor chip attached to the upper surface of the package substrate, an auxiliary chip attached to the lower surface of the package substrate, external connection terminals attached to the lower surface of the package substrate and spaced apart from the auxiliary chip, and an encapsulant encapsulating the semiconductor chip and the auxiliary chip and filling the communication hole.
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公开(公告)号：US20210066046A1
公开(公告)日：2021-03-04
申请号：US16883392
申请日：2020-05-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junyoung Oh , Jaeho Kwak , Boeun Jang , Seokyeon Hwang , Yongseok Seo , Sangsoo Kim , Seunghwan Kim , Jongho Park , Yongkwan Lee , Jongho Lee , Daewook Kim , Wonpil Lee , Changkyu Choi
Abstract: A surface treatment apparatus and a surface treatment system having the same are disclosed. The surface treatment apparatus includes a process chamber in which the surface treatment process is conducted, a plasma generator for generating process radicals as a plasma state for the surface treatment process, the plasma generator being positioned outside of the process chamber and connected to the process chamber by a supply duct, a heat exchanger arranged on the supply duct and cooling down temperature of the process radicals passing through the supply duct and a flow controller controlling the process radicals to flow out of the process chamber. The flow controller is connected to a discharge duct through which the process radicals are discharged outside the process chamber. The plasma surface treatment process is conducted to the package structure having minute mounting gap without the damages to the IC chip and the board.
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公开(公告)号：US09362611B2
公开(公告)日：2016-06-07
申请号：US13954256
申请日：2013-07-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jeongwan Park , Byungchan Jang , Sukho Kim , Seunghwan Kim , Joonho Byun
Abstract: An antenna of a mobile includes at least two internal antennas and a printed circuit board disposed between a front cover and a rear cover. The printed circuit board includes at least one first antenna mounted on an upper surface and the printed circuit board having at least one fastening opening therein. A second antenna is mounted in an upper portion of a side surface of the printed circuit board and included a protruded portion of one end protruded from a body and in which the protruded portion is fastened to the fastening opening to be fastened to a side surface of the printed circuit board and the mobile terminal can be produced having a reduced thickness.
Abstract translation: 移动台的天线包括至少两个内部天线和布置在前盖和后盖之间的印刷电路板。 印刷电路板包括安装在上表面上的至少一个第一天线和其中具有至少一个紧固开口的印刷电路板。 第二天线安装在印刷电路板的侧表面的上部，并且包括从主体突出的一端的突出部分，其中突出部分紧固到紧固开口以紧固到侧面 可以制造具有减小的厚度的印刷电路板和移动终端。
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公开(公告)号：US20250139757A1
公开(公告)日：2025-05-01
申请号：US18754533
申请日：2024-06-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Minwoo Jeon , Seunghwan Kim
Abstract: A method of inspecting a semiconductor package includes acquiring an image of a surface of a semiconductor package, classifying a characteristic of a mold bleed present on the surface of the semiconductor package and captured in the image, identifying that the mold bleed is abnormal, and generating an alarm upon identifying that the mold bleed is abnormal.
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Patent Agency Ranking
公开(公告)号：US12205925B2
公开(公告)日：2025-01-21
申请号：US17671065
申请日：2022-02-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yongkwan Lee , Seunghwan Kim , Jungjoo Kim , Jongwan Kim , Hyunki Kim , Junwoo Park , Hyunggil Baek , Junga Lee , Taejun Jeon
IPC: H01L25/065 , H01L23/00 , H01L23/498 , H01L23/538
Abstract: A semiconductor package includes a package substrate having a communication hole extending from an upper surface of the package substrate to a lower surface of the package substrate, a semiconductor chip attached to the upper surface of the package substrate, an auxiliary chip attached to the lower surface of the package substrate, external connection terminals attached to the lower surface of the package substrate and spaced apart from the auxiliary chip, and an encapsulant encapsulating the semiconductor chip and the auxiliary chip and filling the communication hole.
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公开(公告)号：US20230378094A1
公开(公告)日：2023-11-23
申请号：US18104650
申请日：2023-02-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junwoo Park , Yongkwan Lee , Seunghwan Kim , Jungjoo Kim , Jongwan Kim , Taejun Jeon , Junhyeung Jo
IPC: H01L23/00 , H01L23/538 , H01L23/498 , H01L23/31 , H10B80/00
CPC classification number: H01L23/562 , H01L23/5383 , H01L23/5386 , H01L23/5385 , H01L23/49811 , H01L23/3128 , H10B80/00 , H01L2224/16227 , H01L24/16 , H01L2224/32225 , H01L24/32 , H01L2224/73204 , H01L24/73
Abstract: A semiconductor package includes a support wiring structure, a semiconductor chip on the support wiring structure, a connection structure on the support wiring structure and spaced apart from the semiconductor chip in a horizontal direction, an interposer including a central portion and an outer portion and having a recess portion provided on a lower surface of the central portion facing the semiconductor chip, wherein the central portion is on the semiconductor chip and the connection structure is connected to the outer portion, and a metal plate disposed along a portion of a surface of the recess portion inside the interposer, wherein the metal plate extends along a side surface of the outer portion of the interposer and the lower surface of the central portion of the interposer, and the metal plate has a cavity passing through a vicinity of a center of the metal plate planarly.
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公开(公告)号：US20230260926A1
公开(公告)日：2023-08-17
申请号：US18107143
申请日：2023-02-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yongkwan Lee , Seunghwan Kim , Jungjoo Kim , Jongwan Kim , Junwoo Park , Hyunggil Baek , Junga Lee
IPC: H01L23/544 , H01L23/31 , H01L23/498 , H01L23/00 , H01L25/10 , H01L23/538 , H01L21/48 , H01L21/56
CPC classification number: H01L23/544 , H01L23/3128 , H01L23/49811 , H01L23/562 , H01L25/105 , H01L23/5383 , H01L23/5385 , H01L21/4846 , H01L21/563 , H01L2224/16227 , H01L24/16 , H01L2224/32225 , H01L24/32 , H01L2224/73204 , H01L24/73 , H01L2223/54426 , H01L2224/92125 , H01L24/92
Abstract: A semiconductor package includes an interposer including an upper pad and an upper passivation layer partially covering the upper pad, a semiconductor chip disposed on the interposer, a conductor pattern disposed on the interposer, a guide pattern disposed on the interposer while including a main opening and at least one sub-opening connected to the main opening, a support disposed on the interposer while including a core portion and a peripheral portion surrounding the core portion, a lower surface of the support being disposed in the main opening of the guide pattern, an upper redistribution structure disposed on the semiconductor chip and connected to the conductor pattern and the guide pattern, and an encapsulant between the interposer and the upper redistribution structure. The encapsulant contacts an inner wall of the main opening, an inner wall of the at least one sub-opening and a side surface of the support.
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28.发明授权公开(公告)号：US11728142B2
公开(公告)日：2023-08-15
申请号：US16883392
申请日：2020-05-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junyoung Oh , Jaeho Kwak , Boeun Jang , Seokyeon Hwang , Yongseok Seo , Sangsoo Kim , Seunghwan Kim , Jongho Park , Yongkwan Lee , Jongho Lee , Daewook Kim , Wonpil Lee , Changkyu Choi
IPC: H01J37/32 , C23C16/455 , C23C16/458 , H01L21/673
CPC classification number: H01J37/32449 , C23C16/45504 , C23C16/45589 , H01J37/32633 , C23C16/4583 , C23C16/45502 , C23C16/45591 , H01J37/32357 , H01L21/67326
Abstract: A surface treatment apparatus and a surface treatment system having the same are disclosed. The surface treatment apparatus includes a process chamber in which the surface treatment process is conducted, a plasma generator for generating process radicals as a plasma state for the surface treatment process, the plasma generator being positioned outside of the process chamber and connected to the process chamber by a supply duct, a heat exchanger arranged on the supply duct and cooling down temperature of the process radicals passing through the supply duct and a flow controller controlling the process radicals to flow out of the process chamber. The flow controller is connected to a discharge duct through which the process radicals are discharged outside the process chamber. The plasma surface treatment process is conducted to the package structure having minute mounting gap without the damages to the IC chip and the board.
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公开(公告)号：US20210091456A1
公开(公告)日：2021-03-25
申请号：US17113577
申请日：2020-12-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jae-Ho Lim , Kyung-Jong Lee , Hosaeng Kim , Seunghwan Kim
Abstract: Provided is an electronic device that includes first and second housings, a display, a connecting member connecting the first and second housings, first and second conductive members, and a wireless communication circuit. The first housing includes a first side facing a first direction, a second side facing a second direction opposite to the first direction, and a first lateral side surrounding at least part of a space between the first side and the second side. The second housing includes a third side facing a third direction, a fourth side facing a fourth direction opposite to the third direction, and a second lateral side surrounding at least part of a space between the third side and the fourth side. The connecting member connects the first and second housings such that folding of the first and second housings results in the first and second lateral sides abutting against each other.
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