Abstract:
A resistance variable memory apparatus may include a memory circuit configured to include a plurality of blocks, each including a plurality of memory cells. The resistance variable memory apparatus may include a disturbance preventing circuit configured to be driven based on a counting signal corresponding to the number of write accesses for each of the plurality of blocks, a write command, and an address signal and to allow scrubbing to be performed on a memory cell having a preset scrubbing condition when the counting signal satisfied with the scrubbing condition is output based on the scribing condition according to a physical position of the memory cell in the block.
Abstract:
A test apparatus may include transceivers and a global de-skew circuit. In a training mode, the transceivers provide first timing information obtained by delaying a first data signal in the range of up to a preset unit interval based on a clock signal and receive second timing information corresponding to timing differences between a slowest transceiver and the remaining transceivers. In an operation mode, the transceivers provide compensation data to a plurality of DUTs (Devices Under Test) substantially simultaneously. The compensation data may be obtained by delaying a second data signal by multiples of the preset unit interval in response to the second timing information. In the training mode, the global de-skew circuit receives the first timing information, calculates, using the first timing information, the timing differences between the slowest transceiver and the remaining transceivers, and provides the second timing information corresponding to the timing differences to the transceivers.
Abstract:
A resistance variable memory apparatus may include a memory circuit configured to include a plurality of blocks, each including a plurality of memory cells. The resistance variable memory apparatus may include a disturbance preventing circuit configured to be driven based on a counting signal corresponding to the number of write access for each of the plurality of blocks, a write command, and an address signal and to allow scrubbing to be performed on a memory cell having a preset scrubbing condition when the counting signal satisfied with the scrubbing condition is output based on the scribing condition according to a physical position of the memory cell in the block.
Abstract:
A semiconductor system may be provided. The semiconductor system may include a first semiconductor device configured for outputting a transmission command and a transmission address, being inputted with and outputting transmission data, and generating an error flag signal when an error bit is included in the transmission data inputted in a read operation. The semiconductor system may include a second semiconductor device configured for storing the transmission address in a lookup table circuit when the error flag signal is enabled, and comparing the transmission address and a storage address stored in the lookup table circuit when the read operation is performed based on the transmission command and outputting the transmission data from the lookup table circuit.
Abstract:
A data processing system includes a plurality of peripheral devices in which device identification information and group identification information are stored, and a controller. The peripheral devices of the same species device group have the same group identification information, and peripheral devices from different peripheral device groups have different group identification information. The controller controls peripheral devices of the same species device group to perform the same operation.
Abstract:
A semiconductor memory device includes a semiconductor circuit substrate having a chip pad forming region. A pair of data lines are formed on the semiconductor circuit substrate at one side of the chip pad region. The pair of data lines extend along a direction that the chip pad region of the semiconductor circuit substrate extends. The pair of data lines are arranged to be adjacent to each other and receive a pair of differential data signals. A power supply line is formed on the semiconductor circuit substrate at the other side of the chip pad region. The power supply line extends along the direction that the chip pad region of the semiconductor circuit substrate extends, and the power supply line receives power.
Abstract:
A latency control circuit includes a clock delay configured to output a plurality of serial delay signals obtained by serially delaying an input clock signal with the same intervals, a deviation information generating unit configured to generate a deviation information on the basis of a delay value, which the clock signal undergoes in a chip, and latency information, a clock selector configured to output a plurality of clock selection signals based on the plurality of serial delay signals and the deviation information, a command signal processing unit configured to generate a read signal based on an input command signal, and output a variable delay duplication signal by variably delaying the read signal, and a latency shifter configured to output a latency signal by combining the plurality of clock selection signals with the variable delay duplication signal.
Abstract:
A test circuit of a semiconductor apparatus includes a test temperature information generation section, an erroneous operation prevention unit, and a refresh cycle adjustment unit. The test temperature information generation section outputs test temperature information having a plurality of bits in a test operation mode, and irregularly changes logic values of the plurality of bits and transition time points of the logic values. The erroneous operation prevention unit generates a temperature compensation signal in response to the test temperature information. The refresh cycle adjustment unit changes a cycle of a reference refresh signal in response to the temperature compensation signal, and generates a refresh signal.