公开(公告)号：US11434561B2

公开(公告)日：2022-09-06

申请号：US17032437

申请日：2020-09-25

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： OhHan Kim ,  HunTeak Lee ,  Sell Jung ,  HeeSoo Lee

IPC: C23C14/50 ,  H01L23/00 ,  H01L23/498 ,  H01L23/552 ,  C23C14/34

Abstract: A semiconductor manufacturing device has a cooling pad with a plurality of movable pins. The cooling pad includes a fluid pathway and a plurality of springs disposed in the fluid pathway. Each of the plurality of springs is disposed under a respective movable pin. A substrate includes an electrical component disposed over a surface of the substrate. The substrate is disposed over the cooling pad with the electrical component oriented toward the cooling pad. A force is applied to the substrate to compress the springs. At least one of the movable pins contacts the substrate. A cooling fluid is disposed through the fluid pathway.

公开(公告)号：US20220157739A1

公开(公告)日：2022-05-19

申请号：US16950295

申请日：2020-11-17

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak Lee ,  KyungHwan Kim ,  HeeSoo Lee ,  ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L23/552 ,  H01L21/56

Abstract: A semiconductor package has a substrate, a first component disposed over the substrate, an encapsulant deposited over the first component, and a second component disposed over the substrate outside the encapsulant. A metal mask is disposed over the second component. A shielding layer is formed over the semiconductor package. The metal mask after forming the shielding layer. The shielding layer is optionally formed on a contact pad of the substrate while a conic area above the contact pad that extends 40 degrees from vertical remains free of the encapsulant and metal mask while forming the shielding layer. Surfaces of the metal mask and encapsulant oriented toward the contact pad can be sloped. The metal mask can be disposed and removed using a pick-and-place machine.

公开(公告)号：US20210301390A1

公开(公告)日：2021-09-30

申请号：US17032437

申请日：2020-09-25

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： OhHan Kim ,  HunTeak Lee ,  SeIl Jung ,  HeeSoo Lee

IPC: C23C14/50 ,  H01L23/00 ,  H01L23/498 ,  H01L23/552 ,  C23C14/34

Abstract: A semiconductor manufacturing device has a cooling pad with a plurality of movable pins. The cooling pad includes a fluid pathway and a plurality of springs disposed in the fluid pathway. Each of the plurality of springs is disposed under a respective movable pin. A substrate includes an electrical component disposed over a surface of the substrate. The substrate is disposed over the cooling pad with the electrical component oriented toward the cooling pad. A force is applied to the substrate to compress the springs. At least one of the movable pins contacts the substrate. A cooling fluid is disposed through the fluid pathway.

公开(公告)号：US10797039B2

公开(公告)日：2020-10-06

申请号：US15976455

申请日：2018-05-10

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： DeokKyung Yang ,  OhHan Kim ,  HeeSoo Lee ,  HunTeak Lee ,  InSang Yoon ,  Il Kwon Shim

IPC: H01L25/00 ,  H01L23/00 ,  H01L21/56 ,  H01L23/552 ,  H01L25/065 ,  H01L25/16 ,  H01L23/498 ,  H01L23/31 ,  H01L23/538 ,  H01L23/50

Abstract: A semiconductor device has a first substrate and a second substrate. An opening is formed through the second substrate. A first semiconductor component and second semiconductor component are disposed between the first substrate and second substrate. The second substrate is electrically coupled to the first substrate through the first semiconductor component. A first terminal of the first semiconductor component is electrically coupled to the first substrate. A second terminal of the first semiconductor component is electrically coupled to the second substrate. The second semiconductor component extends into the opening. An encapsulant is deposited over the first substrate and second substrate.

公开(公告)号：US20200161252A1

公开(公告)日：2020-05-21

申请号：US16193691

申请日：2018-11-16

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： DeokKyung Yang ,  HunTeak Lee ,  HeeSoo Lee ,  Wanil Lee ,  SangDuk Lee

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/66 ,  H01L21/56

Abstract: A semiconductor device has a substrate comprising a carrier and an interposer disposed on the carrier. An electrical component is disposed over a first surface of the interposer. An interconnect structure is disposed over the first surface of the interposer. An encapsulant is deposited over the electrical component, interconnect structure, and substrate. A trench is formed through the encapsulant and interposer into the carrier. A shielding layer is formed over the encapsulant and into the trench. The carrier is removed after forming the shielding layer.

公开(公告)号：US20180269195A1

公开(公告)日：2018-09-20

申请号：US15459997

申请日：2017-03-15

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： OhHan Kim ,  KyungHwan Kim ,  WoonJae Beak ,  HunTeak Lee ,  InSang Yoon

IPC: H01L25/00 ,  H01L23/58 ,  H01L23/552 ,  H01L23/00 ,  H01L21/683 ,  H01L21/56

Abstract: A semiconductor device has a semiconductor die or component, including an IPD, disposed over an attach area of a penetrable film layer with a portion of the semiconductor die or component embedded in the penetrable film layer. A conductive layer is formed over a portion of the film layer within the attach area and over a portion of the film layer outside the attach area. An encapsulant is deposited over the film layer, conductive layer, and semiconductor die or component. The conductive layer extends outside the encapsulant. An insulating material can be disposed under the semiconductor die or component. A shielding layer is formed over the encapsulant. The shielding layer is electrically connected to the conductive layer. The penetrable film layer is removed. The semiconductor die or component disposed over the film layer and covered by the encapsulant and shielding layer form an SIP module without a substrate.

公开(公告)号：US20180158768A1

公开(公告)日：2018-06-07

申请号：US15830644

申请日：2017-12-04

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： OhHan Kim ,  DeokKyung Yang ,  HunTeak Lee ,  InSang Yoon ,  Il Kwon Shim

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L23/552 ,  H01L25/065 ,  H01L23/538 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L23/49838 ,  H01L21/4803 ,  H01L21/4846 ,  H01L21/56 ,  H01L21/561 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5385 ,  H01L23/552 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/162 ,  H01L2224/0401 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/48091 ,  H01L2224/48179 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/15151 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19102 ,  H01L2924/19105 ,  Y02P80/30

Abstract: A semiconductor device has a first substrate. A first semiconductor component and second semiconductor component are disposed on the first substrate. In some embodiments, a recess is formed in the first substrate, and the first semiconductor component is disposed on the recess of the first substrate. A second substrate has an opening formed through the second substrate. A third semiconductor component is disposed on the second substrate. The second substrate is disposed over the first substrate and second semiconductor component. The first semiconductor component extends through the opening. An encapsulant is deposited over the first substrate and second substrate.

公开(公告)号：US11990424B2

公开(公告)日：2024-05-21

申请号：US18303308

申请日：2023-04-19

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak Lee ,  KyungHwan Kim ,  HeeSoo Lee ,  ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49822

Abstract: A semiconductor package has a substrate, a first component disposed over the substrate, an encapsulant deposited over the first component, and a second component disposed over the substrate outside the encapsulant. A metal mask is disposed over the second component. A shielding layer is formed over the semiconductor package. The metal mask after forming the shielding layer. The shielding layer is optionally formed on a contact pad of the substrate while a conic area above the contact pad that extends 40 degrees from vertical remains free of the encapsulant and metal mask while forming the shielding layer. Surfaces of the metal mask and encapsulant oriented toward the contact pad can be sloped. The metal mask can be disposed and removed using a pick-and-place machine.

公开(公告)号：US20240153783A1

公开(公告)日：2024-05-09

申请号：US18543992

申请日：2023-12-18

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak Lee ,  Gwang Kim ,  Junho Ye

IPC: H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/60 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/60 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/81815 ,  H01L2924/1532

Abstract: A semiconductor device has a substrate and a first component disposed over a first surface of the substrate. A connector is disposed over the first surface of the substrate. A first encapsulant is deposited over the first component while the connector remains outside of the first encapsulant. A shielding layer is formed over the first encapsulant while the connector remains outside of the shielding layer. A second component is disposed over a second surface of the substrate. A solder bump is disposed over the second surface of the substrate. A second encapsulant is deposited over the second surface of the substrate. An opening is formed through the second encapsulant to expose the solder bump. A solder ball is disposed in the opening. The solder ball and solder bump are reflowed to form a combined solder bump.

公开(公告)号：US20240128201A1

公开(公告)日：2024-04-18

申请号：US18390051

申请日：2023-12-20

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak Lee ,  Gwang Kim ,  Junho Ye ,  YouJoung Choi ,  MinKyung Kim ,  Yongwoo Lee ,  Namgu Kim

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/64 ,  H01L23/66 ,  H01Q1/24 ,  H01Q1/40

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/645 ,  H01L23/66 ,  H01Q1/243 ,  H01Q1/40 ,  H01L2223/6677

Abstract: A semiconductor device has a substrate and an electrical component disposed over a surface of the substrate. An antenna interposer is disposed over the substrate. A first encapsulant is deposited around the antenna interposer. The first encapsulant has a high dielectric constant. The antenna interposer has a conductive layer operating as an antenna and an insulating layer having a low dielectric constant less than the high dielectric constant of the first encapsulant. The antenna interposer is made from an antenna substrate having a plurality of antenna interposers. Bumps are formed over the antenna substrate and the antenna substrate is singulated to make the plurality of antenna interposers. A second encapsulant is deposited over the electrical component. The second encapsulant has a low dielectric constant less than the high dielectric constant of the first encapsulant. A shielding layer is disposed over the second encapsulant.