公开(公告)号：US20170290150A1

公开(公告)日：2017-10-05

申请号：US15505619

申请日：2015-09-08

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Takashi KASUGA ,  Yoshio OKA ,  Shigeaki UEMURA ,  Shigeyoshi NAKAYAMA ,  Jinjoo PARK ,  Sumito UEHARA ,  Hiroshi UEDA ,  Kousuke MIURA

IPC: H05K1/09 ,  C23C18/30 ,  H05K3/10 ,  H05K3/46 ,  H05K3/02 ,  C23C18/18 ,  C23C18/31

CPC classification number: H05K1/092 ,  B22F1/0018 ,  B22F1/0059 ,  B22F3/16 ,  B22F7/064 ,  B22F2998/10 ,  B22F2999/00 ,  C09D11/037 ,  C09D11/10 ,  C09D11/52 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/1879 ,  C23C18/2033 ,  C23C18/208 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/31 ,  C23C18/32 ,  C23C18/405 ,  C23C18/42 ,  H05K1/097 ,  H05K3/02 ,  H05K3/022 ,  H05K3/108 ,  H05K3/18 ,  H05K3/381 ,  H05K3/4661 ,  H05K2201/032 ,  H05K2203/0703 ,  H05K2203/1105 ,  C22C1/0425 ,  B22F7/08 ,  B22F1/0074 ,  C23C18/00 ,  B22F2003/248 ,  C25D7/00

Abstract: The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.

公开(公告)号：US20170118837A1

公开(公告)日：2017-04-27

申请号：US15311601

申请日：2015-05-12

Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Kousuke MIURA ,  Satoshi KIYA ,  Sumito UEHARA

IPC: H05K1/11 ,  H05K3/46 ,  H05K1/09 ,  H05K3/40 ,  H05K1/03

CPC classification number: H05K1/115 ,  H05K1/0313 ,  H05K1/034 ,  H05K1/09 ,  H05K3/381 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4661 ,  H05K2201/09509 ,  H05K2203/072

Abstract: An object of the present invention is to provide a printed wiring board in which conductive layers formed on two surfaces of a base layer that contains a fluororesin as a main component are reliably connected to each other through a via-hole. A printed wiring board according to an embodiment of the present invention includes a base layer containing a fluororesin as a main component, a first conductive layer stacked on one surface of the base layer, a second conductive layer stacked on the other surface of the base layer, and a via-hole that is formed along a connection hole penetrating the base layer and at least one of the first conductive layer and the second conductive layer in a thickness direction and that electrically connects the first conductive layer and the second conductive layer to each other. At least a part of an inner circumferential surface of the base layer in the connection hole has a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more.

公开(公告)号：US20160250830A1

公开(公告)日：2016-09-01

申请号：US15027323

申请日：2014-10-08

Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Satoshi KIYA ,  Sumito UEHARA ,  Kousuke MIURA ,  Makoto NAKABAYASHI

IPC: B32B27/32 ,  H05K3/38 ,  H05K1/02 ,  H05K3/20 ,  B32B7/12 ,  H05K1/03

CPC classification number: B32B27/322 ,  B32B7/12 ,  B32B27/30 ,  B32B2457/08 ,  H05K1/024 ,  H05K1/0274 ,  H05K1/034 ,  H05K1/0366 ,  H05K3/007 ,  H05K3/067 ,  H05K3/20 ,  H05K3/281 ,  H05K3/285 ,  H05K3/386 ,  H05K3/389 ,  H05K2201/0108 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0326 ,  H05K2201/09781 ,  H05K2201/2009 ,  H05K2203/0264 ,  H05K2203/0278 ,  H05K2203/0376 ,  H05K2203/0769 ,  H05K2203/1173

Abstract: A fluororesin base material containing a fluororesin as a main component includes a modified layer on at least a partial region of a surface thereof, the modified layer containing a siloxane bond and a hydrophilic organofunctional group, and a surface of the modified layer having a contact angle of 90° or less with pure water.

Abstract translation: 含氟树脂作为主要成分的氟树脂基材在其表面的至少部分区域上具有改性层，所述改性层含有硅氧烷键和亲水性有机官能团，所述改性层的表面具有接触角 90°以下。