摘要:
A charge/discharge control circuit has a voltage detector for detecting a voltage level of a secondary cell, a switch connected in series with the secondary cell, and a control circuit connected in parallel with the voltage detector for receiving and processing an output signal of the voltage detector and controlling an impedance of the switch. The voltage detector, the switch and the control circuit are integrated in a single substrate. In a preferred embodiment, the switch comprises an external connection terminal and a second terminal connected to the secondary cell, a first IGFET connected between the first and second terminals, a second IGFET connectected between the first terminal and a substrate electrode of the first IGFET, and a third IGFET connected between the second terminal and the substrate electrode of the first IGFET.
摘要:
A light valve device has a drive substrate integrated with a drive electrode. A transistor is connected to the drive electrode and a driving circuit energizes the drive electrode through the transistor. An opposed substrate is provided opposed to the drive electrode, and an electrooptical material layer is disposed between the drive substrate and the opposed substrate. The drive substrate has a structure comprising a substrate layer and a semiconductor single crystal thin film layer. The semiconductor single crystal thin film layer is made by thinning a semiconductor single crystal wafer which has been bonded to the substrate layer. The light valve device has a small size and high pixel density and can be formed using miniaturization technology. The light valve can be used for a small size, high resolution video projector and a color matrix display device.
摘要:
A method of manufacturing an electrically erasable semiconductor non-volatile memory device comprises forming a field insulating film on a surface of a semiconductor substrate having a first conductivity type. A gate insulating film is formed on the surface of the semiconductor substrate. Source and drain regions having a second conductivity type are formed in the surface of the semiconductor substrate in spaced-apart relationship with each other by introducing impurity ions having the second conductivity type into the semiconductor substrate with an acceleration energy sufficient to form a peak value of impurity concentration at a depth of more than approximately 500 .ANG. from the surface of the semiconductor substrate. The gate insulating film is then etched on the drain region to form a tunnel region having opposite sides connected to the field insulating film. Thereafter, a tunnel insulating film is formed on the tunnel region and a floating gate electrode is formed over the source region, the drain region and the semiconductor substrate through the gate insulating film and the tunnel insulating film. A control insulating film is then formed on the floating gate electrode, and a control gate electrode is formed over the floating gate electrode through the control insulating film.
摘要:
A MIS transistor comprises a semiconductor substrate having a first conductivity type, a source region and a drain region disposed in the semiconductor substrate in spaced-apart relation from one another and having a second conductivity type, and an insulating film disposed on the surface of the semiconductor substrate. A gate electrode is disposed on the insulating film between the source region and the drain region. A diffused region having the first conductivity type is disposed in the semiconductor substrate and in contact with the source region. An oxide film is disposed on the diffused region.
摘要:
A semiconductor integrated device having a current regulating diode may be substantially reduced in size and improved in performance by forming the current regulating diode of a plurality of MOS transistors each having a gate, a drain region, and a source region formed in a semiconductor substrate, the source regions and the substrate regions being electrically coupled to each other, the drain regions of at least two of the MOS transistors being electrically coupled, and the source regions of each of the MOS transistors being electrically coupled, the coupled drain regions, the coupled source regions, and the coupled gates forming a drain terminal, a source terminal and a gate terminal, respectively. In order to set a desired regulated current, selected coupling lines in the current regulating diode may be cut. This may be accomplished, for example, by measuring a first current which flows in the drain terminal while applying a first voltage to the gate terminal and a second voltage to the drain terminal relative to an electric potential of the source terminal, then measuring a second current which flows in the drain terminal while applying a third voltage to the gate terminal and the second voltage to the drain terminal relative to an electric potential of the source terminal. In order to achieve the desired current characteristic, selected conductive lines between coupled drains or between coupled sources are then cut.
摘要:
An electroconductive or insulative film 100 is formed over a surface of a semiconductor substrate 1. A first photoresist 101 is coated over the film 100, and is then patterned. The film 100 is selectively removed by etching to expose a given area of the substrate 1. Subsequently an impurity of the first conductivity type is doped into the exposed area to form a first impurity region. After removing the first photoresist 101, a second photoresist 103 is coated entirely over the film 100, and is then patterned. Subsequently, the film 100 is selectively removed from another given area by etching. Another impurity of the second conductivity type is doped into the exposed area to form a second impurity region 104. Only the two steps of the photoresist patterning are carried out to form the impurity regions of the different conductivity types, thereby reducing production cost of the semiconductor device. The impurity can be doped by ion implantation while covering the film 100 with the photoresist, thereby facilitating micronization and integration of the semiconductor device.
摘要:
An ashtray which has a main body including a tray for receiving ashes and a housing having an opening facing upwardly for housing the tray therein, a lid member for covering the opening of the housing therewith, a hinge assembly for rotatably connecting the lid member to the main body, an air cleaning means disposed at the lid member for removing impurities from the air, the air cleaning means including a fan for exhausting the air, a drive means for driving the fan and an air cleaner for removing impurities from the air and a light means for lighting the main body and the lid member. The ashtray can be used in a dimly-lit-place as well as in a well-lit place, and is able to clean the air by removing impurities, including smoke emitted from cigarettes or other smoking materials.
摘要:
A thermosensitive semiconductor device has a semiconductor substrate of one conductivity type which is used as the common collector of at least two Darlington-connected transistors. The base of the first stage transistor is connected to the common collector to form a first terminal and the emitter of the final stage transistor forms a second terminal. A constant current source is connected between the first and second terminals. To reduce deviations in the temperature response, a second collector region can be used and which can extend to a depth deeper than the depth of the emitter of the final stage transistor to absorb some of the carriers injected by the emitter.
摘要:
In a MISFET, areas where a channel surface of a channel region is inverted by a first gate voltage and areas where the channel surface is inverted by a second gate voltage are provided in the channel region of the MISFET in plane as components thereof. The channel region 104 having a first impurity concentration determined by a surface concentration of a P-type semiconductor substrate and a channel region 105 having a second impurity concentration determined by doping an impurity to the region selected by a pattern 106 of a mask for doping impurity by ion implantation and others are provided in a channel region of an N-type MOSFET on the P-type semiconductor substrate. The channel region 104 having the first impurity concentration and the channel region 105 having the second impurity concentration are divided into a plurality of plane shapes. The channel region of the same MOSFET may be structured by the plurality of plane shapes having the plurality of impurity concentrations as described above and a threshold voltage of the MOSFET may be readily set to a desired value in response to a plane area ratio of the area having the first impurity concentration and the area having the second impurity concentration, allowing to realize a high performance semiconductor integrated circuit device at low cost.