Method of manufacturing a semiconductor device
    22.
    发明授权
    Method of manufacturing a semiconductor device 失效
    制造半导体器件的方法

    公开(公告)号:US06228751B1

    公开(公告)日:2001-05-08

    申请号:US08706667

    申请日:1996-09-06

    IPC分类号: H01L27108

    摘要: A method of manufacturing a semiconductor device that forms laminate layers includes the steps of reducing contamination containing the single bond of carbon on at least one part of a surface on which the laminate films are formed by activated hydrogen before the laminate films are formed, and forming the laminate films on the surface on which the laminate films are formed.

    摘要翻译: 一种形成层叠层的半导体器件的制造方法包括以下步骤:在层压膜形成之前,通过活性氢在其上形成层压膜的表面的至少一部分上减少含有单键碳的污染物,并形成 在其上形成层压膜的表面上的层压膜。

    Method of manufacturing a semiconductor device
    24.
    发明授权
    Method of manufacturing a semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US07393723B2

    公开(公告)日:2008-07-01

    申请号:US10793909

    申请日:2004-03-08

    IPC分类号: H01L21/00

    摘要: A method of manufacturing a semiconductor device that forms laminate layers includes the steps of reducing contamination containing the single bond of carbon on at least one part of a surface on which the laminate films are formed by activated hydrogen before the laminate films are formed, and forming the laminate films on the surface on which the laminate films are formed.

    摘要翻译: 一种形成层叠层的半导体器件的制造方法包括以下步骤:在层压膜形成之前,通过活性氢在其上形成层压膜的表面的至少一部分上减少含有单键碳的污染物,并形成 在其上形成层压膜的表面上的层压膜。