公开(公告)号：US20080061115A1

公开(公告)日：2008-03-13

申请号：US11882824

申请日：2007-08-06

申请人： Andreas Ostmann ,  Alexander Neumann ,  Dionysios Manessis ,  Rainer Patzelt

发明人： Andreas Ostmann ,  Alexander Neumann ,  Dionysios Manessis ,  Rainer Patzelt

IPC分类号： B23K1/20 ,  B23K20/00

CPC分类号： H05K1/188 ,  H01L24/24 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1132 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13193 ,  H01L2224/2402 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/83 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/10674 ,  H05K2203/1189 ,  H01L2224/13099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method is provided for making an electrical connection with a microelectronic component arranged on or embedded within a surface of a circuit board layer or a substrate. The microelectronic component has an electrical contact face that is accessible on a surface of the microelectronic component. An electrically conducting bump is applied to the electrical contact face of the microelectronic component. A metal foil or metal coat is applied via a coating of an insulating binder to the surface of the circuit board under an action of pressure and/or heat so that the electrically conducting bump penetrates the coating of the insulating binder to make the electrical connection between the metal foil or metal coat and the electrical contact face.

摘要翻译： 提供了一种用于与布置在电路板层或衬底的表面上或嵌入电路板层或衬底的表面中的微电子组件进行电连接的方法。 微电子部件具有可在微电子部件的表面上接近的电接触面。 将导电凸起施加到微电子部件的电接触面。 金属箔或金属涂层通过绝缘粘合剂的涂层在压力和/或热的作用下施加到电路板的表面，使得导电凸块穿透绝缘粘合剂的涂层，以使电连接 金属箔或金属涂层和电接触面。

公开(公告)号：US20120320549A1

公开(公告)日：2012-12-20

申请号：US13515012

申请日：2010-12-17

申请人： Thomas Gottwald ,  Alexander Neumann

发明人： Thomas Gottwald ,  Alexander Neumann

IPC分类号： H05K7/00 ,  H05K3/46 ,  H01L23/48

CPC分类号： H05K1/186 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L2221/68304 ,  H01L2221/68327 ,  H01L2221/6835 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/1134 ,  H01L2224/12105 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/214 ,  H01L2224/2201 ,  H01L2224/221 ,  H01L2224/224 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/9202 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H05K1/189 ,  H05K3/205 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/462 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/10977 ,  H05K2203/063 ,  H05K2203/1469 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/83851

摘要： The present invention relates to a method for producing a conductor structural element, comprising providing a rigid substrate, electrodepositing a copper coating on the rigid substrate, applying a conductor pattern structure to the copper coating, then possibly mounting components, laminating the substrate with at least one electrically insulating layer, detaching the rigid substrate, at least partially removing the remaining copper coating of the rigid substrate in such a way that the conductor pattern structure is exposed.

摘要翻译： 导体结构元件的制造方法技术领域本发明涉及一种导体结构元件的制造方法，其特征在于，提供刚性基板，在所述刚性基板上电沉积铜涂层，将铜导体图案结构施加到所述铜涂层上，然后可能安装部件，至少层叠所述基板 一个电绝缘层，分离刚性基板，至少部分地去除刚性基板的剩余的铜涂层，使得暴露导体图案结构。

公开(公告)号：US08106768B2

公开(公告)日：2012-01-31

申请号：US11879445

申请日：2007-07-17

申请人： Alexander Neumann

发明人： Alexander Neumann

IPC分类号： G08B1/08 ,  G05B13/02 ,  G08C17/00 ,  H02J7/00 ,  H01M10/44 ,  H01M10/46

CPC分类号： G01D21/00 ,  Y02A30/257 ,  Y02B80/50

摘要： The method of operation applies to a self-powered home automation sensor device for detecting the existence of and/or for measuring the intensity of a first physical phenomenon, comprising a means of converting an effect of a second physical phenomenon into electrical energy and a means of determining the instantaneous power of this second physical phenomenon that can be converted into electrical energy, wherein a normal, first mode of operation of the device or an energy-saving second mode of operation of the device is activated according to a value defined on the basis of the determination of the instantaneous power that can be converted into electrical energy.

摘要翻译： 该操作方法适用于用于检测第一物理现象的强度的存在和/或用于测量第一物理现象的强度的自供电的家庭自动化传感器装置，包括将第二物理现象的影响转换为电能的装置和装置 确定可以转换成电能的第二物理现象的瞬时功率，其中设备的正常的第一操作模式或设备的节能第二操作模式根据在 确定可转换成电能的瞬时功率的基础。

公开(公告)号：US20100170085A1

公开(公告)日：2010-07-08

申请号：US12450998

申请日：2008-04-28

申请人： Ulrich Schaaf ,  Andreas Kugler ,  Karl-Friederich Becker ,  Alexander Neumann ,  Jan Kostelnik

发明人： Ulrich Schaaf ,  Andreas Kugler ,  Karl-Friederich Becker ,  Alexander Neumann ,  Jan Kostelnik

IPC分类号： H05K3/30

CPC分类号： H01L23/5389 ,  H01L23/3121 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1461 ,  H01L2924/181 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/188 ,  H05K3/4602 ,  H05K3/4641 ,  H05K2201/068 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49139 ,  H01L2924/00

摘要： In a method for producing an electronic subassembly, at least one electronic component is fixed in place on an insulating layer of a conductive foil in a first step, the conductive foil with the electronic component is laminated onto a circuit board substrate, and a circuit track structure is then developed by structuring the conductive foil. The expansion coefficient of the insulating layer lies between the expansion coefficient of the circuit board substrate and the expansion coefficient of the circuit track structure, and/or electronic components that require small passages for contacting with the circuit track structure are pressed deeper into the insulating layer than electronic components that require larger passages in the insulating layer.

摘要翻译： 在一种电子组件的制造方法中，在第一步骤中，将至少一个电子部件固定在导电箔的绝缘层上的适当位置，将具有电子部件的导电箔层压到电路板基板上，并且将电路轨迹 然后通过构造导电箔来开发结构。 绝缘层的膨胀系数位于电路板基板的膨胀系数和电路轨道结构的膨胀系数之间，和/或需要与电路轨道结构接触的小通道的电子部件被更深地压入绝缘层 比在绝缘层中需要更大通道的电子部件。

公开(公告)号：US20080017726A1

公开(公告)日：2008-01-24

申请号：US11879445

申请日：2007-07-17

申请人： Alexander Neumann

发明人： Alexander Neumann

IPC分类号： F24D12/00

CPC分类号： G01D21/00 ,  Y02A30/257 ,  Y02B80/50

摘要： The method of operation applies to a self-powered home automation sensor device for detecting the existence of and/or for measuring the intensity of a first physical phenomenon, comprising a means of converting an effect of a second physical phenomenon into electrical energy and a means of determining the instantaneous power of this second physical phenomenon that can be converted into electrical energy, wherein a normal, first mode of operation of the device or an energy-saving second mode of operation of the device is activated according to a value defined on the basis of the determination of the instantaneous power that can be converted into electrical energy.

摘要翻译： 该操作方法适用于用于检测第一物理现象的强度的存在和/或用于测量第一物理现象的强度的自供电的家庭自动化传感器装置，包括将第二物理现象的影响转换为电能的装置和装置 确定可以转换成电能的第二物理现象的瞬时功率，其中设备的正常的第一操作模式或设备的节能第二操作模式根据在 确定可转换成电能的瞬时功率的基础。