Method of forming metal fine particle pattern and method of forming electroconductive pattern
    21.
    发明授权
    Method of forming metal fine particle pattern and method of forming electroconductive pattern 失效
    形成金属微粒图案的方法和形成导电图案的方法

    公开(公告)号:US07279195B2

    公开(公告)日:2007-10-09

    申请号:US10921355

    申请日:2004-08-19

    摘要: A method of forming a metal fine particle pattern including forming a polymerization initiation layer on a support, wherein a polymer which has, in its side chain, a cross-linking group and a functional group having the ability to initiate polymerization is fixed by a cross-linking reaction, forming a graft polymer region in a pattern on the surface of the polymerization initiation layer, wherein the graft polymer layer has the ability to contain a metal ion or a metal salt, adding a metal ion or a metal salt to the graft polymer layer, and thereafter reducing the metal ion or a metal ion in the metal salt to form a metal fine particle dispersion region; and a method of forming an electroconductive pattern using the method of forming a metal fine particle pattern.

    摘要翻译: 一种形成金属微粒图案的方法,包括在载体上形成聚合引发层,其中在其侧链具有交联基团和具有引发聚合能力的官能团的聚合物通过十字 连接反应,在聚合引发层的表面上形成图案的接枝聚合物区域,其中接枝聚合物层具有容纳金属离子或金属盐的能力,向接枝物中加入金属离子或金属盐 聚合物层,然后还原金属盐中的金属离子或金属离子,形成金属微粒分散区; 以及使用形成金属细粒图案的方法形成导电图案的方法。

    Method of graft polymerization and variety of materials utilizing the same as well as producing method thereof
    22.
    发明授权
    Method of graft polymerization and variety of materials utilizing the same as well as producing method thereof 失效
    接枝聚合方法及使用其的各种材料及其制备方法

    公开(公告)号:US07056642B2

    公开(公告)日:2006-06-06

    申请号:US10662458

    申请日:2003-09-16

    IPC分类号: G03F7/004

    摘要: A method of graft polymerization which includes a step of forming a polymerization initiating layer in which a polymer having, on a side chain thereof, a crosslinking group and a functional group having polymerization initiating capability is immobilized on a support by a crosslinking reaction, and a step of conatacting a compound having a polymerizable functional group with the polymerization initiating layer, and then bonding the compound to the polymerization initiating layer supplying energy thereto, as well as a hydrophilic member, a printing plate precursor, a pattern forming material, a pattern forming method, a method of producing a particle-adsorbed material, and a method of producing a metal particle-dispersed thin layer film, to which the above-mentioned method of graft polymerization can be applied.

    摘要翻译: 一种接枝聚合方法,包括形成聚合引发层的步骤,其中具有交联基团和具有聚合引发能力的官能团的聚合物在其侧链上通过交联反应固定在载体上, 将具有聚合性官能团的化合物与聚合引发层相接合的步骤,然后将化合物与向其供应能量的聚合引发层接合,以及亲水部件,印版前体,图案形成材料,图案形成 方法,颗粒吸附材料的制造方法以及可以应用上述接枝聚合方法的金属颗粒分散薄膜的制造方法。

    Biosensor
    23.
    发明申请
    Biosensor 审中-公开
    生物传感器

    公开(公告)号:US20060068424A1

    公开(公告)日:2006-03-30

    申请号:US11202138

    申请日:2005-08-12

    IPC分类号: C12Q1/68 C12M1/34

    CPC分类号: G01N33/54393 G01N33/54373

    摘要: An object of the present invention is to provide a biosensor wherein at least two types of surfaces are patterned without impairing the sensor surface and non-specific adsorption is thereby suppressed. The present invention provides a biosensor comprising a substrate coated with a hydrophobic compound having a photoactive group, or a substrate which is coated with a hydrophobic polymer and is further modified with a compound having a photoactive group.

    摘要翻译: 本发明的目的是提供一种生物传感器,其中至少两种类型的表面被图案化而不损害传感器表面,由此抑制了非特异性吸附。 本发明提供一种生物传感器,其包括涂布有具有光活性基团的疏水性化合物的基材或涂布有疏水性聚合物的基材,并进一步用具有光活性基团的化合物改性。

    Conductive film forming method and conductive material
    24.
    发明申请
    Conductive film forming method and conductive material 审中-公开
    导电膜形成方法和导电材料

    公开(公告)号:US20050266255A1

    公开(公告)日:2005-12-01

    申请号:US11141318

    申请日:2005-06-01

    摘要: The invention provides a method for forming a conductive film including: applying energy to a surface of a base material including a polyimide having at least one structural unit represented by Formulae (1) or (2) and having a polymerization initiating site in a skeleton thereof to generate an activation site on the surface of the base material; forming a graft polymer that directly bonds to the surface of the base material and that interacts with either an electroless plating catalyst or a precursor thereof by using the activation site as a starting point; applying either an electroless plating catalyst or a precursor thereof to the graft polymer; and electroless plating. R1 represents a bivalent organic group. R2 represents one of Formulae (3) to (6). R3, R4, R1 and R5 independently represent a bivalent organic group.

    摘要翻译: 本发明提供一种形成导电膜的方法,包括:将能量施加到基材的表面,该基材包括具有至少一个由式(1)或(2)表示的结构单元的聚酰亚胺,并且在其骨架中具有聚合引发位点 以在基材的表面上产生活化位点; 形成与基材表面直接结合并通过使用活化部位作为起始点与化学镀催化剂或其前体相互作用的接枝聚合物; 将无电镀催化剂或其前体施用于接枝聚合物; 和化学镀。 R 1表示二价有机基团。 R 2表示式(3)〜(6)中的一个。 R 3,R 4,R 1和R 5独立地表示二价有机基团。

    Method for forming surface graft, conductive film and metal patterns
    26.
    发明授权
    Method for forming surface graft, conductive film and metal patterns 失效
    形成表面接枝,导电膜和金属图案的方法

    公开(公告)号:US07739789B2

    公开(公告)日:2010-06-22

    申请号:US10594227

    申请日:2005-03-24

    IPC分类号: H05K3/02

    摘要: The present invention provides a method for forming a surface graft, comprising the process of applying energy to the surface of a substrate containing polyimide having a polymerization initiating moiety in the skeleton thereof, to generate active points on the surface of the substrate and to generate a graft polymer that is directly bonded to the surface of the substrate starting from the active points and that has a polar group, and a surface graft material obtained thereby. The present invention also provides a method for forming a conductive film, comprising the processes of applying energy to the surface of a substrate containing polyimide having a polymerization initiating moiety in the skeleton thereof, to generate active points on the surface of the substrate and to generate a graft polymer that is directly bonded to the surface of the substrate starting from the active points and that has a polar group, and causing a conductive material to adhere to the graft polymer, and a conductive material obtained thereby.

    摘要翻译: 本发明提供了一种形成表面接枝物的方法,包括向基体上具有聚合引发部分的含有聚酰亚胺的基材的表面施加能量的方法,以在基材的表面上产生活性点,并产生 从活性点开始并且具有极性基团直接结合到基材表面的接枝聚合物,以及由此获得的表面接枝材料。 本发明还提供一种形成导电膜的方法,其包括在基体上具有聚合引发部分的含有聚酰亚胺的基材的表面施加能量的工序,以在基板的表面上产生活性点,并产生 从活性点开始直接键合到基材表面并具有极性基团并使导电材料附着到接枝聚合物上的接枝聚合物,以及由此获得的导电材料。

    Metal Film Formation Method of Metal Film
    27.
    发明申请
    Metal Film Formation Method of Metal Film 审中-公开
    金属膜金属成膜方法

    公开(公告)号:US20090004465A1

    公开(公告)日:2009-01-01

    申请号:US11813839

    申请日:2006-01-13

    摘要: The present invention provides a metal film formed by applying an electroless plating catalyst or its precursor to a polymer layer on a base plate having a surface roughness of 500 nm or less and then carrying out electroless plating, the polymer layer containing a polymer which has a functional group capable of interacting with the electroless plating catalyst or its precursor and is chemically bonded directly to the base plate, wherein the adhesion strength between the base plate and the metal film is 0.2 kN/m or more.

    摘要翻译: 本发明提供一种金属膜,该金属膜是通过将化学镀催化剂或其前体施加到表面粗糙度为500nm以下的基板上的聚合物层上,然后进行无电解电镀而形成的,该聚合物层含有具有 能够与化学镀催化剂或其前体相互作用并与基板直接化学键合的官能团,其中基板和金属膜之间的粘合强度为0.2kN / m以上。

    Metal Pattern Forming Methd, Metal Pattern Obtained by the Same, Printed Wiring Board, Conductive Film Forming Method, and Conductive Film Obtained by the Same
    29.
    发明申请
    Metal Pattern Forming Methd, Metal Pattern Obtained by the Same, Printed Wiring Board, Conductive Film Forming Method, and Conductive Film Obtained by the Same 失效
    金属图案形成Methd,由其获得的金属图案,印刷线路板,导电膜成型方法和由其获得的导电膜

    公开(公告)号:US20070246249A1

    公开(公告)日:2007-10-25

    申请号:US10580953

    申请日:2004-11-29

    IPC分类号: H05K1/09 B05D5/12

    摘要: The present invention provides a method of forming a metal pattern and a metal pattern obtained by the method. The method includes the steps of (I) forming on a substrate a polymer layer in which a polymer having a functional group that interacts with an electroless plating catalyst or a precursor thereof is chemically bonded directly to the substrate in a pattern form, (II) adding the electroless plating catalyst or precursor thereof to the polymer layer, and (III) forming a metal layer in the pattern form by electroless plating. The present invention also provides a method of forming a conductive film, including the steps of (A) forming on a substrate a polymerization initiating layer in which a polymer having, on a side chain thereof, a crosslinking group and a functional group having polymerization initiating capability is immobilized by a crosslinking reaction on the surface of the base material, (B) generating a graft polymer by chemically bonding a polymer having a functional group that interacts with an electroless plating catalyst or a precursor thereof directly onto the entire surface of the polymerization initiating layer, (C) adding the electroless plating catalyst or precursor thereof to the graft polymer, and (D) forming a metal layer by electroless plating.

    摘要翻译: 本发明提供一种通过该方法形成金属图案和金属图案的方法。 该方法包括以下步骤:(I)在基底上形成聚合物层,其中具有与化学镀催化剂或其前体相互作用的官能团的聚合物以图案形式直接化学键合到基底上,(II) 将化学镀催化剂或其前体添加到聚合物层中,和(III)通过无电镀形成图案形式的金属层。 本发明还提供一种形成导电膜的方法,包括以下步骤:(A)在基材上形成聚合引发层,其中在侧链上具有交联基团和具有聚合引发剂的官能团的聚合物 通过在基材表面上的交联反应来固定能力,(B)通过将具有与化学镀催化剂或其前体相互作用的官能团的聚合物直接化学键合到聚合物的整个表面上而产生接枝聚合物 引发层,(C)将化学镀催化剂或其前体加入到接枝聚合物中,和(D)通过无电镀形成金属层。

    Surface graft material, conductive pattern material, and production method thereof
    30.
    发明申请
    Surface graft material, conductive pattern material, and production method thereof 失效
    表面接枝材料,导电图案材料及其制造方法

    公开(公告)号:US20050208428A1

    公开(公告)日:2005-09-22

    申请号:US11084046

    申请日:2005-03-21

    摘要: A surface graft material including a substrate and a surface graft polymer chain, wherein the surface graft polymer chain includes a photocleavable moiety at one of its terminals, and the surface graft polymer chain is directly bonded to a surface of the substrate by a covalent bond between the photocleavable moiety and the substrate. A graft pattern formation method comprising exposing the graft material to cleave the photocleavable moiety in the exposed area, and removing the graft polymer chain from the exposed are to form a surface graft polymer chain pattern. A conductive pattern material and a metal particle pattern material using the graft pattern.

    摘要翻译: 包括基材和表面接枝聚合物链的表面接枝材料,其中所述表面接枝聚合物链在其一个末端包含可光致发光部分,并且所述表面接枝聚合物链通过所述基材的表面之间的共价键直接键合到所述基材的表面 可光洁剂部分和底物。 移植物图案形成方法包括使接枝材料暴露以暴露区域中的可光切割部分,以及从暴露部分移除接枝聚合物链,形成表面接枝聚合物链图案。 导电图案材料和使用该接枝图案的金属颗粒图案材料。