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公开(公告)号：US07749685B2
公开(公告)日：2010-07-06
申请号：US11378918
申请日：2006-03-17
IPC分类号： G03C1/00
CPC分类号： G03C1/73 , G03C1/732 , Y10S430/146 , Y10S430/155
摘要： An imaging method is disclosed. An imaging composition is coated on a work piece followed by applying a sufficient amount of energy from a 3-D imaging system to form an image on the coated work piece. The image may be a logo or marker for alignment of parts.
摘要翻译： 公开了一种成像方法。 将成像组合物涂覆在工件上，然后从3-D成像系统施加足够量的能量以在涂覆的工件上形成图像。 图像可以是用于对准部件的标志或标记。
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公开(公告)号：US07615130B2
公开(公告)日：2009-11-10
申请号：US11207627
申请日：2005-08-19
IPC分类号： B32B15/00
CPC分类号： G02B6/43 , G02B6/138 , G02B6/266 , G02B2006/12173 , G02B2006/12176 , H05K1/0274 , H05K2203/016
摘要： Provided are methods of forming a printed circuit board having optical functionality. The methods involve: (a) providing a first, printed circuit board substrate; (b) forming an optical waveguide structure comprising a clad and a core structure on a second substrate separate from the printed circuit board substrate, wherein the optical waveguide structure comprises a silicon-containing material; (c) separating the optical waveguide structure from the second substrate; and (d) affixing the optical waveguide structure to the printed circuit board substrate. The invention has particular applicability in the electronics and optoelectronics industries for the formation of hybrid printed circuit boards.
摘要翻译： 提供了形成具有光学功能的印刷电路板的方法。 所述方法包括：（a）提供第一印刷电路板基板; （b）在与印刷电路板基板分离的第二基板上形成包括包层和芯结构的光波导结构，其中所述光波导结构包括含硅材料; （c）将光波导结构与第二基板分离; 和（d）将光波导结构固定在印刷电路板基板上。 本发明在用于形成混合印刷电路板的电子和光电子工业中具有特别的适用性。
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公开(公告)号：US07270932B2
公开(公告)日：2007-09-18
申请号：US10773990
申请日：2004-02-06
CPC分类号： G03C1/73 , G03C1/732 , Y10S430/127 , Y10S430/163
摘要： Imaging compositions and methods of using the compositions are disclosed. The imaging compositions are sensitive to low levels of energy such that upon application of the low levels of energy the compositions change color or shade. The compositions may be used in methods of marking.
摘要翻译： 公开了使用组合物的成像组合物和方法。 成像组合物对低水平的能量敏感，使得当施加低水平的能量时，组合物改变颜色或阴影。 组合物可用于标记方法。
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公开(公告)号：US07072564B2
公开(公告)日：2006-07-04
申请号：US10993079
申请日：2004-11-19
摘要： Provided are compositions suitable for use in forming a flexible optical waveguide. The compositions include a polymer that has units of the formula (R1SiO1.5) and (R22SiO), wherein R1 and R2 are the same or different, and are substituted and/or unsubstituted organic groups, and wherein the (R22SiO) units are present in an amount of 14 wt % or more based on the polymer; and a plurality of functional end and/or internal groups. Also included is a component for altering the solubility of the composition upon activation. The solubility of the composition in a dried state is alterable upon activation of the component such that the composition is developable in an aqueous developer solution. Also provided are flexible optical waveguides, methods of forming flexible optical waveguides and electronic devices that include a flexible optical waveguide.
摘要翻译： 提供了适用于形成柔性光波导的组合物。 组合物包括具有下式的单元的聚合物（R 1 O 2 SiO 1.5）和（R 2）2 < SiO），其中R 1和R 2相同或不同，并且是取代和/或未取代的有机基团，并且其中（R 2） SiO 2单元的含量相对于聚合物为14重量％以上; 以及多个功能端和/或内部组。 还包括用于在活化时改变组合物的溶解度的组分。 组合物在干燥状态下的溶解度可以在组分活化后改变，使得组合物可在显影剂水溶液中显影。 还提供了柔性光波导，形成柔性光波导的方法和包括柔性光波导的电子器件。
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公开(公告)号：US07024093B2
公开(公告)日：2006-04-04
申请号：US10726052
申请日：2003-12-02
IPC分类号： G02B6/00
CPC分类号： G02B6/138
摘要： Provided are methods of forming optical waveguides. The methods involve: (a) forming over a substrate a layer of a photodefinable composition; (b) exposing a portion of the layer to actinic radiation; (c) developing the exposed layer to form a waveguide core structure; and (d) heating the waveguide core structure to a temperature and for a time effective to reflow the structure such that it becomes at least partially rounded in cross-section. Also provided are optical waveguides formed from the described methods and electronic devices including one or more of the optical waveguides.
摘要翻译： 提供了形成光波导的方法。 所述方法包括：（a）在基底上形成可光分解组合物的层; （b）将该层的一部分暴露于光化辐射; （c）显影曝光层以形成波导芯结构; 和（d）将波导芯结构加热到有效地回流结构的温度和时间，使得其在横截面中变得至少部分为圆形。 还提供了由所述方法形成的光波导和包括一个或多个光波导的电子器件。
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公开(公告)号：US06944945B1
公开(公告)日：2005-09-20
申请号：US09570321
申请日：2000-05-12
CPC分类号： H05K3/465 , H05K1/0271 , H05K3/205 , H05K3/3473 , H05K3/423 , H05K2201/09781 , H05K2201/2009 , H05K2203/0733 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： A method for manufacture of a circuit board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.
摘要翻译： 一种用于制造电路板和通过该方法形成的板的方法。 该方法包括依次选择性镀覆金属加强件，焊接垫，信号和互连。 所得板最好不含玻璃纤维增强层。
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27.发明授权Conductive polymer colloidal compositions with selectivity for non-conductive surfaces 有权导电聚合物胶体组合物，对非导电表面具有选择性公开(公告)号：US06899829B2
公开(公告)日：2005-05-31
申请号：US09998117
申请日：2001-11-30
摘要： A conductive polymer colloidal composition that selectively forms a coating on a non-conductive surface. The conductive polymer colloidal composition is composed of a polymer and a sulfonate dopant. The conductive polymer colloidal composition may also contain conductive colloidal particles such as conductive carbon or metal salt particles, oxidants, stabilizers, and preservatives. The conductive polymer colloidal composition may be employed to selectively coat the non-conductive parts of printed wiring boards such that a uniform metal layer can be deposited on the conductive polymer coat. In addition to a uniform metal layer being formed over the conductive polymer, adhesion between the metal layer and the printed wiring board is improved.
摘要翻译： 导电聚合物胶体组合物，其选择性地在非导电表面上形成涂层。 导电聚合物胶体组合物由聚合物和磺酸盐掺杂剂组成。 导电聚合物胶体组合物还可以含有导电胶体颗粒，例如导电碳或金属盐颗粒，氧化剂，稳定剂和防腐剂。 可以使用导电聚合物胶体组合物来选择性地涂覆印刷线路板的非导电部分，使得可以在导电聚合物涂层上沉积均匀的金属层。 除了在导电聚合物上形成均匀的金属层之外，还提高了金属层和印刷线路板之间的粘附性。
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公开(公告)号：US06506979B1
公开(公告)日：2003-01-14
申请号：US09570215
申请日：2000-05-12
IPC分类号： H05K102
CPC分类号： H05K3/465 , H05K3/0023 , H05K3/0032 , H05K3/205 , H05K3/3473 , H05K3/423 , H05K3/4682 , H05K2201/09472 , H05K2203/0152 , H05K2203/0338 , H05K2203/0726 , H05K2203/0733
摘要： A method for manufacture of a circuit board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.
摘要翻译： 一种用于制造电路板和通过该方法形成的板的方法。 该方法包括依次选择性地镀金属加强件，焊接垫，信号线和互连。 所得板最好不含玻璃纤维增强层。
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公开(公告)号：US06455231B1
公开(公告)日：2002-09-24
申请号：US09433153
申请日：1999-11-03
申请人： James G. Shelnut
发明人： James G. Shelnut
IPC分类号： G03F7033
CPC分类号： G03F7/161 , G03F7/027 , Y10S430/128
摘要： Dry film resists of the invention in general comprise a photoactive component, a highly viscous or solid (at room temperature, ca. 25° C.) crosslinker component, and preferably a flexibilizing agent. Preferred dry film constructions of the invention do not require the use of a protective cover sheet due to the composition's very dry nature.
摘要翻译： 本发明的干膜抗蚀剂通常包含光活性组分，高粘度或固体（室温，约25℃）交联剂组分，优选柔韧剂。 本发明优选的干膜结构由于组合物非常干燥的性质而不需要使用保护性覆盖片。
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公开(公告)号：US5528000A
公开(公告)日：1996-06-18
申请号：US395685
申请日：1995-02-28
摘要： A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer.
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