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10 条记录 (耗时 0.024 秒)

    Sequential build circuit board
    3.
    发明授权
    Sequential build circuit board 失效
    顺序构建电路板

    公开(公告)号：US06759596B1

    公开(公告)日：2004-07-06

    申请号：US09569553

    申请日：2000-05-12

    申请人： James G. Shelnut ,  Charles R. Shipley ,  Robert L. Goldberg

    发明人： James G. Shelnut ,  Charles R. Shipley ,  Robert L. Goldberg

    IPC分类号： H05K103

    CPC分类号： H05K1/0271 ,  H05K3/205 ,  H05K3/421 ,  H05K3/465 ,  H05K3/4682 ,  H05K2201/09781 ,  H05K2201/2009 ,  H05K2203/0152 ,  H05K2203/0733 ,  Y10T29/4913 ,  Y10T29/49156

    摘要： The invention provides multilayer circuit boards and methods for formation of a sequential build circuit board. Among other things, glass fiber reinforced copper clad epoxy substrates, required to provide strength or rigidity to prior boards, are not required for preferred circuit boards of the invention. Preferred methods of the invention include applying a dielectric coating onto a support; forming recesses in the dielectric coating that define openings including opening for at least one reinforcing member; depositing copper metal into the recesses to form a first layer; applying a second dielectric coating onto the first circuit layer; forming recesses in the second dielectric coating that define openings including openings for at least one reinforcing member in registration with the one or more reinforcing members in the first layer; depositing metal into the recesses in the dielectric coating to form the second layer; and repeating the process to form sequential build board having the desired number of layers.

    摘要翻译： 本发明提供了用于形成顺序构建电路板的多层电路板和方法。 除了其它方面，对于本发明的优选电路板，不需要为现有板提供强度或刚性所需的玻璃纤维增​​强铜包覆环氧树脂基板。 本发明的优选方法包括将介电涂层施加到载体上; 在所述电介质涂层中形成限定开口的凹部，所述开口包括用于至少一个加强构件的开口; 将铜金属沉积到所述凹部中以形成第一层; 将第二电介质涂层施加到所述第一电路层上; 在所述第二电介质涂层中形成限定开口的凹部，所述开口包括用于与所述第一层中的所述一个或多个加强构件对准的至少一个加强构件的开口; 将金属沉积到介电涂层中的凹槽中以形成第二层; 并重复该过程以形成具有所需数量层的顺序构建板。

    Electroplating process
    5.
    发明授权
    Electroplating process 失效
    电镀工艺

    公开(公告)号：US5419829A

    公开(公告)日：1995-05-30

    申请号：US243980

    申请日：1994-05-17

    申请人： Gordon Fisher ,  John J. Bladon ,  Wade Sonnenberg ,  Robert L. Goldberg

    发明人： Gordon Fisher ,  John J. Bladon ,  Wade Sonnenberg ,  Robert L. Goldberg

    IPC分类号： C25D5/54 ,  H05K3/42

    CPC分类号： C25D5/54 ,  H05K3/424

    摘要： A method for electroplating a nonconducting surface using a metal oxide colloid. The process comprises contacting the surface of the nonconductor to be plated with a preformed colloid of a metal oxide to adsorb the colloid onto the surface of the nonconductor and then electroplating metal over the surface having the adsorbed metal oxide colloid. The process may include a step of reducing the metal oxide to a lower valent state prior to the step of metal plating.

    摘要翻译： 一种使用金属氧化物胶体电镀不导电表面的方法。 该方法包括将待镀的非导体表面与金属氧化物的预制胶体接触，以将胶体吸附到非导体的表面上，然后在具有吸附的金属氧化物胶体的表面上电镀金属。 该方法可以包括在金属电镀步骤之前将金属氧化物还原为低价态的步骤。

    Electroplating process
    6.
    发明授权
    Electroplating process 失效
    电镀工艺

    公开(公告)号：US5484518A

    公开(公告)日：1996-01-16

    申请号：US206733

    申请日：1994-03-04

    申请人： Robert L. Goldberg

    发明人： Robert L. Goldberg

    IPC分类号： C25D5/54 ,  H05K3/42

    CPC分类号： C25D5/54 ,  H05K3/424

    摘要： A process for electroplating a substrate by coating the substrate with a liquid dispersion of conductive particles selected from the group of metals, metal oxides and metal sulfides, drying the substrate and electroplating over said dried coating. The process is especially useful for the fabrication of printed circuit boards.

    摘要翻译： 通过用选自金属，金属氧化物和金属硫化物的导电颗粒的液体分散体涂覆基板来电镀基板的方法，干燥基板并在所述干燥的涂层上电镀。 该方法对印刷电路板的制造特别有用。

    Method for patterning electroless metal on a substrate followed by reactive ion etching
    7.
    发明授权
    Method for patterning electroless metal on a substrate followed by reactive ion etching 失效
    在基板上图案化无电金属的方法，然后进行反应离子蚀刻

    公开(公告)号：US5112434A

    公开(公告)日：1992-05-12

    申请号：US672402

    申请日：1991-03-20

    申请人： Robert L. Goldberg

    发明人： Robert L. Goldberg

    IPC分类号： C23C18/16 ,  G03F7/00 ,  H01L21/266 ,  H01L21/308 ,  H01L21/311 ,  H01L21/48 ,  H05K3/18

    CPC分类号： H01L21/4846 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  G03F7/00 ,  H01L21/266 ,  H01L21/3081 ,  H01L21/3086 ,  H01L21/31144 ,  H01L21/481 ,  H05K3/185 ,  Y10S438/945 ,  Y10S438/95

    摘要： This invention describes methods for altering a substrate in a fine line image pattern using microlithographic processes including formation of a metal mask over a polymer coating to protect the coating during dry development of the same. A substrate is first coated with a polymer suitable for complexing noble metal compounds. The substrate is then complexed with a noble metal compound, such as by contact with a palladium salt, selectively irradiated to form the desired conductor pattern, and then etched so that the desired pattern remains. The substrate is subsequently placed in an electroless plating bath to form a metal mask. Alternatively, before applying the noble metal compound, a substrate immersed in a polymer solution suitable for complexing a noble metal compound can be selectively irradiated to selectively deposit polymer on the substrate, followed by applying a noble metal compound and electroless plating to form the desired mask.

    摘要翻译： 本发明描述了使用包括在聚合物涂层上形成金属掩模的微光刻工艺来改变细线图像图案中的衬底的方法，以在其干燥显影期间保护涂层。 首先用适合于络合贵金属化合物的聚合物涂覆基材。 然后将基底与贵金属化合物例如通过与钯盐接触而被选择性地照射以形成所需的导体图案，然后进行蚀刻，使得所需图案残留。 然后将基底放置在无电镀浴中以形成金属掩模。 或者，在涂布贵金属化合物之前，可以选择性地照射浸渍在适于配合贵金属化合物的聚合物溶液中的基板，以选择性地将聚合物沉积在基板上，然后施加贵金属化合物和化学镀以形成所需的掩模 。

    Conductive oxide coating process
    9.
    发明授权
    Conductive oxide coating process 失效
    导电氧化物涂层工艺

    公开(公告)号：US06632344B1

    公开(公告)日：2003-10-14

    申请号：US09535302

    申请日：2000-03-24

    申请人： Robert L. Goldberg ,  Michael Gulla

    发明人： Robert L. Goldberg ,  Michael Gulla

    IPC分类号： C25D554

    CPC分类号： C25D5/54 ,  C25D5/02 ,  C25D5/56 ,  H05K3/0055 ,  H05K3/424

    摘要： The invention is directed to a process for electroplating a non-conducting surface such as through-hole walls within a printed circuit board substrate. The process comprises formation of a conductive oxide coating over a substrate, preferably by immersion of said substrate in an aqueous oxidative desmear solution for a time sufficient to form a coating containing conductive dielectric oxidation residue and then, in the absence of a step of forming an additional conductive coating over the residue coating or removing the coating, electroplating metal onto said surface by immersion of the substrate having the coating in an electroplating solution.

    摘要翻译： 本发明涉及一种用于在印刷电路板衬底内电镀非导电表面（例如通孔壁）的方法。 该方法包括在衬底上形成导电氧化物涂层，优选通过将所述衬底浸入水性氧化脱粘剂溶液中足以形成含有导电介电氧化残余物的涂层的时间，然后在不存在形成 在残留物涂层上的额外的导电涂层或去除涂层，通过将具有涂层的基底浸入电镀溶液中将金属电镀到所述表面上。

    Electroplating process
    10.
    发明授权
    Electroplating process 失效
    电镀工艺

    公开(公告)号：US5500106A

    公开(公告)日：1996-03-19

    申请号：US489613

    申请日：1995-06-12

    申请人： Robert L. Goldberg

    发明人： Robert L. Goldberg

    IPC分类号： C25D5/54 ,  H05K3/42

    CPC分类号： C25D5/54 ,  H05K3/424

    摘要： A process for electroplating a substrate by coating the substrate with a porous coating of conductive particles having a reducing agent within its pores and electroplating over said coating. The reducing agent causes formation of an initial electroless metal deposit over the conductive particle coating thus enhancing its conductivity. The process is especially useful for the fabrication of printed circuit boards.

    摘要翻译： 一种通过用在其孔内具有还原剂的导电颗粒的多孔涂层涂覆基底并在所述涂层上电镀来对基底进行电镀的方法。 还原剂导致在导电颗粒涂层上形成初始化学金属沉积物，从而增强其导电性。 该方法对印刷电路板的制造特别有用。