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51 条记录 (耗时 0.039 秒)

    Array-type photo module
    22.
    发明授权
    Array-type photo module 有权
    阵列型照片模块

    公开(公告)号：US08744223B2

    公开(公告)日：2014-06-03

    申请号：US13410131

    申请日：2012-03-01

    申请人： Yuto Yamashita ,  Keiichi Sasaki ,  Etsuo Ogino ,  Yasuaki Tamura ,  Yuji Akahori ,  Yuichi Suzuki

    发明人： Yuto Yamashita ,  Keiichi Sasaki ,  Etsuo Ogino ,  Yasuaki Tamura ,  Yuji Akahori ,  Yuichi Suzuki

    IPC分类号： G02B6/32

    CPC分类号： G02B6/425 ,  G02B6/4215

    摘要： The present invention provides an array-type photo module including a filter, which, in each channel, transmits therethrough a portion of emitted light from an incident optical fiber on the opposite side of a gradient-index lens array and reflects another portion of the emitted light from the incident optical fiber toward the gradient-index lens array, and a light-shielding member which is arranged on the opposite side of the filter from the gradient-index lens array, so as to be spaced from the filter and, in each channel, has an opening passing therethrough transmitted light from the filter on the opposite side of the filter. The array-type photo module is easily and inexpensively manufactured, and may be used in a high-density array, with low crosstalk.

    摘要翻译： 本发明提供了一种阵列型照相模块，它包括一个滤光器，它在每个通道中透过其中一部分来自入射光纤的发射光，在入射光纤位于相反的一个梯度折射率透镜阵列上， 从入射光纤到达梯度折射率透镜阵列的光;以及遮光构件，其设置在与滤光镜相反的一侧，与滤光镜相隔离，并且每个 通道具有穿过过滤器相对侧上的来自过滤器的透射光的开口。 阵列型光模块容易且廉价地制造，并且可以以低串扰的高密度阵列使用。

    Through-hole forming method, inkjet head, and silicon substrate
    23.
    发明授权
    Through-hole forming method, inkjet head, and silicon substrate 失效
    通孔形成方法，喷墨头和硅衬底

    公开(公告)号：US08409452B2

    公开(公告)日：2013-04-02

    申请号：US12197499

    申请日：2008-08-25

    申请人： Keiichi Sasaki ,  Yukihiro Hayakawa

    发明人： Keiichi Sasaki ,  Yukihiro Hayakawa

    IPC分类号： H01B13/00

    CPC分类号： H01L21/308 ,  B41J2/1603 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1642 ,  B41J2202/13 ,  H01L29/06

    摘要： A through-hole forming method includes steps of forming a first impurity region (102a) around a region where a through-hole is to be formed in the first surface of a silicon substrate (101), the first impurity region (102) being higher in impurity concentration than the silicon substrate (101), forming a second impurity region (102b) at a position adjacent to the first impurity region (102a) in the depth direction of the silicon substrate (101), the second impurity region (102b) being higher in impurity concentration than the first impurity region (102a), forming an etch stop layer (103) on the first surface, forming an etch mask layer (104) having an opening on the second surface of the silicon substrate (101) opposite to the first surface, and etching the silicon substrate (101) until at least the etch stop layer (103) is exposed via the opening.

    摘要翻译： 通孔形成方法包括以下步骤：在硅衬底（101）的第一表面中形成在要形成通孔的区域周围的第一杂质区域（102a），第一杂质区域（102）更高 在所述硅衬底（101）的深度方向上与所述第一杂质区（102a）相邻的位置形成第二杂质区（102b），所述第二杂质区（102b） 杂质浓度高于第一杂质区（102a），在第一表面上形成蚀刻停止层（103），形成在硅衬底（101）的第二表面上具有开口的蚀刻掩模层（104） 并且蚀刻硅衬底（101），直到至少蚀刻停止层（103）经由开口露出。

    Maintenance support method, storage medium, and maintenance support apparatus
    29.
    发明申请
    Maintenance support method, storage medium, and maintenance support apparatus 有权
    维护支持方式，存储介质和维护支持设备

    公开(公告)号：US20050149570A1

    公开(公告)日：2005-07-07

    申请号：US11007759

    申请日：2004-12-09

    申请人： Keiichi Sasaki ,  Akira Sawada ,  Shigehito Kodera

    发明人： Keiichi Sasaki ,  Akira Sawada ,  Shigehito Kodera

    IPC分类号： F21V25/00 ,  G05B23/02 ,  G06F19/00 ,  G06Q50/00 ,  G06Q50/10

    CPC分类号： G06Q10/06

    摘要： In an embodiment of this invention, a diagnosis engine refers to a risk assessment DB and anti-risk measure DB, calculates along the time sequence a risk estimate amount in case of failure for each device and a maintenance cost in executing a measure method in advance, and adds the risk estimate amount and maintenance cost along the time sequence to calculate an optimum maintenance period of the device. When a failure has occurred in the device, the diagnosis engine refers to a failure diagnosis DB on the basis of the identification information of the device and the failure mode and analyzes, on the basis of an operation record, a failure which is different from a secular change.

    摘要翻译： 在本发明的实施例中，诊断引擎是指风险评估DB和反风险度量DB，沿着时间序列计算每个设备的故障情况下的风险估计量以及提前执行测量方法的维护成本 ，并根据时间序列添加风险估算量和维护成本，以计算设备的最佳维护周期。 当设备发生故障时，诊断引擎基于设备的识别信息和故障模式来参考故障诊断DB，并且基于操作记录分析与 世俗变化。

    Manufacturing method of circuit board, circuit board, and liquid discharging apparatus
    30.
    发明授权
    Manufacturing method of circuit board, circuit board, and liquid discharging apparatus 有权
    电路板，电路板和液体排放装置的制造方法

    公开(公告)号：US06838351B2

    公开(公告)日：2005-01-04

    申请号：US10805191

    申请日：2004-03-22

    申请人： Keiichi Sasaki ,  Masato Kamiichi ,  Ershad Ali Chowdhury ,  Yukihiro Hayakawa

    发明人： Keiichi Sasaki ,  Masato Kamiichi ,  Ershad Ali Chowdhury ,  Yukihiro Hayakawa

    IPC分类号： B41J2/05 ,  H01C17/065 ,  H01C17/28 ,  H05K1/16 ,  H05K3/02 ,  H01L27/02

    CPC分类号： H01C17/065 ,  H01C17/281 ,  H05K1/167 ,  H05K3/02 ,  Y10T29/49126

    摘要： A circuit board for a liquid discharging apparatus in which coating performance of a protective layer and a cavitation resistive film on a heat generating element is excellent and durability is excellent and a manufacturing method of such a circuit board are provided. A surface portion of a wiring material layer is processed so that an etching speed of the surface portion is made higher than that of the material forming the wiring material layer. It is desirable to execute a process for forming at least one selected from a fluoride, a chloride, and a nitride of the material forming the wiring material layer into the surface portion of the wiring material layer.

    摘要翻译： 一种用于液体排放装置的电路板，其中发热元件上的保护层和空穴电阻膜的涂层性能优异且耐久性优异，并且提供了这种电路板的制造方法。 处理布线材料层的表面部分，使得表面部分的蚀刻速度高于形成布线材料层的材料的蚀刻速度。 期望的是，将形成布线材料层的材料的氟化物，氯化物和氮化物中的至少一种形成到布线材料层的表面部分中。