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公开(公告)号：US07011457B2
公开(公告)日：2006-03-14
申请号：US10989290
申请日：2004-11-17
IPC分类号： G02B6/36
CPC分类号： G02B6/4204 , G02B6/4201 , G02B6/4208 , G02B6/4243 , G02B6/4256 , G02B6/4271
摘要： An optical coupling apparatus having a temperature control element on which a semiconductor light emitting element, a substrate and a lens are mounted, the semiconductor light emitting element being mounted on the substrate, and rays of light from the semiconductor light emitting element being introduced into the lens. A base on which the temperature control element is disposed, a through-hole portion formed in a housing wall portion installed on the base, penetrating through the housing wall portion and having a wall surface portion longer than a thickness of the housing wall portion and an optical fiber communicated with the through-hole portion and receiving converted light from the lens introduced thereto. A length of the substrate in a direction connecting the light emitting element to the optical fiber is within a range from 0.1 to 0.25 with respect to a length of the base sandwiched by the housing walls of the substrate.
摘要翻译： 一种具有安装有半导体发光元件，基板和透镜的温度控制元件的光耦合装置，半导体发光元件安装在基板上，并将来自半导体发光元件的光线引入到 镜片。 设置有温度控制元件的基座，形成在安装在基座上的壳体壁部中的通孔部分，穿过壳体壁部分并且具有比壳体壁部分的厚度更长的壁表面部分，以及 与通孔部分连通并接收从其引入的透镜的转换光的光纤。 在将发光元件连接到光纤的方向上的基板的长度相对于由基板的壳体壁夹持的基板的长度在0.1〜0.25的范围内。
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公开(公告)号：US20050063649A1
公开(公告)日：2005-03-24
申请号：US10989290
申请日：2004-11-17
CPC分类号： G02B6/4204 , G02B6/4201 , G02B6/4208 , G02B6/4243 , G02B6/4256 , G02B6/4271
摘要： An optical coupling apparatus having a temperature control element on which a semiconductor light emitting element, a substrate and a lens are mounted, the semiconductor light emitting element being mounted on the substrate, and rays of light from the semiconductor light emitting element being introduced into the lens. A base on which the temperature control element is disposed, a through-hole portion formed in a housing wall portion installed on the base, penetrating through the housing wall portion and having a wall surface portion longer than a thickness of the housing wall portion and an optical fiber communicated with the through-hole portion and receiving converted light from the lens introduced thereto. A length of the substrate in a direction connecting the light emitting element to the optical fiber is within a range from 0.1 to 0.25 with respect to a length of the base sandwiched by the housing walls of the substrate.
摘要翻译： 一种具有安装有半导体发光元件，基板和透镜的温度控制元件的光耦合装置，半导体发光元件安装在基板上，并将来自半导体发光元件的光线引入到 镜片。 设置有温度控制元件的基座，形成在安装在基座上的壳体壁部中的通孔部分，穿过壳体壁部分并且具有比壳体壁部分的厚度长的壁表面部分，以及 与通孔部分连通并接收从其引入的透镜的转换光的光纤。 在将发光元件连接到光纤的方向上的基板的长度相对于由基板的壳体壁夹持的基板的长度在0.1〜0.25的范围内。
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公开(公告)号：US6124553A
公开(公告)日：2000-09-26
申请号：US262270
申请日：1994-06-20
IPC分类号： H05K3/46 , H01L23/02 , H01L23/12 , H01L23/498 , H05K1/16
CPC分类号： H01L23/49838 , H01L23/49822 , H01L23/49833 , H01L2224/16 , H01L2924/00014 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/16152 , H01L2924/3025
摘要： A multilayer wiring system for preventing the generation of fixing failure due to an organic residue, eliminating an increase in the number of processes and reducing an area necessary for bonding of the cap and its fabrication method. The multilayer wiring board includes at least one wiring layer made of a conductor, at least one insulating layer made of an organic matter and a board. The wiring layer and the insulating layer are alternately laminated on the board and a cap is provided for covering the insulating layer and the wiring layer. The wiring layer has a wiring pattern for forming a wiring and a frame pattern for surrounding the wiring pattern. This frame pattern includes vent holes. The insulating layer has a shield structure made of an inorganic matter around the outer peripheral portion thereof and/or in the interior thereof. The shield structure is formed of the frame patterns continuously connected to each other and the cap is joined to an uppermost layer of the shield structure.
摘要翻译： 一种用于防止由于有机残渣产生固定故障的多层布线系统，消除了工艺数量的增加并减少了盖子接合所需的面积及其制造方法。 多层布线基板包括至少一层由导体制成的布线层，至少一层由有机物制成的绝缘层和基板。 布线层和绝缘层交替地层叠在基板上，并且设置盖以覆盖绝缘层和布线层。 布线层具有用于形成布线的布线图形和用于围绕布线图案的框图案。 该框架图案包括通气孔。 绝缘层具有由外周部分和/或其内部的无机物构成的屏蔽结构。 屏蔽结构由彼此连续连接的框架图案形成，并且盖与屏蔽结构的最上层接合。
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公开(公告)号：US08003193B2
公开(公告)日：2011-08-23
申请号：US11924924
申请日：2007-10-26
申请人： Shohei Hata , Eiji Sakamoto , Naoki Matsushima
发明人： Shohei Hata , Eiji Sakamoto , Naoki Matsushima
CPC分类号： G01P15/0802 , B81B2201/0271 , B81C1/00269 , G01P1/023 , G01P15/0897 , H03H9/105 , H03H9/1057 , H03H9/173 , Y10T428/24273 , Y10T428/24322 , Y10T428/2462 , Y10T428/24826 , Y10T428/265
摘要： The present invention provides a low-cost MEMS functional device by improving air tightness of a jointed section by anode junction in wafer level packaging for MEMS based functional devices. The MEMS functional device comprises a function element section formed by processing a substrate mainly made of Si, a metallized film for sealing formed around the functional element, and a glass substrate jointed to the metallized film for sealing by anode junction. Formed on a surface of the metallized film for sealing is a metallized film containing at least one of Sn and Ti as a main component.
摘要翻译： 本发明通过在基于MEMS的功能器件的晶片级封装中改善阳极结的接合部分的气密性来提供低成本MEMS功能器件。 MEMS功能器件包括通过处理主要由Si制成的衬底，形成在功能元件周围形成的用于密封的金属化膜形成的功能元件部分，以及连接到金属化膜的用于通过阳极接合进行密封的玻璃衬底。 形成在用于密封的金属化膜的表面上是以Sn和Ti中的至少一种为主要成分的金属化膜。
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公开(公告)号：US20090294158A1
公开(公告)日：2009-12-03
申请号：US11814847
申请日：2006-03-09
申请人： Naoki Matsushima , Hideaki Takemori
发明人： Naoki Matsushima , Hideaki Takemori
CPC分类号： H01L23/49816 , H01L23/49822 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/05082 , H01L2224/05169 , H01L2224/05554 , H01L2224/05624 , H01L2224/05644 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48465 , H01L2224/48472 , H01L2224/48475 , H01L2224/48478 , H01L2224/4848 , H01L2224/48624 , H01L2224/48644 , H01L2224/48724 , H01L2224/49175 , H01L2224/78301 , H01L2224/85009 , H01L2224/85051 , H01L2224/85205 , H01L2224/85214 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/10162 , H01L2924/12042 , H01L2924/12043 , H01L2924/15153 , H01L2924/1517 , H01L2924/15788 , H01L2924/19041 , H01L2924/20752 , H01L2924/3011 , H05K1/0306 , H05K3/328 , H05K3/4007 , H05K3/4644 , H05K2201/0154 , H05K2201/0367 , H05K2203/049 , Y10T29/49124 , H01L2924/00014 , H01L2924/00 , H01L2224/48744 , H01L2924/00015
摘要： To provide an electronic circuit board in which a conductive wire is excellently connected to a bonding pad formed directly on a polyimide film. The electronic circuit includes: a first layer metal pattern 3 formed on a substrate 1; a polyimide film 2 formed on the first layer metal pattern 3; and a second layer metal pattern formed on a surface of the polyimide film 2. A conductive bump 4 is formed on the surface of the second layer metal pattern 31 by ball-bonding to provide electrical connection with a semiconductor chip 7 bonded to the first layer metal pattern by die-bonding. The conductive bump 4 is electrically connected to an electrode 72 of the semiconductor chip 7 by wire bonding.
摘要翻译： 提供一种电线电路板，其中导线与直接形成在聚酰亚胺膜上的接合焊盘良好地连接。 电子电路包括：形成在基板1上的第一层金属图案3; 形成在第一层金属图案3上的聚酰亚胺膜2; 以及形成在聚酰亚胺膜2的表面上的第二层金属图案。通过滚珠接合在第二层金属图案31的表面上形成导电凸块4，以与连接到第一层的半导体芯片7电连接 金属图案通过芯片接合。 导电凸块4通过引线接合电连接到半导体芯片7的电极72。
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公开(公告)号：US07520683B2
公开(公告)日：2009-04-21
申请号：US11195663
申请日：2005-08-03
CPC分类号： G02B6/4201 , G02B6/4206 , G02B6/4267 , G02B6/4268 , G02B6/4271
摘要： To provide a small-sized and reliable optical module in which a light emitting element and an optical function element respectively remarkably different in a coefficient of thermal expansion are mounted in the same casing, in the invention, the optical function element is mounted on the casing made of first material substantially equal in a coefficient of thermal expansion to the optical function element, a light emitting element unit including the light emitting element (for example, a thermoelectric module over which the light emitting element is mounted) is mounted on a member (base material) made of second material different from the first material and matched with the light emitting element unit in a coefficient of thermal expansion, and the member is, for example, embedded in the bottom of the casing.
摘要翻译： 为了提供一种小型可靠的光学模块，其中在同一壳体中安装有分别显着不同的热膨胀系数的发光元件和光学功能元件，在本发明中，光学功能元件安装在壳体 由与光学功能元件的热膨胀系数基本相等的第一材料制成，包括发光元件（例如，安装有发光元件的热电模块）的发光元件单元安装在构件上 基材）由与第一材料不同的第二材料制成，并且以热膨胀系数与发光元件单元匹配，并且该构件例如嵌入壳体的底部。
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公开(公告)号：US20080259337A1
公开(公告)日：2008-10-23
申请号：US11944064
申请日：2007-11-21
IPC分类号： G01N21/00
CPC分类号： A61B5/0261 , A61B5/6814 , A61B2560/0252 , A61B2562/0233 , A61B2562/046
摘要： A cerebral function measuring apparatus houses a light detector in a package that can be set on the head of the subject examinee with light detection elements, amplifiers, and high voltage power supplies sealed in the package. Each amplifier and each high voltage power supply are united into one and covered with a high polymer material with high dielectric strength, and further enclosed by a metallic shield so as to be insulated. The high voltage power supply consists of a very small coil and an integrated circuit to generate a voltage required to drive the light detection element in the package. A removable and safe module type light detector is thus realized.
摘要翻译： 大脑功能测量装置容纳包装中的光检测器，该检测器可以被封装在被检体内的光检测元件，放大器和高压电源上。 每个放大器和每个高压电源组合成一个并覆盖有高介电强度的高聚合物材料，并进一步用金属屏蔽物封闭以便被绝缘。 高压电源由非常小的线圈和集成电路组成，以产生驱动封装中的光检测元件所需的电压。 从而实现了可移动和安全的模块型光检测器。
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公开(公告)号：US07038866B2
公开(公告)日：2006-05-02
申请号：US11127179
申请日：2005-05-12
IPC分类号： G02B7/02
CPC分类号： G02B6/4204 , G02B7/008
摘要： The present invention provides a compact, highly reliable optical module in which a light-emitting element and optical modulator element that differ from each other in thermal expansion coefficient are mounted in one casing. In the optical module having a differential thermal expansion coefficient less than 5×10−6 [1/K] between the light-emitting element and the casing, and a differential thermal expansion coefficient of at least 5×10−6 [1/K] between the optical modulator element and the casing, a section at which the optical modulator element and the casing are fixed is equal to or less than 10 mm wide in the direction of an optical axis.
摘要翻译： 本发明提供一种紧凑，高度可靠的光学模块，其中将热膨胀系数彼此不同的发光元件和光调制元件安装在一个壳体中。 在发光元件和外壳之间的差热膨胀系数小于5×10 -6 [1 / K]的光学模块中，并且差分热膨胀系数为至少5×10 -6 光调制元件与外壳之间的-6 / 1 / K，光调制元件和外壳固定的部分在光轴方向宽度为10mm以下。
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公开(公告)号：US20050275958A1
公开(公告)日：2005-12-15
申请号：US11127179
申请日：2005-05-12
CPC分类号： G02B6/4204 , G02B7/008
摘要： The present invention provides a compact, highly reliable optical module in which a light-emitting element and optical modulator element that differ from each other in thermal expansion coefficient are mounted in one casing. In the optical module having a differential thermal expansion coefficient less than 5×10−6 [1/K] between the light-emitting element and the casing, and a differential thermal expansion coefficient of at least 5×10−6 [1/K] between the optical modulator element and the casing, a section at which the optical modulator element and the casing are fixed is equal to or less than 10 mm wide in the direction of an optical axis.
摘要翻译： 本发明提供一种紧凑，高度可靠的光学模块，其中将热膨胀系数彼此不同的发光元件和光调制元件安装在一个壳体中。 在发光元件和外壳之间的差热膨胀系数小于5×10 -6 [1 / K]的光学模块中，并且差分热膨胀系数为至少5×10 -6 光调制元件与外壳之间的-6 / 1 / K，光调制元件和外壳固定的部分在光轴方向宽度为10mm以下。
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公开(公告)号：US06937406B2
公开(公告)日：2005-08-30
申请号：US10645986
申请日：2003-08-22
申请人： Naoki Matsushima , Hideo Sotokawa , Hideyuki Kuwano , Yoshiaki Niwa , Keiichi Yamada , Masahiro Hirai , Kazumi Kawamoto , Shohei Hata , Toshiaki Takai
发明人： Naoki Matsushima , Hideo Sotokawa , Hideyuki Kuwano , Yoshiaki Niwa , Keiichi Yamada , Masahiro Hirai , Kazumi Kawamoto , Shohei Hata , Toshiaki Takai
CPC分类号： G02B6/4204 , G02B6/423 , G02B6/4239 , G02B7/025
摘要： The present invention provides an optical module and a method for manufacturing the optical module, in which a V-shaped or trapezoidal groove having a first slope and a second slope facing to the first slope is formed at the surface of a silicon substrate by anisotropic etching, an adhesive is applied to a portion of at least the second slope in a region except the first slope of the groove, and lens is fixedly put in the groove.
摘要翻译： 本发明提供了一种光学模块及其制造方法，其中通过各向异性蚀刻在硅衬底的表面上形成具有第一斜面和第一斜面的第一斜面的V形或梯形槽 在除了槽的第一斜面之外的区域中，至少第二斜面的一部分施加粘合剂，并且将透镜固定地放入槽中。
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