摘要:
A nitride semiconductor device according to the present invention sequentially includes at least an n-electrode, an n-type semiconductor layer, an active layer, and a p-type semiconductor layer. The n-type semiconductor layer includes: an n-type GaN contact layer including n-type impurity-doped GaN having an electron concentration ranging from 5×1016 cm−3 to 5×1018 cm−3; the n-electrode provided on one of a main surface of the n-type GaN contact layer; and a generating layer provided on other main surface of the n-type GaN contact layer, including at least any one of AlxGa1-xN (0
摘要翻译:根据本发明的氮化物半导体器件至少依次包括n电极,n型半导体层,有源层和p型半导体层。 n型半导体层包括:n型GaN接触层,其包含具有5×10 16 cm -3至5×10 18 cm -3的电子浓度的n型杂质掺杂的GaN; n电极,设置在n型GaN接触层的主表面之一上; 和包含Al x Ga 1-x N(0
摘要:
There are provided a nitride semiconductor device such as a nitride semiconductor light emitting device, a transistor device or the like, obtained by forming a buffer layer of a single crystal of the nitride semiconductor, in which both a-axis and c-axis are aligned, directly on a substrate lattice-mismatched with the nitride semiconductor without forming an amorphous low temperature buffer layer, and growing epitaxially the nitride semiconductor layer on the buffer layer of the single crystal. In this device, a single crystal buffer layer (2), made of a single crystal of AlxGayIn1-x-yN (0≦x≦1, 0≦y≦1 and 0≦x+y≦1), in which a-axis and c-axis are aligned, is directly formed on a substrate (1) lattice-mismatched with nitride semiconductor, and a nitride semiconductor layer (3) is epitaxially grown on the buffer layer (2) of the single crystal. The buffer layer of the single crystal can be formed by the use of a PLD method.
摘要翻译:提供了一种氮化物半导体器件,例如氮化物半导体发光器件,晶体管器件等,其通过形成氮化物半导体的单晶的缓冲层而获得,其中a轴和c轴都被对准 直接在与氮化物半导体晶格失配的衬底上,而不形成非晶低温缓冲层,并且在单晶缓冲层上外延生长氮化物半导体层。 在该器件中,由AlxGayIn1-x-yN(0≤x≤1,0<= y <= 1和0 <= x + y <= 1)的单晶制成的单晶缓冲层(2) ),其中a轴和c轴对准,直接形成在与氮化物半导体晶格失配的衬底(1)上,并且氮化物半导体层(3)外延生长在 单晶。 单晶的缓冲层可以通过使用PLD法形成。
摘要:
Provided is a multilayer substrate having the configuration in which a multilayer film is formed on a principal surface opposite to a principal surface in the oxide-thin-film lamination direction in a translucent substrate. The multilayer film is formed by sequentially laminating a dielectric film, Au (gold) film, and oxide film in this order from the translucent substrate. On the principal surface opposite to the principal surface on which the oxide thin film is disposed, the multilayer film containing the Au film is formed, the Au film can reflect and block the excessive infrared light from a substrate holder or a heat source at the time of growth. As a result, temperature can be accurately measured.
摘要:
Although there is provided a high light transmittance of an emitted light by a ITO electrode film conventionally employed, there occurs a formation of a Schottky type contact between the ITO electrode film and a p type GaN system semiconductor layer, thus resulting in a not uniform flow of an electric current. It is an object of the present invention to provide a semiconductor light emitting device constituted by forming a transparent electrode, which facilitates acquiring an ohmic property, to be replaced by an ITO electrode film, at the light extracting or light exit side of the GaN system semiconductor light emitting device, so as to improve a light emission efficiency and a radiation extracting efficiency or a light exit efficiency of a GaN system semiconductor light emitting device. In order to accomplish the above mentioned object, the present invention provides a semiconductor light emitting device comprising a light emission layer, consisting of a GaN system semiconductor, which is interposed between an n type GaN system semiconductor layer and a p type GaN system semiconductor layer, wherein there is provided a Ga-doped MgzZn1-zO (0≦
摘要:
A semiconductor laser device includes a nitride semiconductor laminate structure including an n-type clad layer, an n-type guide layer formed on the n-type clad layer, a light emitting layer formed on the n-type guide layer and a p-type semiconductor layer formed on the light emitting layer. The nitride semiconductor laminate structure does not include a p-type semiconductor clad layer. The semiconductor laser device further includes an upper clad layer formed on the p-type semiconductor layer. The upper clad layer includes a first conductive film made of an indium oxide-based material and a second conductive film formed on the first conductive film and made of a zinc oxide-based material, a gallium oxide-based material or a tin oxide-based material.
摘要:
There is provided a zinc oxide based compound semiconductor device which, even when a semiconductor device is formed by forming a lamination portion having a hetero junction of ZnO based compound semiconductor layers, does not cause any rise in a drive voltage while ensuring p-type doping, and, at the same time, can realize good crystallinity and excellent device characteristics. ZnO based compound semiconductor layers (2) to (6) are epitaxially grown on the principal plane of a substrate (1) made of MgxZn1-xO (0≦x
摘要翻译:提供了一种氧化锌基化合物半导体器件,即使当通过形成具有ZnO基化合物半导体层的异质结的层叠部分形成半导体器件时,也不会导致驱动电压的任何上升,同时确保p型掺杂 ,同时可以实现良好的结晶度和优异的器件特性。 ZnO基化合物半导体层(2)〜(6)在由Mg x Zn 1-x O(0&nlE; x <1)构成的基板(1)的主面上外延生长。 基板的主平面是A平面{11-20}或M平面{10-10}在-c轴方向上倾斜的平面。
摘要:
Provided is a ZnO-based semiconductor device in which, in the case of forming a laminate including an acceptor-doped layer made of a ZnO-based semiconductor, the properties of a film can be stabilized by preventing deterioration of the flatness of the acceptor-doped layer or a layer after the acceptor-doped layer and an increase of crystal defect in the layer, without lowering the concentration of an acceptor element.
摘要:
Provided is a ZnO-based semiconductor device in which flat ZnO-based semiconductor layers can be grown on a MgZnO substrate having a laminate-side principal surface including a C-plane. With an MgxZn1-xO substrate (0≦x
摘要翻译:提供一种其中可以在具有包括C面的层压体侧主表面的MgZnO基板上生长平坦的ZnO基半导体层的ZnO基半导体器件。 对于具有包括C面的主表面的Mg x Zn 1- x O衬底(0&amp; nlE; x <1),主表面形成为使得在衬底的晶轴的c轴和通过突出 在由m轴和衬底的晶轴的c轴限定的平面上的主表面的法线可以在0 <Φm和nlE的范围内; 3。 在如此形成的主表面上,外延生长ZnO基半导体层2至5。 在ZnO基半导体层5上形成p电极8,在Mg x Zn 1-x O基板1的底面形成有n电极9.以这种方式,在Mg x Zn n-x O基板的表面上形成有台阶 同时在m轴方向上规则地布置。 由此,可以避免称为步骤聚束的现象,能够提高在基板1上形成的各半导体层的膜的平坦度。
摘要:
Provided is a ZnO-based thin film which is doped with p-type impurities and which can be used for various devices. An MgxZn1-xO film (0≦x≦0.5) is formed on top of a substrate so as to have an acceptor concentration of a p-type dopant that is 5×1020 cm−3 or less. An acceptor concentration exceeding 5×1020 cm−3 results in the formation of a mixed crystal of the p-type impurities and the ZnO crystal as the base material. Accordingly, no high-quality ZnO-based thin film doped to be p-type can be obtained. This fact is testified by the change observed in the ZnO secondary ion intensity.
摘要:
Provided are a ZnO-based thin film which is inhibited from being doped with an unintentional impurity, and a semiconductor device. The ZnO-based thin film has a main surface: which is formed of MgxZn1-xO (0≦x
摘要翻译:提供了抑制非掺杂杂质的ZnO类薄膜和半导体器件。 ZnO系薄膜的主表面由含有p型杂质的Mg x Zn 1-x O(0&nlE; x <1)形成; 并且当用原子力显微镜观察主表面时满足以下条件中的至少一个:观察到的六边形凹坑的密度不大于5×10 6个凹坑/ cm 2; 并且在主表面中没有发现凹陷部分,其包括形成在凹陷部分的底部中的多个微晶突起。