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    COLORS ONLY PROCESS TO REDUCE PACKAGE YIELD LOSS
    22.
    发明申请
    COLORS ONLY PROCESS TO REDUCE PACKAGE YIELD LOSS 有权
    颜色只有减少包装损失的过程

    公开(公告)号：US20090111208A1

    公开(公告)日：2009-04-30

    申请号：US12347468

    申请日：2008-12-31

    申请人： Yang-Tung FAN ,  Chiou-Shian Peng ,  Cheng-Yu Chu ,  Shih-Jane Lin ,  Yen-Ming Chen ,  Fu-Jier Fan ,  Kuo-Wei Lin

    发明人： Yang-Tung FAN ,  Chiou-Shian Peng ,  Cheng-Yu Chu ,  Shih-Jane Lin ,  Yen-Ming Chen ,  Fu-Jier Fan ,  Kuo-Wei Lin

    IPC分类号： H01L31/18

    CPC分类号： H01L27/14685 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14645 ,  H01L31/02162 ,  H01L31/02327

    摘要： Disclosed is an ordered microelectronic fabrication sequence in which color filters are formed by conformal deposition directly onto a photodetector array of a CCD, CID, or CMOS imaging device to create a concave-up pixel surface, and, overlayed with a high transmittance planarizing film of specified index of refraction and physical properties which optimize light collection to the photodiode without additional conventional microlenses. The optically flat top surface serves to encapsulate and protect the imager from chemical and thermal cleaning treatment damage, minimizes topographical underlayer variations which would aberrate or cause reflection losses of images formed on non-planar surfaces, and, obviates residual particle inclusions induced during dicing and packaging. A CCD imager is formed by photolithographically patterning a planar-array of photodiodes on a semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, and, color filters are formed thereon. A transparent encapsulant is deposited to planarize the color filter layer and completes the solid-state color image-forming device without conventional convex microlenses.

    摘要翻译： 公开了一种有序的微电子制造顺序，其中滤色器通过直角沉积直接形成在CCD，CID或CMOS成像装置的光电检测器阵列上以形成凹入像素表面，并且覆盖有高透光率平面化膜 指定的折射率和物理性质，其优化光收集到光电二极管而不需要额外的常规微透镜。 光学平坦的顶表面用于封装和保护成像器免受化学和热清洁处理损伤，最小化形成的底层变化，其将形成在非平面表面上的图像的像差或引起反射损失，并且消除在切割期间引起的残留颗粒夹杂物， 打包。 通过在半导体衬底上光刻地构图光电二极管平面阵列来形成CCD成像器。 光电二极管阵列设置有金属遮光罩，钝化，并且在其上形成滤色器。 沉积透明密封剂以平坦化滤色器层并完成固态彩色图像形成装置，而不需要常规的凸起的微透镜。

    Colors only process to reduce package yield loss
    24.
    发明授权
    Colors only process to reduce package yield loss 有权
    颜色只能减少包装产量损失

    公开(公告)号：US07183598B2

    公开(公告)日：2007-02-27

    申请号：US11037445

    申请日：2005-01-18

    申请人： Yang-Tung Fan ,  Chiou-Shian Peng ,  Cheng-Yu Chu ,  Shih-Jane Lin ,  Yen-Ming Chen ,  Fu-Jier Fan ,  Kuo-Wei Lin

    发明人： Yang-Tung Fan ,  Chiou-Shian Peng ,  Cheng-Yu Chu ,  Shih-Jane Lin ,  Yen-Ming Chen ,  Fu-Jier Fan ,  Kuo-Wei Lin

    IPC分类号： H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119

    CPC分类号： H01L27/14685 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14645 ,  H01L31/02162 ,  H01L31/02327

    摘要： Disclosed is an ordered microelectronic fabrication sequence in which color filters are formed by conformal deposition directly onto a photodetector array of a CCD, CID, or CMOS imaging device to create a concave-up pixel surface, and, overlayed with a high transmittance planarizing film of specified index of refraction and physical properties which optimize light collection to the photodiode without additional conventional microlenses. The optically flat top surface serves to encapsulate and protect the imager from chemical and thermal cleaning treatment damage, minimizes topographical underlayer variations which would aberrate or cause reflection losses of images formed on non-planar surfaces, and, obviates residual particle inclusions induced during dicing and packaging. A CCD imager is formed by photolithographically patterning a planar-array of photodiodes on a semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, and, color filters are formed thereon. A transparent encapsulant is deposited to planarize the color filter layer and completes the solid-state color image-forming device without conventional convex microlenses.

    摘要翻译： 公开了一种有序的微电子制造顺序，其中滤色器通过直角沉积直接形成在CCD，CID或CMOS成像装置的光电检测器阵列上以形成凹入像素表面，并且覆盖有高透光率平面化膜 指定的折射率和物理性质，其优化光收集到光电二极管而不需要额外的常规微透镜。 光学平坦的顶表面用于封装和保护成像器免受化学和热清洁处理损伤，最小化形成的底层变化，其将形成在非平面表面上的图像的像差或引起反射损失，并且消除在切割期间引起的残留颗粒夹杂物， 打包。 通过在半导体衬底上光刻地构图光电二极管平面阵列来形成CCD成像器。 光电二极管阵列设置有金属遮光罩，钝化，并且在其上形成滤色器。 沉积透明密封剂以平坦化滤色器层并完成固态彩色图像形成装置，而不需要常规的凸起的微透镜。

    Colors only process to reduce package yield loss
    26.
    发明申请
    Colors only process to reduce package yield loss 有权
    颜色只能减少包装产量损失

    公开(公告)号：US20050121737A1

    公开(公告)日：2005-06-09

    申请号：US11037445

    申请日：2005-01-18

    申请人： Yang-Tung Fan ,  Chion-Shian Peng ,  Cheng-Yu Chu ,  Shih-Jane Lin ,  Yen-Ming Chen ,  Fu-Jier Fan ,  Kuo-Wei Lin

    发明人： Yang-Tung Fan ,  Chion-Shian Peng ,  Cheng-Yu Chu ,  Shih-Jane Lin ,  Yen-Ming Chen ,  Fu-Jier Fan ,  Kuo-Wei Lin

    IPC分类号： G02F1/1335 ,  H01L21/00 ,  H01L27/146 ,  H01L31/0216 ,  H01L31/0232

    CPC分类号： H01L27/14685 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14645 ,  H01L31/02162 ,  H01L31/02327

    摘要： Disclosed is an ordered microelectronic fabrication sequence in which color filters are formed by conformal deposition directly onto a photodetector array of a CCD, CID, or CMOS imaging device to create a concave-up pixel surface, and, overlayed with a high transmittance planarizing film of specified index of refraction and physical properties which optimize light collection to the photodiode without additional conventional microlenses. The optically flat top surface serves to encapsulate and protect the imager from chemical and thermal cleaning treatment damage, minimizes topographical underlayer variations which would aberrate or cause reflection losses of images formed on non-planar surfaces, and, obviates residual particle inclusions induced during dicing and packaging. A CCD imager is formed by photolithographically patterning a planar-array of photodiodes on a semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, and, color filters are formed thereon. A transparent encapsulant is deposited to planarize the color filter layer and completes the solid-state color image-forming device without conventional convex microlenses.

    摘要翻译： 公开了一种有序的微电子制造顺序，其中滤色器通过直角沉积直接形成在CCD，CID或CMOS成像装置的光电检测器阵列上以形成凹入像素表面，并且覆盖有高透光率平面化膜 指定的折射率和物理性质，其优化光收集到光电二极管而不需要额外的常规微透镜。 光学平坦的顶表面用于封装和保护成像器免受化学和热清洁处理损伤，最小化形成的底层变化，其将形成在非平面表面上的图像的像差或引起反射损失，并且消除在切割期间引起的残留颗粒夹杂物， 打包。 通过在半导体衬底上光刻地构图光电二极管平面阵列来形成CCD成像器。 光电二极管阵列设置有金属遮光罩，钝化，并且在其上形成滤色器。 沉积透明密封剂以平坦化滤色器层并完成固态彩色图像形成装置，而不需要常规的凸起的微透镜。

    Method to form a color image sensor cell while protecting the bonding pad structure from damage
    27.
    发明授权
    Method to form a color image sensor cell while protecting the bonding pad structure from damage 有权
    形成彩色图像传感器单元同时保护接合垫结构免受损坏的方法

    公开(公告)号：US06632700B1

    公开(公告)日：2003-10-14

    申请号：US10135096

    申请日：2002-04-30

    申请人： Yang-Tung Fan ,  Cheng-Yu Chu ,  Chiou-Shian Peng ,  Shih-Jane Lin ,  Yen-Ming Chen ,  Fu-Jier Fan ,  Kuo-Wei Lin

    发明人： Yang-Tung Fan ,  Cheng-Yu Chu ,  Chiou-Shian Peng ,  Shih-Jane Lin ,  Yen-Ming Chen ,  Fu-Jier Fan ,  Kuo-Wei Lin

    IPC分类号： H01L2100

    CPC分类号： H01L31/02162 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14685

    摘要： A new method to form color image sensor cells without damaging bonding pads in the manufacture of an integrated circuit device is achieved. The method comprises, first, forming cell electrodes and bonding pads on a semiconductor substrate. A passivation layer is formed overlying the cell electrodes but exposing the top surface of the bonding pads. The semiconductor substrate is then dipped in a hydrogen peroxide solution to thereby form a metal oxide layer overlying the bonding pads. A first transparent planarization layer is deposited overlying the passivation layer and the metal oxide layer. A color filter photoresist layer is deposited overlying the first transparent planarization layer. The color filter photoresist layer is patterned to form color filter elements to complete the color image sensor cells in the manufacture of the integrated circuit device. The presence of the metal oxide layer prevents damage to the bonding pads from an alkaline developer.

    摘要翻译： 实现了在集成电路器件的制造中形成彩色图像传感器单元而不损坏接合焊盘的新方法。 该方法首先在半导体衬底上形成电池电极和接合焊盘。 钝化层形成在电池电极上方，但暴露了焊盘的顶表面。 然后将半导体衬底浸入过氧化氢溶液中，从而形成覆盖在焊盘上的金属氧化物层。 覆盖钝化层和金属氧化物层的第一透明平坦化层被沉积。 沉积在第一透明平坦化层上的滤色器光致抗蚀剂层。 图案化滤色器光致抗蚀剂层以形成滤色器元件，以在集成电路器件的制造中完成彩色图像传感器单元。 金属氧化物层的存在防止了碱性显影剂对接合焊盘的损坏

    Method for removing solder bodies from a semiconductor wafer
    29.
    发明授权
    Method for removing solder bodies from a semiconductor wafer 有权
    从半导体晶片去除焊锡体的方法

    公开(公告)号：US06319846B1

    公开(公告)日：2001-11-20

    申请号：US09755521

    申请日：2001-01-05

    申请人： Kuo-Wei Lin ,  James Chen ,  Eugene Chu ,  Alex Fahn ,  Chiou-Shian Peng ,  Gilbert Fane ,  Kenneth Lin

    发明人： Kuo-Wei Lin ,  James Chen ,  Eugene Chu ,  Alex Fahn ,  Chiou-Shian Peng ,  Gilbert Fane ,  Kenneth Lin

    IPC分类号： H01L21302

    CPC分类号： H01L21/32134 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/81052 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

    摘要： A method for removing a multiplicity of solder bodies connected to a semiconductor wafer through a copper wetting layer from the semiconductor wafer is disclosed. In the method, a semiconductor wafer that has on a top surface a multiplicity of solder bodies electrically connected to a multiplicity of bond pads through a multiplicity of copper wetting layers is first provided. When the multiplicity of solder bodies is found out of specification or must be removed for any other quality reasons, the semiconductor wafer is exposed to an etchant that has an etch rate toward the copper wetting layer at least 5 times the etch rate toward a metal that forms the multiplicity of bond pads. The semiconductor wafer may be removed from the etchant when the multiplicity of copper wetting layers is substantially dissolved such that the multiplicity of solder bodies is separated from the multiplicity of bond pads. The multiplicity of solder bodies may be either solder bumps or solder balls. The etchant may be a solution that contains Ce (NH4)2 (NO3)6 in a concentration range between about 3 wt. % and about 30 wt. % in water. Ultrasonic vibration may further be used to facilitate the dissolution of the copper wetting layers in the etchant.

    摘要翻译： 公开了一种通过铜浸润层从半导体晶片去除连接到半导体晶片的多个焊料体的方法。 在该方法中，首先提供在顶表面上具有多个通过多个铜润湿层电连接到多个接合焊盘的多个焊料体的半导体晶片。 当发现多个焊料体不符合规格或由于任何其他质量原因必须除去多个焊料体时，将半导体晶片暴露于蚀刻剂，蚀刻速率朝向铜润湿层的刻蚀速率至少为蚀刻速率的5倍， 形成多个接合焊盘。 当多个铜润湿层基本上被溶解使得多个焊料体与多个接合焊盘分离时，半导体晶片可以从蚀刻剂中去除。 多个焊料体可以是焊料凸块或焊球。 蚀刻剂可以是含有浓度范围为约3重量％的Ce（NH 4）2（NO 3）6的溶液。 ％和约30wt。 ％ 在水里。 还可以使用超声振动来促进铜湿润层在蚀刻剂中的溶解。