公开(公告)号：US06731001B2

公开(公告)日：2004-05-04

申请号：US09918803

申请日：2001-08-01

申请人： Kan Kinouchi ,  Mitsuhiro Saitou ,  Takashi Nagasaka ,  Yuji Ootani ,  Hiroyuki Yamakawa ,  Koji Takeuchi ,  Hirokazu Imai ,  Yukihiro Maeda ,  Atsushi Kanamori

发明人： Kan Kinouchi ,  Mitsuhiro Saitou ,  Takashi Nagasaka ,  Yuji Ootani ,  Hiroyuki Yamakawa ,  Koji Takeuchi ,  Hirokazu Imai ,  Yukihiro Maeda ,  Atsushi Kanamori

IPC分类号： H01L2352

CPC分类号： H01L23/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/20753 ,  H01L2924/2076 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/284 ,  H05K3/366 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/92247 ,  H01L2924/00

摘要： Several electronic parts are mounted on several ceramic substrates in a semiconductor device, and are wire bonded to the respective ceramic substrates through bonding wires. The electronic parts and the bonding wires are covered with an enclosing member on every ceramic substrate, and an inside of the enclosing member is filled with silicone gel for sealing. The ceramic substrates are bonded to a radiation fin together, and are mounted on a motherboard perpendicularly to the motherboard.

摘要翻译： 几个电子部件安装在半导体器件中的多个陶瓷基板上，并且通过接合线引线接合到相应的陶瓷基板。 电子部件和接合线在每个陶瓷基板上被封闭构件覆盖，并且封装构件的内部填充有用于密封的硅凝胶。 陶瓷基板一起结合到散热片上，并垂直于母板安装在母板上。

公开(公告)号：US06725770B2

公开(公告)日：2004-04-27

申请号：US10293486

申请日：2002-11-14

申请人： Yukihiro Maeda

发明人： Yukihiro Maeda

IPC分类号： B41M112

CPC分类号： B41J3/546

摘要： A hybrid printing apparatus and related control method have a first print section 1a composed of a plurality of printing machines located in parallel to one another, and a second print section 1b composed of one printing machine and connected to the first print section, via a print medium transfer section 1c having a transfer passage 31 composed of discrete passage components which include change-over rollers 32 to change over start/stop operations in transfer of print media and medium detection sensors 33 to detect leading edges of the print media discharged from the respective printing machines of the first print section 1a, respectively. A control section 1d controls timings at which the change-over rollers 32 are changed over, so as to sequentially transfer the printing media from the first section 1a to the second print section 1b in response to detection signals from the medium detection sensors 33.

摘要翻译： 混合印刷装置和相关控制方法具有由彼此平行定位的多个印刷机构成的第一印刷部分1a和由一个印刷机组成的第二印刷部分1b，并经由印刷机连接到第一印刷部分 介质传送部分1c具有由离散通道部件组成的传送通道31，传送通道31包括转印辊32，以转换打印介质和介质检测传感器33的传送中的开始/停止操作，以检测从相应的打印介质排出的打印介质的前端 第一打印部分1a的打印机。 控制部1d控制转换辊32的切换时间，以便响应于来自介质检测传感器33的检测信号，将打印介质从第一部分1a依次传送到第二打印部分1b。

公开(公告)号：US06645606B2

公开(公告)日：2003-11-11

申请号：US10120527

申请日：2002-04-12

申请人： Tetsuo Nakano ,  Yukihiro Maeda ,  Yasutomi Asai ,  Takashi Nagasaka

发明人： Tetsuo Nakano ,  Yukihiro Maeda ,  Yasutomi Asai ,  Takashi Nagasaka

IPC分类号： B32B1500

CPC分类号： H05K3/244 ,  H01L23/49811 ,  H01L23/538 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05147 ,  H01L2224/05599 ,  H01L2224/05644 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48747 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/245 ,  H05K3/328 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48744

摘要： A substrate has a first surface and a second surface. A plurality of pads is formed on the first surfaces. Each pads has a Cu plating layer and an Au plating layer that is directly formed on the Cu plating layer. Al wiring or Au wiring is bonded with the pads. The thickness of the Au plating layer that is bonded with the Al wiring is less than 0.5 &mgr;m. Thickness of the Au plating layer that is bonded with the Au wiring is 0.05 &mgr;m or more.

公开(公告)号：US20130279000A1

公开(公告)日：2013-10-24

申请号：US13978241

申请日：2012-01-11

申请人： Yukihiro Maeda ,  Kiyohiko Ito

发明人： Yukihiro Maeda ,  Kiyohiko Ito

IPC分类号： G02B5/08 ,  G02B1/10

CPC分类号： G02B5/085 ,  B32B17/10018 ,  B32B17/1022 ,  B32B2367/00 ,  C08J7/045 ,  C08J2367/02 ,  C08J2433/00 ,  G02B1/105 ,  G02B1/14 ,  G02B5/0808 ,  G02B5/0875 ,  G02B5/208

摘要： A far infrared reflecting laminate wherein layers [A] to [C] are sequentially arranged in this order: [A] a substrate; [B] a far-infrared reflecting layer having structure [B1] or [B2], [B1] a single layer of a metal containing 95 to 100% by mass of silver; or [B2] a multilayer structure composed of a metal layer containing 95 to 100% by mass of silver and a layer containing a metal oxide and/or a metal nitride and having a refractive index of 1.5 to 3; and [C] a surface hard-coat layer containing a crosslinking resin having one or more polar groups selected from a phosphoric acid group, a sulfonic acid group, and an amide group and having a thickness of 0.4 to 2.0 μm.

摘要翻译： 其中层[A]至[C]的顺序依次排列为远红外线反射层叠体：[A]基板; [B]具有[B1]或[B2]结构的远红外反射层，[B1]含有95〜100质量％银的单层金属; 或[B2]由包含95〜100质量％的银的金属层和含有金属氧化物和/或金属氮化物并且折射率为1.5〜3的层构成的多层结构体; 和[C]含有具有一个或多个极性基团的交联树脂的表面硬涂层，所述极性基团选自磷酸基，磺酸基和酰胺基，并且具有0.4-2.0μm的厚度。

公开(公告)号：US08148809B2

公开(公告)日：2012-04-03

申请号：US12654707

申请日：2009-12-29

申请人： Kouji Senda ,  Satoshi Shiraki ,  Yukihiro Maeda ,  Shinichi Hirose ,  Tetsuo Fujii ,  Takashi Nakano

发明人： Kouji Senda ,  Satoshi Shiraki ,  Yukihiro Maeda ,  Shinichi Hirose ,  Tetsuo Fujii ,  Takashi Nakano

IPC分类号： H01L23/48

CPC分类号： H01L21/84 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/27 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing a semiconductor device includes: preparing a wafer formed of a SOI substrate; forming a circuit portion in a principal surface portion; removing a support substrate of the SOI substrate; fixing an insulation member on a backside of a semiconductor layer so as to be opposite to the circuit portion; dicing the wafer and dividing the wafer into multiple chips; arranging a first conductive member on the insulation member so as to be opposite to a part of the low potential reference circuit, and arranging a second conductive member on the insulation member so as to be opposite to a part of the high potential reference circuit; and coupling the first conductive member with a first part of the low potential reference circuit, and coupling the second conductive member with a second part of the high potential reference circuit.

摘要翻译： 一种制造半导体器件的方法包括：制备由SOI衬底形成的晶片; 在主表面部分形成电路部分; 去除SOI衬底的支撑衬底; 将绝缘构件固定在半导体层的背面以与电路部分相对; 切割晶片并将晶片分成多个芯片; 在所述绝缘构件上设置与所述低电位基准电路的一部分相对的第一导电构件，并且在所述绝缘构件上配置与所述高电位基准电路的一部分相反的第二导电构件; 以及将所述第一导电构件与所述低电位参考电路的第一部分耦合，以及将所述第二导电构件与所述高电位参考电路的第二部分耦合。

公开(公告)号：US08123316B2

公开(公告)日：2012-02-28

申请号：US12588110

申请日：2009-10-05

申请人： Tomohiko Shimoda ,  Yukihiro Maeda ,  Kenji Oshima

发明人： Tomohiko Shimoda ,  Yukihiro Maeda ,  Kenji Oshima

IPC分类号： B41J29/38

CPC分类号： B41J2/175 ,  B41J2/04528 ,  B41J2/04553 ,  B41J2/04581 ,  B41J2/04588 ,  B41J2/04595 ,  B41J2/04596

摘要： An image forming apparatus including: a print-job controller configured to receive a print job and control a printing operation based on the received print job; an ink-ejection driver configured to output a driving signal on the basis of the print job; an ink ejector configured to eject ink onto a paper sheet on the basis of the driving signal outputted by the ink-ejection driver; and an ink-temperature measuring unit configured to measure an ink temperature. When the ink temperature measured by the ink-temperature measuring unit is equal to or higher than a first reference temperature, the ink-ejection driver outputs a driving signal of a first voltage. When the ink temperature measured by the ink-temperature measuring unit is lower than the first reference temperature and is equal to or higher than a second reference temperature that is lower than the first reference temperature, the print-job controller performs the printing operation as long as predetermined conditions are satisfied for suppressing lowering of print quality possibly caused by ink ejection based on a driving signal of a second voltage that is higher than the first voltage and the ink-ejection driver outputs the driving signal of the second voltage while the printing operation is being performed.

摘要翻译： 一种图像形成装置，包括：打印作业控制器，被配置为接收打印作业并基于所接收的打印作业来控制打印操作; 喷墨驱动器，被配置为基于所述打印作业来输出驱动信号; 墨水喷射器，被配置为基于由喷墨驱动器输出的驱动信号将墨水喷射到纸张上; 以及墨水温度测量单元，其被配置为测量墨水温度。 当由油墨温度测量单元测量的油墨温度等于或高于第一参考温度时，喷墨驱动器输出第一电压的驱动信号。 当由油墨温度测量单元测量的油墨温度低于第一参考温度并且等于或高于低于第一参考温度的第二参考温度时，打印作业控制器执行打印操作 由于根据高于第一电压的第二电压的驱动信号来抑制可能由喷墨引起的打印质量的降低的预定条件，并且喷墨驱动器在打印操作期间输出第二电压的驱动信号 正在执行。

公开(公告)号：US20100129094A1

公开(公告)日：2010-05-27

申请号：US12452791

申请日：2008-07-16

申请人： Yukihiro Maeda ,  Masashi Hara

发明人： Yukihiro Maeda ,  Masashi Hara

IPC分类号： G03G15/16

CPC分类号： B41J3/60 ,  B41J13/0009 ,  B41J13/0045 ,  G03G15/234

摘要： A printer is operable for image formation onto a sheet of a sheet width Lp, with a sheet spacing Lg and a printing transfer speed Vg, a constant speed transferrer makes sheet transfer at the printing transfer speed Vg from a register via the printer to a speed change position, a variable speed transferrer makes sheet transfer from the speed change position to the register, and a transfer controller controls sheet transfer speeds, the variable speed transferrer having sections for sheet transfer, including deceleration and acceleration sections for sheet reversal at the sheet reversing path, and a constant speed section for transfer at a constant transfer speed Vr, the transfer controller determining a circulating sheet number N, executing a calculation of transfer speed Vr employing sheet width Lp, sheet spacing Lg, printing transfer speed Vg, and accelerations, to enable sheet transfer for circulation within a time interval of N×(Lp+Lg)/Vg.

摘要翻译： 打印机可操作用于在片材宽度Lp的片材上形成图像，片材间距Lg和印刷传送速度Vg，恒定速度转印器使印刷传送速度Vg从记录器经由打印机转印到速度 变速传送器将片材从变速位置传送到寄存器，转印控制器控制纸张传送速度，变速传送器具有用于纸张传送的部分，包括用于纸张反转的纸张反转的减速和加速部分 路径和用于以恒定传送速度Vr传送的恒定速度部分，传送控制器确定循环片材编号N，执行片材宽度Lp，片材间距Lg，印刷传送速度Vg和加速度的传送速度Vr的计算， 以便在N×（Lp + Lg）/ Vg的时间间隔内进行片材转印。

公开(公告)号：US20100086338A1

公开(公告)日：2010-04-08

申请号：US12585821

申请日：2009-09-25

申请人： Masashi Hara ,  Yukihiro Maeda ,  Masatoshi Fujimoto ,  Masakazu Kawano

发明人： Masashi Hara ,  Yukihiro Maeda ,  Masatoshi Fujimoto ,  Masakazu Kawano

IPC分类号： G03G15/00

CPC分类号： G03G15/6561 ,  G03G2215/00552 ,  G03G2215/00628 ,  G03G2215/00662

摘要： A conveyance control mechanism for a printer including an image forming unit forming an image on a sheet being conveyed on a conveyance route, includes a curl detector configured to detect a curl of the sheet conveyed on the conveyance route, in an upstream of the image forming unit on the conveyance route. The conveyance route controller may drive and stop the conveyance route differently depending on whether the curl detector detects a curl at either a front end or at a position other than the front end. When the curl detector detects a curl of the sheet, an image forming route where the image forming unit performs an image formation may be separated and retreated from the conveyance route and the sheet being conveyed may be discharged onto the retreated image forming route.

摘要翻译： 一种用于打印机的输送控制机构，包括在输送路径上输送的纸张上形成图像的图像形成单元，包括卷曲检测器，被构造成检测在输送路径上传送的纸张的卷曲， 运输路线上的单位。 输送路径控制器可以根据卷曲检测器是否检测到在前端或除了前端之外的位置处的卷曲而不同地驱动和停止输送路径。 当卷曲检测器检测到纸张的卷曲时，图像形成单元执行图像形成的图像形成路径可以从输送路径分离并退回，并且被输送的纸张可以被排出到后退图像形成路径上。

公开(公告)号：US06539854B2

公开(公告)日：2003-04-01

申请号：US09907701

申请日：2001-07-19

申请人： Yukihiro Maeda ,  Hirohide Hashimoto

发明人： Yukihiro Maeda ,  Hirohide Hashimoto

IPC分类号： B41L1300

CPC分类号： B41L13/06 ,  B41L21/00

摘要： A stencil printer includes a printing drum which is rotated bearing a stencil wound around the printing drum, a pair of paper feed rollers which are rotated in contact with each other to supply a printing paper to the printing drum, and a press roller which is rotated in contact with the printing drum to convey the printing paper supplied to the printing drum with the printing paper pressed against the stencil on the printing drum. A paper feed roller driver drives the paper feed rollers, and a paper feed roller controller controls the paper feed roller driver to rotate the paper feed rollers at a peripheral speed higher than that of the printing drum at least from the time the leading end of the printing paper reaches the printing drum to the time the trailing end of the printing paper passes the paper feed rollers.

公开(公告)号：US5657203A

公开(公告)日：1997-08-12

申请号：US400258

申请日：1995-03-06

申请人： Yasunobu Hirao ,  Takashi Nagasaka ,  Hidekazu Katsuyama ,  Makoto Koyama ,  Yuji Motoyama ,  Mamoru Urushizaki ,  Yukihiro Maeda

发明人： Yasunobu Hirao ,  Takashi Nagasaka ,  Hidekazu Katsuyama ,  Makoto Koyama ,  Yuji Motoyama ,  Mamoru Urushizaki ,  Yukihiro Maeda

IPC分类号： H01L25/00 ,  H01L21/48 ,  H01L23/498 ,  H01L23/50 ,  H01L25/04 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H05K1/14 ,  H05K5/00 ,  H05K7/20

CPC分类号： H01L21/4842 ,  H01L23/49811 ,  H01L23/49861 ,  H01L25/162 ,  H05K5/0043 ,  H05K5/0056 ,  H05K5/064 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/19041

摘要： In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.

摘要翻译： 为了提供具有高封装密度并且可以促进其中的多个电路板之间的电连接的电子器件，电子器件包括具有通过主平面的两个相互相对的开口的框架，布置在框架中的多个电路板平行 并分别安装所选择的电子电路，以及用于封闭主平面中的开口的第一和第二闭合盖; 第一闭合盖与至少一个电路板的表面接触，在其上没有安装电子电路。 另外，在框架的内壁上; 形成用于支撑封闭盖构件，支撑板，电路板等的适当的阶梯部分。此外，在阶梯部分中，设置容纳多余粘合剂的部分。